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Colin J Mcdonough, Age 42540 New Salem Rd, Voorheesville, NY 12186

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Known as:
Collin Mcdonough Colin Mc Colin Mc Donough
Related to:
John J Mcdonough

Colin Mcdonough Phones & Addresses

540 New Salem Rd, Voorheesville, NY 12186

Albany, NY

735 Spring St, Latrobe, PA 15650 (724) 537-4680

Easton, PA

Pittsburgh, PA

Mentions for Colin J Mcdonough

Career records & work history

Medicine Doctors

Colin M. Mcdonough

Specialties:
Internal Medicine
Work:
Providence Medical Group
1899 Blankenship Rd, West Linn, OR 97068
(503) 513-3350 (phone) (503) 513-3355 (fax)
Site
Education:
Medical School
University of Texas Southwestern Medical Center at Dallas
Graduated: 1988
Procedures:
Cardiac Stress Test, Electrocardiogram (EKG or ECG), Vaccine Administration
Conditions:
Acute Pharyngitis, Anemia, Anxiety Dissociative and Somatoform Disorders, Atrial Fibrillation and Atrial Flutter, Attention Deficit Disorder (ADD), Contact Dermatitis, Diabetes Mellitus (DM), Disorders of Lipoid Metabolism, Gastroesophageal Reflux Disease (GERD), Gout, Hypertension (HTN), Hypothyroidism, Ischemic Heart Disease, Obstructive Sleep Apnea, Osteoporosis, Skin and Subcutaneous Infections, Abdominal Hernia, Abnormal Vaginal Bleeding, Acne, Acute Bronchitis, Acute Conjunctivitis, Acute Pancreatitis, Acute Renal Failure, Acute Sinusitis, Acute Upper Respiratory Tract Infections, Alopecia Areata, Alzheimer's Disease, Anxiety Phobic Disorders, Arterial Thromboembolic Disease, Atopic Dermatitis, Benign Polyps of the Colon, Benign Prostatic Hypertrophy, Bipolar Disorder, Bronchial Asthma, Calculus of the Urinary System, Candidiasis, Cardiac Arrhythmia, Cardiomyopathy, Carpel Tunnel Syndrome, Celiac Disease, Chronic Fatigue Syndrome, Chronic Renal Disease, Cirrhosis, Conduction Disorders, Constipation, Dementia, Dermatitis, Diverticulitis, Erectile Dysfunction (ED), Fractures, Dislocations, Derangement, and Sprains, Gastritis and Duodenitis, Gingival and Periodontal Diseases, Hearing Loss, Heart Failure, Hemorrhagic stroke, Hemorrhoids, Herpes Simplex, Herpes Zoster, Hyperthyroidism, Infectious Liver Disease, Inflammatory Bowel Disease (IBD), Inguinal Hernia, Insomnia, Internal Derangement of Knee Cartilage, Iron Deficiency Anemia, Irritable Bowel Syndrome (IBS), Ischemic Stroke, Labyrinthitis, Lateral Epicondylitis, Malignant Neoplasm of Female Breast, Menopausal and Postmenopausal Disorders, Migraine Headache, Multiple Sclerosis (MS), Non-Toxic Goiter, Osteoarthritis, Osteomyelitis, Otitis Media, Parkinson's Disease, Paroxysmal Supreventricular Tachycardia (PSVT), Peripheral Nerve Disorders, Plantar Fascitis, Plantar Warts, Pneumonia, Pulmonary Embolism, Restless Leg Syndrome, Retinal Detachments, Rheumatoid Arthritis, Rosacea, Rotator Cuff Syndrome and Allied Disorders, Schizophrenia, Sciatica, Spinal Stenosis, Substance Abuse and/or Dependency, Sunburn, Tension Headache, Tinea Pedis, Transient Cerebral Ischemia, Urinary Incontinence, Venous Embolism and Thrombosis, Ventral Hernia, Vitamin D Deficiency
Languages:
English, Spanish
Description:
Dr. McDonough graduated from the University of Texas Southwestern Medical Center at Dallas in 1988. He works in West Linn, OR and specializes in Internal Medicine.

