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Charles W Freund, Age 804308 Balcones Woods Dr, Austin, TX 78759

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Known as:
Charles E Freund

Charles Freund Phones & Addresses

4308 Balcones Woods Dr, Austin, TX 78759 (512) 345-4651

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License Records

Charles E Freund

Licenses:
License #: TA.04.0406252 - Active
Category: Financial Industry License
Issued Date: Aug 6, 2014
Type: Title Insurance Agent

Charles E Freund

Licenses:
License #: TA.15.1501651 - Active
Category: Financial Industry License
Issued Date: Oct 26, 2005
Type: Title Insurance Agent

Charles Freund resumes & CV records

Resumes

Charles Freund Photo 26

Staff Electrical Engineer

Location:
Austin, TX
Industry:
Semiconductors
Work:
Lam Research
Staff Electrical Engineer
Charles Freund Photo 27

Charles Freund

Publications & IP owners

Us Patents

Method And Apparatus Of Arrayed, Clustered Or Coupled Eddy Current Sensor Configuration For Measuring Conductive Film Properties

US Patent:
7205166, Apr 17, 2007
Filed:
Dec 30, 2003
Appl. No.:
10/749531
Inventors:
Yehiel Gotkis - Fremont CA, US
Rodney Kistler - Los Gatos CA, US
Aleksander Owczarz - San Jose CA, US
Charles Freund - Austin TX, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
H01L 21/66
US Classification:
438 14, 438 17, 257E23243
Abstract:
A method for minimizing measuring spot size and noise during film thickness measurement is provided. The method initiates with locating a first eddy current sensor directed toward a first surface associated with a conductive film. The method includes locating a second eddy current sensor directed toward a second surface associated with the conductive film. The first and second eddy current sensors may share a common axis or be offset from each other. The method further includes alternating power supplied to the first eddy current sensor and the second eddy current sensor, such that the first eddy current sensor and the second eddy current sensor are powered one at a time. In one aspect of the invention, a delay time is incorporated between switching power between the first eddy current sensor and the second eddy current sensor. The method also includes calculating the film thickness measurement based on a combination of signals from the first eddy current sensor and the second eddy current sensor. An apparatus and a system are also provided.

Method And Apparatus Of Arrayed, Clustered Or Coupled Eddy Current Sensor Configuration For Measuring Conductive Film Properties

US Patent:
2007016, Jul 19, 2007
Filed:
Mar 2, 2007
Appl. No.:
11/681711
Inventors:
Yehiel Gotkis - Fremont CA, US
Rodney Kistler - Los Gatos CA, US
Charles Freund - Austin TX, US
International Classification:
H01L 21/306
US Classification:
156345100
Abstract:
A method for minimizing measuring spot size and noise during film thickness measurement is provided. The method initiates with locating a first eddy current sensor directed toward a first surface associated with a conductive film. The method includes locating a second eddy current sensor directed toward a second surface associated with the conductive film. The first and second eddy current sensors may share a common axis or be offset from each other. The method further includes alternating power supplied to the first eddy current sensor and the second eddy current sensor, such that the first eddy current sensor and the second eddy current sensor are powered one at a time. In one aspect of the invention, a delay time is incorporated between switching power between the first eddy current sensor and the second eddy current sensor. The method also includes calculating the film thickness measurement based on a combination of signals from the first eddy current sensor and the second eddy current sensor. An apparatus and a system are also provided.

Method Of And Apparatus For Dynamic Alignment Of Substrates

US Patent:
6502054, Dec 31, 2002
Filed:
Dec 23, 1999
Appl. No.:
09/470780
Inventors:
Benjamin W. Mooring - Austin TX
Charles W. Freund - Austin TX
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
G01C 300
US Classification:
702150, 702149
Abstract:
A wafer is transported on a blade of a robot along a path through a port into a module of semiconductor manufacturing equipment. The port has a transverse axis intersecting the path. Dynamic alignment uses two through-beam sensors positioned along the transverse axis to determine the position of the center of the wafer with respect to the center of the blade as the wafer is transported. Positioning of the sensors according to latency characteristics of the sensors assures that the moving wafer will break or make a beam of a first of the sensors and that the first sensor will generate a first transition signal before the moving wafer will break or make a beam of a second of the sensors and before the second sensor generates a second transition signal. The dynamic alignment may be performed with respect to wafers having different sizes.

Possible Relatives

Cynthia M Freund  David J Freund  Aaron P Freund  Diana S Freund  Diane L Freund  Eliezer Freund  Emily N Freund  Charles A Standen  Charles A Standridge  Charles R Stanfill 

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