Alvin Schneider resumes & CV records
Resumes
Alvin Schneider
Alvin L Schneider, Age 7832390 Constitution Hwy, Locust Grove, VA 22508
Alvin Schneider Phones & Addresses
Locust Grove, VA
Broadway, VA
Mcgaheysville, VA
Castorland, NY
New York, NY
9350 Foxtail Pl, Mcgaheysville, VA 22840 (540) 289-3247
Work
Position:
Craftsman/Blue Collar
Education
Degree:
High school graduate or higher
Emails
Mentions for Alvin L Schneider
Publications & IP owners
Us Patents
Soldering Flux
US Patent:
6599372, Jul 29, 2003
Filed:
Dec 1, 2000
Appl. No.:
09/728264
Inventors:
Sanyogita Arora - North Arlington NJ
Alvin F. Schneider - Warren NJ
Karen A. Tellefsen - Millington NJ
Alvin F. Schneider - Warren NJ
Karen A. Tellefsen - Millington NJ
Assignee:
Frys Metals, Inc. - Jersey City NJ
International Classification:
B23K 35363
US Classification:
148 23, 148 24, 219 8515
Abstract:
A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.
Improved Cleaning Solvent Containing Non-Azeotropic Mixtures Of 1,1,1-Trichloroethane And N-Propanol
US Patent:
4086179, Apr 25, 1978
Filed:
Dec 10, 1976
Appl. No.:
5/749274
Inventors:
Alvin F. Schneider - Edison NJ
Assignee:
Alpha Metals, Inc. - Jersey City NJ
International Classification:
C23G 502
C11D 750
C11D 730
C11D 750
C11D 730
US Classification:
252171
Abstract:
Improved cleaning compositions for the removal of various forms of contamination from printed circuit boards and other related electronic equipment in vapor cleaning processes are disclosed, including major amounts of 1,1,1-trichloroethane and an amount of normal propanol less than that in the true azeotropic mixture of these components, generally from about 1. 0 to less than 4. 75 weight percent of the normal propanol. In addition, vapor cleaning processes utilizing such solvent compositions are also disclosed, and in a preferred embodiment, the composition includes about 96. 0 weight percent of the 1,1,1-trichloroethane and about 4. 0 weight percent of the normal propanol.
No-Clean Soldering Flux And Method Using The Same
US Patent:
5297721, Mar 29, 1994
Filed:
Nov 19, 1992
Appl. No.:
7/976931
Inventors:
Alvin F. Schneider - Edison NJ
David B. Blumel - New York NY
John V. Tomczak - Dolton IL
David B. Blumel - New York NY
John V. Tomczak - Dolton IL
Assignee:
Fry's Metals, Inc. - Providence RI
International Classification:
B23K 35363
US Classification:
2281801
Abstract:
A no-clean soldering flux consists essentially of one or more halide-free, water soluble activators in an aggregate amount not exceeding about 5% by weight of the flux, a water soluble fluorinated surfactant in an amount not exceeding about 1% by weight of the flux, and water. The flux is substantially VOC-free and is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary. The absence of significant amounts of VOC's and the elimination of post-soldering cleaning result in substantial environmental and production-related benefits.
Isbn (Books And Publications)
Professional'S Guide To The Ti Professional Computer
Author:
Alvin D. Schneider
ISBN #:
0672222558
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