People Background Check
Find People:

Christopher R Lucero, Age 3812691 W Flower St, Avondale, AZ 85392

Get Report
Known as:
Christopher Ray Lucero Chris Lucero Lucero Lucero
Related to:
Thomas Edgar Daniels 68

Christopher Lucero Phones & Addresses

12691 W Flower St, Avondale, AZ 85392

Phoenix, AZ

201 S Morrison Rd APT 3B, Muncie, IN 47304 (765) 631-2493

Wilmington, NC

Great Falls, MT

Mentions for Christopher R Lucero

Career records & work history

Lawyers & Attorneys

Christopher Lucero Photo 1

Christopher Lucero - Lawyer

Specialties:
Criminal Law, DUI/DWI
ISLN:
1000437764
Admitted:
2015
University:
St. John's University School of Law
Law School:
St John's University School of Law, JD - Juris Doctor, 2014

Publications & IP owners

Us Patents

Cooling System For An Electronic Component

US Patent:
6880345, Apr 19, 2005
Filed:
Nov 4, 2003
Appl. No.:
10/701727
Inventors:
Javier M. Leija - Chandler AZ, US
Christopher D. Lucero - Phoenix AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
F25B021/02
US Classification:
62 32, 62 37, 622592
Abstract:
A cooling system for an electronic component is provided. The cooling system includes a plurality of thermoelectric elements for placement above a plurality of different areas of the electronic component. The cooling system has a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements, such that the thermoelectric elements pump heat away from the respective areas. The cooling system has a control apparatus connected to the conductors for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.

Pull Lever Latch Apparatus

US Patent:
7083449, Aug 1, 2006
Filed:
Mar 29, 2005
Appl. No.:
11/092114
Inventors:
Javier Leija - Chandler AZ, US
James C Shipley - Gilbert AZ, US
Christopher A Gonzales - Chandler AZ, US
Christopher D Lucero - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01R 13/62
US Classification:
439160
Abstract:
In general, in one aspect, the disclosure describes an apparatus that includes a latch to connect a board to a chassis. The apparatus further includes a pull lever to control whether said latch is retracted or extended. The latch connects the board to the chassis when it is extended.

Circuit Board Latch System

US Patent:
7209364, Apr 24, 2007
Filed:
Dec 29, 2004
Appl. No.:
11/024625
Inventors:
James C. Shipley - Gilbert AZ, US
Javier Leija - Chandler AZ, US
Christopher A. Gonzales - Chandler AZ, US
Christopher D. Lucero - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 7/14
US Classification:
361801, 361759, 361747, 361740, 361732, 361726
Abstract:
A method according to one embodiment may include providing a circuit board assembly comprising a circuit board and a rotatable knob and at least one latch coupled to the knob via a linkage. The method of this embodiment may also include moving the at least one latch to a retracted position by rotating the knob, and inserting the circuit board assembly into a chassis. The method may then include moving the latch to an extended position. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.

Airflow Redistribution Device

US Patent:
7215552, May 8, 2007
Filed:
Mar 23, 2005
Appl. No.:
11/087256
Inventors:
James C Shipley - Gilbert AZ, US
Javier Leija - Chandler AZ, US
Christopher A Gonzales - Chandler AZ, US
Christopher D Lucero - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 7/20
US Classification:
361721, 361695, 361719, 165 802, 16510433, 165122, 174 161, 454184
Abstract:
In general, in one aspect, the disclosure describes an apparatus to redistribute airflow throw slots of a chassis that houses boards. The apparatus includes at least one restriction region to limit airflow therethrough. The apparatus further includes an open region to allow airflow to pass therethrough. At least some of the airflow limited by the at least one restriction region will flow through the open region. The apparatus also includes a connection mechanism to connect to a chassis.

Reconfigurable Airflow Director For Modular Blade Chassis

US Patent:
7259961, Aug 21, 2007
Filed:
Jun 24, 2004
Appl. No.:
10/875968
Inventors:
Christopher D. Lucero - Phoenix AZ, US
Javier Leija - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 7/20
US Classification:
361695, 361694, 361696, 361697, 361724, 361727, 454184, 165121, 3122232
Abstract:
A reconfigurable airflow director for modular blade chassis. The airflow director includes multiple duct channels having adjustable inlets and/or outlets. The airflow director may be reconfigured to adjust the amount of airflow across selected blades and selected zones on an individual blade. In one embodiment, snap-in airflow blockers are employed to block all or a portion of selected inlets or outlets to adjust the airflow through corresponding duct channels. In one embodiment, adjustable inlet vanes are employed to increase or decrease the size of adjacent inlets. In one embodiment, the airflow director is formed from multiple airflow director modules, each including an outer shell having multiple ribs extending therefrom to form multiple airflow channels, wherein the airflow director modules are stacked together to form a plurality of duct channels. Modular fan assemblies including multiple hot-swappable fans are employed to push and/or draw airflow through the duct channels of the airflow director.

Thermoelectric Module

US Patent:
7299639, Nov 27, 2007
Filed:
Jun 22, 2004
Appl. No.:
10/874525
Inventors:
Javier Leija - Chandler AZ, US
Christopher D. Lucero - Phoenix AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
F25B 21/02
US Classification:
62 32, 62 37
Abstract:
A thermoelectric module having areas of highly thermally conductive material integrated into a substrate layer. For one embodiment copper pads are integrated into the external surface of the substrate of the hot side of the thermoelectric module. The copper pads allow direct connection of a heat removal device to the thermoelectric module thereby reducing thermal resistance. Thermal vias may be formed through the substrate to further reduce thermal resistance.

Auxiliary Airflow System

US Patent:
7316606, Jan 8, 2008
Filed:
Feb 8, 2005
Appl. No.:
11/053727
Inventors:
James C Shipley - Gilbert AZ, US
Javier Leija - Chandler AZ, US
Christopher A Gonzales - Chandler AZ, US
Christopher D Lucero - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 5/00
US Classification:
454184, 454185, 361695, 361696, 312236
Abstract:
A method according to one embodiment may include providing a chassis comprising at least one selectively deployable fan disposed within the chassis. The method of this embodiment may also include moving the fan from a stowed configuration to a deployed configuration within the chassis and energizing the at least one fan. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Liquid Cooling System Including Hot-Swappable Components

US Patent:
7420804, Sep 2, 2008
Filed:
Jun 30, 2004
Appl. No.:
10/881884
Inventors:
Javier Leija - Chandler AZ, US
Christopher D. Lucero - Phoenix AZ, US
Christopher A. Gonzales - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 7/20
US Classification:
361687, 361699, 165 804
Abstract:
The specification discloses an apparatus comprising a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger. The specification also discloses a process comprising cooling a heat source using a closed-loop cooling system comprising a cold plate having an inlet and an outlet, the cold plate being attachable to the heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger, and removing or installing the pump module while the cooling system is operating. Other embodiments are described and claimed.

Possible Relatives

Dawn M Lucero  Damian Z Lucero  Dennis N Lucero  Darlene R Lucero  Dave F Lucero  Diana L Lucero  Dolores E Lucero  Christopher E Stamps  Christopher L Stancil  Christopher C Standifer 

NOTICE: You may not use PeopleBackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. PeopleBackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.