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Basab Bijay Dasgupta, Age 76820 Gainsborough Way, Laguna Beach, CA 92651

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Known as:
Basab B Dasgupta Basab Bijay Dasgupia Basab B Dasgupia Basab A
Related to:
Sipra R Dasgupta 76

Basab Dasgupta Phones & Addresses

820 Gainsborough Way, Laguna Beach, CA 92651

Aliso Viejo, CA

Atlanta, GA

Durham, NC

Redondo Beach, CA

San Clemente, CA

San Marcos, CA

Carlsbad, CA

San Diego, CA

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Mentions for Basab Bijay Dasgupta

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Wikipedia

Basab Dasgupta Photo 12

Samir Roychoudhury

Contributors: Rabindra Guha, Basab Dasgupta, Naser Hosain, Murshid A. M., Dr Nrisingha Murari ... Basudeb Dasgupta; Subimal Basak; Tridib Mitra; Shakti Chattopadhyay; Hungry generation

Us Patents

Deflection Yoke With Improved Deflection Sensitivity

US Patent:
6380698, Apr 30, 2002
Filed:
Jan 11, 2001
Appl. No.:
09/759060
Inventors:
Basab Bijay Dasgupta - San Clemente CA
Assignee:
Sony Corporation - Tokyo
Sony Electronics, Inc. - Park Ridge NJ
International Classification:
G09G 128
US Classification:
31536825, 31536828, 313440, 313421, 335210
Abstract:
A deflection yoke is described for use in a cathode ray tube, which has an improved deflection sensitivity. The deflection yoke includes a ferrite core, a vertical coil to generate a vertically defecting magnetic field and a horizontal coil to generated a horizontally deflecting magnetic field. The core has a funnel-shaped body with an opening therethrough defining an inner surface. The horizontal coil includes a pair of saddle-type coils positioned in the core such that at least a portion of the horizontal coil is in contact with the inner surface of the core.

Deflection Coil Having Gaps Formed Subsequent To The Winding

US Patent:
6703914, Mar 9, 2004
Filed:
Jan 11, 2001
Appl. No.:
09/770354
Inventors:
Basab Bijay Dasgupta - San Clemente CA
Assignee:
Sony Corporation - Tokyo
Sony Electronics Inc. - Park Ridge NJ
International Classification:
H01H 100
US Classification:
335213
Abstract:
A method and a related apparatus are described for forming gaps into a saddle-shaped deflection coil subsequent to a winding process. The method includes winding a conductive wire into a saddle-shaped deflection coil using a winding machine and bonding the saddle-shaped deflection coil to provide adhesive bonding between winding turns of the coil while the coil remains in the winding machine. Then, the deflection coil is removed from the winding machine and heat is applied to the deflection coil after the deflection coil has been removed from the winding machine to a temperature above a first temperature and below a second temperature. Gaps are formed in the deflection coil subsequent to the winding process while the temperature of the coil is between the first and second temperatures.

Possible Relatives

Sumon D Dasgupta  Ashok K Dasgupta 

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