Benjamin Bonner resumes & CV records
Resumes
Benjamin Bonner
Benjamin Bonner
Location:
United States
Benjamin A Bonner, Age 571441 Grace Ave, San Jose, CA 95125
Benjamin Bonner Phones & Addresses
1441 Grace Ave, San Jose, CA 95125 (408) 583-7629
85 Paul Ave, Mountain View, CA 94041
Santa Clara, CA
Campbell, CA
San Mateo, CA
Tucson, AZ
Springfield, MO
Mentions for Benjamin A Bonner
Publications & IP owners
Us Patents
Utility Wafer For Chemical Mechanical Polishing
US Patent:
6361405, Mar 26, 2002
Filed:
Apr 6, 2000
Appl. No.:
09/544734
Inventors:
Jeffrey D. David - Sunnyvale CA
Benjamin A. Bonner - San Mateo CA
Thomas H. Osterheld - Mountain View CA
Sidney Huey - Milpitas CA
Benjamin A. Bonner - San Mateo CA
Thomas H. Osterheld - Mountain View CA
Sidney Huey - Milpitas CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B24B 100
US Classification:
451 41, 451 44
Abstract:
A utility wafer, more specifically, an utility wafer for simulating a workpiece in a semiconductor processing system. The utility wafer includes a first side, a second side and a peripheral edge wherein one or both edges of the peripheral edge are relieved to remove the otherwise sharp edge. In one embodiment, the peripheral edge is polished. The utility wafer is resistant to chipping, stress cracking and breakage when undergoing chemical mechanical planarization.
Closed Loop Control Over Delivery Of Liquid Material To Semiconductor Processing Tool
US Patent:
6561381, May 13, 2003
Filed:
Nov 20, 2000
Appl. No.:
09/717720
Inventors:
Thomas H. Osterheld - Mountain View CA
Benjamin A. Bonner - San Mateo CA
Michael W. Richter - Sunnyvale CA
Benjamin A. Bonner - San Mateo CA
Michael W. Richter - Sunnyvale CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B67B 700
US Classification:
222 1, 222 58, 222 61, 222335, 222399
Abstract:
Liquid material is precisely dispensed to a semiconductor processing tool utilizing closed loop control. In one embodiment, CMP slurry material of known density is supplied from a reservoir/mixing vessel to a dispense module. The dispense module also receives a flow of an inert gas through a gas supply valve. Positive pressure arising within the dispense module due to the inert gas flow causes an outflow of slurry from the dispense module to the CMP platen. The rate of flow of the slurry to the CMP platen over time is determined by monitoring the change (decline) in weight of the filled dispense module. In a similar manner, variation in the rate of flow of slurry over time may be detected by monitoring variation in changes in weight of the filled dispense module over time. A regulator structure in electronic communication with the dispense module and with the gas supply valve receives first signals at different time points indicating the weight change of the dispense module. In response, the regulator structure communicates a second signal to the gas supply valve, reflecting an appropriate change in the rate of flow of CMP slurry material to the platen.
Methods And Compositions For Chemical Mechanical Polishing Shallow Trench Isolation Substrates
US Patent:
6811470, Nov 2, 2004
Filed:
Jul 12, 2002
Appl. No.:
10/194560
Inventors:
Benjamin A. Bonner - Campbell CA
Anand N. Iyer - Santa Clara CA
Deepak N. Kumar - Sunnyvale CA
Thomas H. Osterheld - Mountain View CA
Yong-Sik R. Kim - Santa Clara CA
Christopher W. Smith - Los Altos Hills CA
Huanbo Zhang - Cupertino CA
Anand N. Iyer - Santa Clara CA
Deepak N. Kumar - Sunnyvale CA
Thomas H. Osterheld - Mountain View CA
Yong-Sik R. Kim - Santa Clara CA
Christopher W. Smith - Los Altos Hills CA
Huanbo Zhang - Cupertino CA
Assignee:
Applied Materials Inc. - Santa Clara CA
International Classification:
B24B 100
US Classification:
451 41, 451 28
Abstract:
Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.
Closed Loop Control Over Delivery Of Liquid Material To Semiconductor Processing Tool
US Patent:
6834777, Dec 28, 2004
Filed:
Apr 7, 2003
Appl. No.:
10/409368
Inventors:
Thomas H. Osterheld - Mountain View CA
Benjamin A. Bonner - San Mateo CA
Michael W. Richter - Sunnyvale CA
Benjamin A. Bonner - San Mateo CA
Michael W. Richter - Sunnyvale CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B67D 5008
US Classification:
222 58, 222335, 222399
Abstract:
Liquid material is precisely dispensed to a semiconductor processing tool utilizing closed loop control. In one embodiment, CMP slurry material of known density is supplied from a reservoir/mixing vessel to a dispense module. The dispense module also receives a flow of an inert gas through a gas supply valve. Positive pressure arising within the dispense module due to the inert gas flow causes an outflow of slurry from the dispense module to the CMP platen. The rate of flow of the slurry to the CMP platen over time is determined by monitoring the change (decline) in weight of the filled dispense module. In a similar manner, variation in the rate of flow of slurry over time may be detected by monitoring variation in changes in weight of the filled dispense module over time. A regulator structure in electronic communication with the dispense module and with the gas supply valve receives first signals at different time points indicating the weight change of the dispense module. In response, the regulator structure communicates a second signal to the gas supply valve, reflecting an appropriate change in the rate of flow of CMP slurry material to the platen.
