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Charles A Amsden, Age 638 Calle Nopalitos, Santa Fe, NM 87507

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Known as:
Charles Anthony Amsden Charles Charles Amsden Charles A Amsdem
Related to:
Lincoln Holbrook

Charles Amsden Phones & Addresses

8 Calle Nopalitos, Santa Fe, NM 87507

Fremont, CA

Milpitas, CA

1102 Cuesta Dr, Mountain View, CA 94040

Sunnyvale, CA

Santa Clara, CA

Mentions for Charles A Amsden

Charles Amsden resumes & CV records

Resumes

Charles Amsden Photo 18

Charles Amsden

Location:
120 Dixon Landing Rd, Milpitas, CA 95035
Industry:
Electrical/Electronic Manufacturing
Skills:
Materials, Thermal Analysis, Contamination Control, Heat Transfer, Product Design, Budgeting, Manufacturing, Reliability Engineering, Process Development, Requirements Analysis, Budgets, Design For Manufacturing, Metrology, R&D, Process Simulation, Engineering, Optics, Thin Films, Engineering Management, Laser, Electronics, Mechanical Engineering, Opto Mechanical Engineering, Design of Experiments, Optical Engineering, Metal Fabrication, Sheet Metal, Labview, Semiconductors, Solidworks, Finite Element Analysis, Failure Analysis, Systems Engineering, Product Development, Sensors, Thermal
Charles Amsden Photo 19

Charles Amsden

Publications & IP owners

Us Patents

Large Particle Detection For Multi-Spot Surface Scanning Inspection Systems

US Patent:
2013005, Feb 28, 2013
Filed:
Aug 2, 2012
Appl. No.:
13/565702
Inventors:
Juergen Reich - Campbell CA, US
Charles Amsden - Mountain View CA, US
Jiayao Zhang - Sunnyvale CA, US
Christian Wolters - San Jose CA, US
Assignee:
KLA-Tencor Corporation - Milpitas CA
International Classification:
G01N 21/956
US Classification:
3562374
Abstract:
The illumination power density of a multi-spot inspection system is adjusted in response to detecting a large particle in the inspection path of an array of primary illumination spots. At least one low power, secondary illumination spot is located in the inspection path of an array of relatively high power primary illumination spots. Light scattered from the secondary illumination spot is collected and imaged onto one or more detectors without overheating the particle and damaging the wafer. Various embodiments and methods are presented to distinguish light scattered from secondary illumination spots. In response to determining the presence of a large particle in the inspection path of a primary illumination spot, a command is transmitted to an illumination power density attenuator to reduce the illumination power density of the primary illumination spot to a safe level before the primary illumination spot reaches the large particle.

Optical Interconnect For Switch Applications

US Patent:
2020035, Nov 12, 2020
Filed:
Nov 26, 2019
Appl. No.:
16/696241
Inventors:
- Shenzhen, CN
Bardia Pezeshki - Memlo Park CA, US
Charles Amsden - Fremont CA, US
Lucas Soldano - Milan, IT
International Classification:
G02B 6/30
G02B 6/12
G02B 6/32
G02B 6/42
G02B 6/124
Abstract:
A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

Optical Interconnect For Switch Applications

US Patent:
2019023, Aug 1, 2019
Filed:
Sep 4, 2018
Appl. No.:
16/121487
Inventors:
- Newark CA, US
Bardia Pezeshki - Menlo Park CA, US
Charles Amsden - Fremont CA, US
Lucas Soldano - Milan, IT
International Classification:
G02B 6/42
G02B 6/43
Abstract:
A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and a planar lightwave circuits (PLCs).

