Ali A Mira, Age 716113 Blackpool Ct, San Jose, CA 95138

6459579, Oct 1, 2002

Jan 3, 2001

09/752824

Daniel Fairchild Farmer - Mountain View CA
Ashok Krishnamurthi - San Jose CA
Richard Singer - Menlo Park CA
Ali Mira - San Jose CA

Juniper Networks, Inc. - Sunnyvale CA

H05K 720

361695, 361687, 361690, 361692, 3122231, 16510433

The invention provides forced-air cooling to components mounted on circuit boards oriented in a side-to-side direction in a system. Airflow may enter and exit the system through the front and back (or vice-versa), rather than the sides of the system. In one embodiment, airflow entering the front of the system is re-directed in an upward direction, then split to form airflow branches traversing in a side-to-side direction. The airflow branches traverse across the surfaces of circuit boards, then are directed in an upward direction and out the back (or front) of the system. The airflow branches preferably move substantially the same volume of air per unit of time.

8109321, Feb 7, 2012

Mar 5, 2008

12/043078

Sinan Alousi - Sunnyvale CA, US
Daniel Anav - San Jose CA, US
Joseph D. Griffin - Lake Oswego OR, US
Ali Mira - Morgan Hill CA, US
Michael Mira - Morgan Hill CA, US
Henry Schrader - Mountain View CA, US

Alcatel Lucent - Paris

F28F 7/02

165 803, 16510421

A modular heat sink assembly is disclosed. The heat sink assembly includes a main (larger) heat sink member having one or more voids through the member. The heat sink assembly also includes one or more additional (smaller) heat sink members that fit within the voids of the main heat sink member and are able to move (float) within the voids while thermally connected to main heat sink member. The thermal connection to the main heat sink member may be accomplished by incorporating heat pipes as a bridge between the heat sink members, so that heat spreading, and regulation thereof, occurs over the additional heat sink members and the main heat sink member.

2005006, Mar 24, 2005

Apr 5, 2004

10/818751

Ali Mira - Morgan Hill CA, US

Heatscape, Inc. - San Jose CA

F25B029/00

165080300

A heat dissipation device, having a base plate for making contact with a heat producing integrated circuit; several fins disposed on and partially covering the base plate, the fins forming flow channels and the fins and the flow channels having proximal ends and distal ends. The device also includes a fan mounted on the base plate for delivering air flow to the fins, the fan being configured to deliver air to the proximal ends of the fins. The device also includes a shroud disposed over the fins and the fan. The shroud has an aperture that has a shape generally matching the overall shape of the fan, where the aperture acts as an air inlet for the fan. The device also includes members for fastening the heat dissipation device against the heat producing integrated circuit. The fastening members hold in alignment the shroud and the base plate against a printed circuit board having the heat producing integrated circuit.

5867419, Feb 2, 1999

Jul 29, 1997

8/903042

David P. Chengson - Aptos CA
William L. Schmidt - Los Gatos CA
Unmesh Agarwala - San Jose CA
Alan D. Foster - Los Altos CA
Edward C. Priest - San Jose CA
John C. Manton - Mountain View CA
Ali Mira - San Jose CA

Silicon Graphics, Inc. - Moutain View CA

H03H 1100

365 63

A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor.

5662163, Sep 2, 1997

Nov 29, 1995

8/564404

Ali Mira - San Jose CA

Silicon Graphics, Inc. - Mountain View CA

F28F 700

165 803

A readily attachable and detachable heat sink assembly apparatus and method. In one embodiment of the present invention, a backing plate has alignment pins extending therefrom. The backing plate is adapted to be located next to the back surface of a printed circuit board, and have the alignment pins extend through the holes in the printed circuit board. A heat sink unit is adapted to thermally contact a heat generating device located on a front surface of the printed circuit board. The heat sink unit also has holes formed therethrough which are adapted to allow the alignment pins of the backing plate extend through the heat sink unit. A clasp plate is adapted to be located on top of the heat sink unit and has slits which are configured to grasp the ends of the alignment pins. A fastener coupled to the clasp plate fastener is adapted to release the heat sink unit from the heat generating device or tightly attach the heat sink unit to the heat generating device. In so doing, the heat sink unit can be attached to or detached from the heat generating device without having to have access to the back surface of the printed circuit board.

5710733, Jan 20, 1998

Jan 22, 1996

8/589532

David P. Chengson - Aptos CA
William L. Schmidt - Los Gatos CA
Unmesh Agarwala - San Jose CA
Alan D. Foster - Los Altos CA
Edward C. Priest - San Jose CA
John C. Manton - Mountain View CA
Ali Mira - San Jose CA

Silicon Graphics, Inc. - Mountain View CA

H03H 1100
H05K 702

365 52

A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor.

5709263, Jan 20, 1998

Oct 19, 1995

8/551070

Ali Mira - San Jose CA

Silicon Graphics, Inc. - Mountain View CA

F28F 700

165 803

A heat sink with undulating fins is provided. The heat sink according to this invention includes a thermally conductive base plate having a top surface and a plurality of thermally conductive fins. The fins extend upwardly from the top surface. Each fin is integral with the base plate and has an undulating surface. The fin surfaces of adjacent fins define a space for passing a cooling fluid between them.

5661638, Aug 26, 1997

Nov 3, 1995

8/552801

Ali Mira - San Jose CA

Silicon Graphics, Inc. - Mountain View CA

H05K 720

361697

A thermally conductive heat sink unit. In the present invention, a thermally conductive heat sink has a first surface. A plurality of arc-shaped cooling fins are formed in the first surface. The arc-shaped cooling fins extend radially outward from a central region of the first surface. A second surface of the thermally conductive heat sink is adapted to thermally contact a heat generating device. By contacting the heat generating device, heat generated by the device is dissipated through the arc-shaped cooling fins of the first surface. In one embodiment of the present invention, a recessed region is formed into the first surface of the thermally conductive heat sink. The recessed region is formed above the central region and the region peripherally surrounding the central region such that the recessed region extends into a portion of the arc-shaped cooling fins. In such an embodiment, a fan is embedded within the recessed region of the thermally conductive heat sink. The fan impinges the arc-shaped cooling fins and the central region with a stream of coolant to aid in the dissipation of heat from the thermally conductive heat sink.