Colin J Mcdonough, Age 35735 Spring St, Latrobe, PA 15650

Colin Mcdonough Phones & Addresses

735 Spring St, Latrobe, PA 15650

Albany, NY

Easton, PA

Pittsburgh, PA

Mentions for Colin J Mcdonough

Professional Records

Medicine doctors

Colin M. Mcdonough

Specialties:
Internal Medicine
Work:
Providence Medical Group
1899 Blankenship Rd, West Linn, OR 97068
(503) 513-3350 (phone) (503) 513-3355 (fax)
Site
Education:
Medical School
University of Texas Southwestern Medical Center at Dallas
Graduated: 1988
Procedures:
Cardiac Stress Test, Electrocardiogram (EKG or ECG), Vaccine Administration
Conditions:
Acute Pharyngitis, Anemia, Anxiety Dissociative and Somatoform Disorders, Atrial Fibrillation and Atrial Flutter, Attention Deficit Disorder (ADD), Contact Dermatitis, Diabetes Mellitus (DM), Disorders of Lipoid Metabolism, Gastroesophageal Reflux Disease (GERD), Gout, Hypertension (HTN), Hypothyroidism, Ischemic Heart Disease, Obstructive Sleep Apnea, Osteoporosis, Skin and Subcutaneous Infections, Abdominal Hernia, Abnormal Vaginal Bleeding, Acne, Acute Bronchitis, Acute Conjunctivitis, Acute Pancreatitis, Acute Renal Failure, Acute Sinusitis, Acute Upper Respiratory Tract Infections, Alopecia Areata, Alzheimer's Disease, Anxiety Phobic Disorders, Arterial Thromboembolic Disease, Atopic Dermatitis, Benign Polyps of the Colon, Benign Prostatic Hypertrophy, Bipolar Disorder, Bronchial Asthma, Calculus of the Urinary System, Candidiasis, Cardiac Arrhythmia, Cardiomyopathy, Carpel Tunnel Syndrome, Celiac Disease, Chronic Fatigue Syndrome, Chronic Renal Disease, Cirrhosis, Conduction Disorders, Constipation, Dementia, Dermatitis, Diverticulitis, Erectile Dysfunction (ED), Fractures, Dislocations, Derangement, and Sprains, Gastritis and Duodenitis, Gingival and Periodontal Diseases, Hearing Loss, Heart Failure, Hemorrhagic stroke, Hemorrhoids, Herpes Simplex, Herpes Zoster, Hyperthyroidism, Infectious Liver Disease, Inflammatory Bowel Disease (IBD), Inguinal Hernia, Insomnia, Internal Derangement of Knee Cartilage, Iron Deficiency Anemia, Irritable Bowel Syndrome (IBS), Ischemic Stroke, Labyrinthitis, Lateral Epicondylitis, Malignant Neoplasm of Female Breast, Menopausal and Postmenopausal Disorders, Migraine Headache, Multiple Sclerosis (MS), Non-Toxic Goiter, Osteoarthritis, Osteomyelitis, Otitis Media, Parkinson's Disease, Paroxysmal Supreventricular Tachycardia (PSVT), Peripheral Nerve Disorders, Plantar Fascitis, Plantar Warts, Pneumonia, Pulmonary Embolism, Restless Leg Syndrome, Retinal Detachments, Rheumatoid Arthritis, Rosacea, Rotator Cuff Syndrome and Allied Disorders, Schizophrenia, Sciatica, Spinal Stenosis, Substance Abuse and/or Dependency, Sunburn, Tension Headache, Tinea Pedis, Transient Cerebral Ischemia, Urinary Incontinence, Venous Embolism and Thrombosis, Ventral Hernia, Vitamin D Deficiency
Languages:
English, Spanish
Description:
Dr. McDonough graduated from the University of Texas Southwestern Medical Center at Dallas in 1988. He works in West Linn, OR and specializes in Internal Medicine.

