Brian Sutterfield resumes & CV records
Resumes
Brian Dean Sutterfield, Age 57119 Allie Ct, Hudson Oaks, TX 76087
Brian Sutterfield Phones & Addresses
Hudson Oaks, TX
San Diego, CA
South St Paul, MN
Apple Valley, MN
North Las Vegas, NV
Fort Worth, TX
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Brian Dean Sutterfield
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Mentions for Brian Dean Sutterfield
Publications & IP owners
Us Patents
System And Method Of Protecting A System That Includes Unprotected Computer Devices
US Patent:
8321926, Nov 27, 2012
Filed:
Dec 2, 2008
Appl. No.:
12/326246
Inventors:
Brian D. Sutterfield - Apple Valley MN, US
Bradley T. Atwater - Medford NJ, US
Bradley T. Atwater - Medford NJ, US
Assignee:
Lockheed Martin Corporation - Bethesda MD
International Classification:
G06F 9/00
G06F 15/16
G06F 12/14
G06F 7/04
G06F 17/30
G06F 1/26
G06F 11/30
G06F 3/00
G06F 13/28
H04N 7/16
G08B 13/00
G08B 21/00
G08B 29/00
G06F 15/16
G06F 12/14
G06F 7/04
G06F 17/30
G06F 1/26
G06F 11/30
G06F 3/00
G06F 13/28
H04N 7/16
G08B 13/00
G08B 21/00
G08B 29/00
US Classification:
726 11, 726 26, 726 34, 710 8, 710 36, 711152, 713189
Abstract:
A system and method to selectively isolate one or more unprotected computer devices from the rest of the computer system and/or from the network. The ability to isolate and/or authenticate the software and/or hardware on or interacting with the unprotected software and/or hardware provides for a secured system despite the presence or use of an unprotected computer device.
Thermally Conductive Shelf
US Patent:
7508670, Mar 24, 2009
Filed:
Aug 14, 2007
Appl. No.:
11/893036
Inventors:
Kevin J. Thorson - Eagan MN, US
Gregory M. Drexler - Minnetonka MN, US
Rick C. Stevens - Apple Valley MN, US
Brian D. Sutterfield - Apple Valley MN, US
Gregory M. Drexler - Minnetonka MN, US
Rick C. Stevens - Apple Valley MN, US
Brian D. Sutterfield - Apple Valley MN, US
Assignee:
Lockheed Martin Corporation - Bethesda MD
International Classification:
H05K 7/20
US Classification:
361699, 361689, 361698, 174 151, 165 804, 16510433
Abstract:
Embodiments of the present disclosure include devices, systems, and methods. For example, one device embodiment of a thermally conductive shelf for operation with a conduction-cooled electronic module includes an expandable member defining a fluid passage between a first end and a second end, where the expandable member includes a first outer surface to contact a first conduction-cooled electronic module, an inlet located at a first end to receive a conductive fluid, and an outlet located at the second end to exhaust the conductive fluid.
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