Optical Interconnect For Switch Applications

US Patent:
2019007, Mar 7, 2019
Filed:
Apr 24, 2018
Appl. No.:
15/961765
Inventors:
- Newark CA, US
Bardia Pezeshki - Menlo Park CA, US
Charles Amsden - Fremont CA, US
Lucas Soldano - Milan, IT
International Classification:
G02B 6/30
G02B 6/12
G02B 6/124
G02B 6/32
G02B 6/42
G02B 6/34
H04Q 11/00
Abstract:
A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

Defect Marking For Semiconductor Wafer Inspection

US Patent:
2018008, Mar 29, 2018
Filed:
Feb 13, 2017
Appl. No.:
15/430817
Inventors:
- Milpitas CA, US
Steven Lange - Alamo CA, US
Junwei Wei - Milpitas CA, US
Daniel Kapp - Pleasanton CA, US
Charles Amsden - Mountain View CA, US
International Classification:
G01N 21/88
G01N 1/28
G01N 1/44
G01N 21/95
Abstract:
Methods and systems for accurately locating buried defects previously detected by an inspection system are described herein. A physical mark is made on the surface of a wafer near a buried defect detected by an inspection system. In addition, the inspection system accurately measures the distance between the detected defect and the physical mark in at least two dimensions. The wafer, an indication of the nominal location of the mark, and an indication of the distance between the detected defect and the mark are transferred to a material removal tool. The material removal tool (e.g., a focused ion beam (FIB) machining tool) removes material from the surface of the wafer above the buried defect until the buried defect is made visible to an electron-beam based measurement system. The electron-beam based measurement system is subsequently employed to further analyze the defect.

Optical Interconnect Having Optical Splitters And Modulators Integrated On Same Chip

US Patent:
2017027, Sep 21, 2017
Filed:
Mar 21, 2017
Appl. No.:
15/465330
Inventors:
- Newark CA, US
John Heanue - Boston MA, US
Lucas Soldano - Milan, IT
Charles Amsden - Fremont CA, US
International Classification:
H04Q 11/00
H04B 10/516
H04B 10/50
Abstract:
A switch module includes a switch integrated circuit (IC), an InP chip, and a planar lightwave circuit (PLC). The InP chip may include a plurality of light sources, an optical splitter, and a plurality of modulators.

Optical Interconnect For Switch Applications

US Patent:
2017013, May 18, 2017
Filed:
Oct 20, 2016
Appl. No.:
15/299310
Inventors:
- Newark CA, US
Bardia Pezeshki - Menlo Park CA, US
Charles Amsden - Fremont CA, US
Lucas Soldano - Milan, IT
International Classification:
G02B 6/30
G02B 6/124
G02B 6/42
G02B 6/12
G02B 6/32
Abstract:
A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and an interface having removably coupled first side and second side. The first side includes a lens array optically coupled to a SiP chip and the second side includes a connector having a plurality of planar lightwave circuits (PLCs) optically coupled to another lens array.

Optical Interconnect For Switch Applications

US Patent:
2016038, Dec 29, 2016
Filed:
Jun 24, 2016
Appl. No.:
15/192890
Inventors:
- Newark CA, US
Bardia Pezeshki - Menlo Park CA, US
Charles Amsden - Fremont CA, US
Lucas Soldano - Milan, IT
International Classification:
H04Q 11/00
G02B 6/12
G02B 6/42
G02B 6/43
H04B 10/25
H04B 10/80
Abstract:
A switch module includes a switch integrated circuit (IC), a silicon photonics chips, and a planar lightwave circuits (PLCs).

Isbn (Books And Publications)

Navaho Weaving: Its Technic And History

Author:
Charles Avery Amsden
ISBN #:
0486265374

Navaho Weaving, Its Technic And History

Author:
Charles Avery Amsden
ISBN #:
0879050632

Prehistoric Southwesterners From Basketmaker To Pueblo

Author:
Charles A. Amsden
ISBN #:
0404154778

Navaho Weaving Its Technique And Its History

Author:
Charles A. Amsden
ISBN #:
0873801725

Possible Relatives

Daniel K Amsden  Jennifer A Amsden  Kent Amsden  Kimberly A Amsden  Morgan G Amsden  Robert H Amsden  Angela M Amsden  Charles A Standen  Charles A Standridge  Charles R Stanfill 

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