Carrier Head With A Modified Flexible Membrane
US Patent:
6855043, Feb 15, 2005
Filed:
Jul 7, 2000
Appl. No.:
09/611247
Inventors:
Jianshe Tang - Cupertino CA, US
Brian J. Brown - Palo Alto CA, US
Charles C. Garretson - Palo Alto CA, US
Benjamin A. Bonner - San Mateo CA, US
Thomas H. Osterheld - Mountain View CA, US
Fred C. Redeker - Fremont CA, US
Brian J. Brown - Palo Alto CA, US
Charles C. Garretson - Palo Alto CA, US
Benjamin A. Bonner - San Mateo CA, US
Thomas H. Osterheld - Mountain View CA, US
Fred C. Redeker - Fremont CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B24B047/02
US Classification:
451398, 451288, 451290
Abstract:
A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane that applies a load to a substrate and a retaining ring. The friction coefficient of the lower surface of the flexible membrane is increased to prevent contact between the substrate and the retaining ring, thereby preventing slurry compaction and buildup and substrate deformation caused by such contact.
Materials For Chemical Mechanical Polishing
US Patent:
7179159, Feb 20, 2007
Filed:
May 2, 2005
Appl. No.:
11/119682
Inventors:
Benjamin A. Bonner - San Jose CA, US
Peter McReynolds - San Mateo CA, US
Gregory E. Menk - Pleasanton CA, US
Anand N. Iyer - Santa Clara CA, US
Gopalakrishna B. Prabhu - San Jose CA, US
Erik S. Rondum - San Ramon CA, US
Robert L. Jackson - San Jose CA, US
Garlen Leung - San Jose CA, US
Peter McReynolds - San Mateo CA, US
Gregory E. Menk - Pleasanton CA, US
Anand N. Iyer - Santa Clara CA, US
Gopalakrishna B. Prabhu - San Jose CA, US
Erik S. Rondum - San Ramon CA, US
Robert L. Jackson - San Jose CA, US
Garlen Leung - San Jose CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B24D 11/00
US Classification:
451527, 451530, 451533
Abstract:
A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.
Materials For Chemical Mechanical Polishing
US Patent:
7429210, Sep 30, 2008
Filed:
Jan 23, 2007
Appl. No.:
11/626014
Inventors:
Benjamin A. Bonner - San Jose CA, US
Peter McReynolds - San Mateo CA, US
Gregory E. Menk - Pleasanton CA, US
Anand N. Iyer - Santa Clara CA, US
Gopalakrishna B. Prabhu - San Jose CA, US
Erik S. Rondum - San Ramon CA, US
Robert L. Jackson - San Jose CA, US
Garlen Leung - San Jose CA, US
Peter McReynolds - San Mateo CA, US
Gregory E. Menk - Pleasanton CA, US
Anand N. Iyer - Santa Clara CA, US
Gopalakrishna B. Prabhu - San Jose CA, US
Erik S. Rondum - San Ramon CA, US
Robert L. Jackson - San Jose CA, US
Garlen Leung - San Jose CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B24D 11/00
US Classification:
451527, 451530, 451533
Abstract:
A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.
Polishing Apparatus With Grooved Subpad
US Patent:
7601050, Oct 13, 2009
Filed:
Feb 15, 2007
Appl. No.:
11/707651
Inventors:
Steven M. Zuniga - Soquel CA, US
Peter McReynolds - San Mateo CA, US
Erik S. Rondum - San Ramon CA, US
Benjamin A. Bonner - San Jose CA, US
Henry H. Au - San Jose CA, US
Gregory E. Menk - Pleasanton CA, US
Gopalakrishna B. Prabhu - San Jose CA, US
Anand N. Iyer - Santa Clara CA, US
Garlen C. Leung - San Jose CA, US
Peter McReynolds - San Mateo CA, US
Erik S. Rondum - San Ramon CA, US
Benjamin A. Bonner - San Jose CA, US
Henry H. Au - San Jose CA, US
Gregory E. Menk - Pleasanton CA, US
Gopalakrishna B. Prabhu - San Jose CA, US
Anand N. Iyer - Santa Clara CA, US
Garlen C. Leung - San Jose CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B24B 7/22
US Classification:
451 41, 451288, 451533
Abstract:
A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.
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