Resumes

Resumes

Colin Mcdonough Photo 1

Mba Candidate 2015 At Columbia Business School

Location:
New York, New York
Industry:
Investment Banking
Work:
UBS Investment Bank Apr 2010 - May 2013
Director
Bank of America Jul 2007 - Apr 2010
Associate
Education:
Columbia Business School 2013 - 2015
Master of Business Administration (MBA)
Princeton University 2003 - 2007
BA, Political Economy
Skills:
Capital Markets, Bloomberg, Hedge Funds, Equities, Series 7, Financial Markets, Series 63, Equity Capital Markets, Securities, Valuation
Interests:
Reading, Golf, Running, College Football (and College Football Ticket Arbitrage)
Colin Mcdonough Photo 2

Client Services Manager At Alere Wellbeing

Position:
Client Services Manager at Alere Wellbeing
Location:
Seattle, Washington
Industry:
Health, Wellness and Fitness
Work:
Alere Wellbeing since Aug 2011
Client Services Manager
Wild Ginger Jul 2008 - Aug 2011
Server
Education:
University of Michigan 2009 - 2010
CFPH, Public Health
Alaska Pacific University 2000 - 2005
BS, Environmental Science
Skills:
Event Planning, Public Health, Research, Data Analysis, Public Speaking, Program Evaluation

Publications

US Patents

Apparatus And Method For Integration Of Through Substrate Vias

US Patent:
2013027, Oct 17, 2013
Filed:
Apr 12, 2012
Appl. No.:
13/445636
Inventors:
Jeremiah HEBDING - Poughkeepsie NY,
Megha RAO - Clifton Park NY,
Colin McDONOUGH - Albany NY,
Matthew SMALLEY - Ballston Lake NY,
Douglas Duane COOLBAUGH - Highland NY,
Joseph PICCIRILLO, JR. - Clifton Park NY,
Stephen G. BENNETT - Niskayuna NY,
Michael LIEHR - Guilderland NY,
Daniel PASCUAL - Wolcott VT,
Assignee:
The Research Foundation Of State University Of New York - Albany NY
International Classification:
H01L 23/538
H01L 21/762
H01L 21/50
H01L 21/768
US Classification:
257774, 438675, 438455, 438118, 257E21586, 257E21567, 257E21499, 257E23174
Abstract:
An apparatus and method are provided for integrating TSVs into devices prior to device contacts processing. The apparatus includes a semiconducting layer; one or more CMOS devices mounted on a top surface of the semiconducting layer; one or more TSVs integrated into the semiconducting layer of the device wafer; at least one metal layer applied over the TSVs; and one or more bond pads mounted onto a top layer of the at least one metal layer, wherein the at least one metal layer is arranged to enable placement of the one or more bond pads at a specified location for bonding to a second device wafer. The method includes obtaining a wafer of semiconducting material, performing front end of line processing on the wafer; providing one or more TSVs in the wafer; performing middle of line processing on the wafer; and performing back end of line processing on the wafer.

Apparatus And Method For Thin Die-To-Wafer Bonding

US Patent:
2013027, Oct 17, 2013
Filed:
Apr 12, 2012
Appl. No.:
13/445550
Inventors:
Daniel PASCUAL - Wolcott VT,
Jeremiah HEBDING - Poughkeepsie NY,
Megha RAO - Clifton Park NY,
Colin McDONOUGH - Albany NY,
Douglas Duane COOLBAUGH - Highland NY,
Joseph PICCIRILLO, JR. - Clifton Park NY,
Michael LIEHR - Guilderland NY,
Assignee:
THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK - Albany NY
International Classification:
H01L 21/50
B23K 37/04
H01L 21/762
US Classification:
438107, 438458, 228 447, 257E21567, 257E21499
Abstract:
A method is provided for bonding a die to a base technology wafer and includes: providing a device wafer having a front, back, at least one side, and at least one TSV, wherein the back contains a substrate material; providing a carrier wafer having a front, back, and at least one side; bonding the wafers using an adhesive; removing the substrate material and wet etching, from the device wafer's back side, to expose at least one metallization scheme feature; processing the device wafer's back side to create at least one backside redistribution layer; removing the device wafer from the carrier wafer; dicing the device wafer into individual die; providing a base technology wafer; coating the front of the base technology wafer with a sacrificial adhesive; placing the front of the individual die onto the front of the base technology wafer; and bonding the individual die to the base technology wafer.

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