Colin Mcdonough resumes & CV records

Resumes

Colin Mcdonough Photo 34

Derivatives Integration Engineer

Location:
Albany, NY
Industry:
Semiconductors
Work:
Suny Polytechnic Institute
Derivatives Integration Engineer The Research Foundation For Suny Aug 2005 - Apr 2011
Graduate Research Assistant
Education:
University at Albany, Suny 2005 - 2011
Doctorates, Doctor of Philosophy, Nanotechnology, Engineering, Philosophy Lafayette College 2001 - 2005
Bachelors, Bachelor of Science, Computer Engineering
Skills:
Nanotechnology, Semiconductors, Photonics, Research, Data Analysis, Characterization, Afm, Scanning Electron Microscopy, Simulations, C++, Raman Microscopy, Near Field Scanning Optical Microscopy, Scanning Probe Microscopy, Stress Analysis, Plasmonics, Surface Plasmon Resonance, R, Python, Cvd, Design of Experiments, Materials Science, Physics, Spectroscopy, Thin Films
Colin Mcdonough Photo 35

Colin Mcdonough

Location:
Albany, NY
Work:
College University
Education:
College University 2006 - 2019
Colin Mcdonough Photo 36

Colin Mcdonough

Colin Mcdonough Photo 37

Colin Mcdonough

Colin Mcdonough Photo 38

Colin Mcdonough

Colin Mcdonough Photo 39

Colin Mcdonough

Publications & IP owners

Us Patents

Apparatus And Method For Integration Of Through Substrate Vias

US Patent:
2013027, Oct 17, 2013
Filed:
Apr 12, 2012
Appl. No.:
13/445636
Inventors:
Jeremiah HEBDING - Poughkeepsie NY, US
Megha RAO - Clifton Park NY, US
Colin McDONOUGH - Albany NY, US
Matthew SMALLEY - Ballston Lake NY, US
Douglas Duane COOLBAUGH - Highland NY, US
Joseph PICCIRILLO, JR. - Clifton Park NY, US
Stephen G. BENNETT - Niskayuna NY, US
Michael LIEHR - Guilderland NY, US
Daniel PASCUAL - Wolcott VT, US
Assignee:
The Research Foundation Of State University Of New York - Albany NY
International Classification:
H01L 23/538
H01L 21/762
H01L 21/50
H01L 21/768
US Classification:
257774, 438675, 438455, 438118, 257E21586, 257E21567, 257E21499, 257E23174
Abstract:
An apparatus and method are provided for integrating TSVs into devices prior to device contacts processing. The apparatus includes a semiconducting layer; one or more CMOS devices mounted on a top surface of the semiconducting layer; one or more TSVs integrated into the semiconducting layer of the device wafer; at least one metal layer applied over the TSVs; and one or more bond pads mounted onto a top layer of the at least one metal layer, wherein the at least one metal layer is arranged to enable placement of the one or more bond pads at a specified location for bonding to a second device wafer. The method includes obtaining a wafer of semiconducting material, performing front end of line processing on the wafer; providing one or more TSVs in the wafer; performing middle of line processing on the wafer; and performing back end of line processing on the wafer.

Apparatus And Method For Thin Die-To-Wafer Bonding

US Patent:
2013027, Oct 17, 2013
Filed:
Apr 12, 2012
Appl. No.:
13/445550
Inventors:
Daniel PASCUAL - Wolcott VT, US
Jeremiah HEBDING - Poughkeepsie NY, US
Megha RAO - Clifton Park NY, US
Colin McDONOUGH - Albany NY, US
Douglas Duane COOLBAUGH - Highland NY, US
Joseph PICCIRILLO, JR. - Clifton Park NY, US
Michael LIEHR - Guilderland NY, US
Assignee:
THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK - Albany NY
International Classification:
H01L 21/50
B23K 37/04
H01L 21/762
US Classification:
438107, 438458, 228 447, 257E21567, 257E21499
Abstract:
A method is provided for bonding a die to a base technology wafer and includes: providing a device wafer having a front, back, at least one side, and at least one TSV, wherein the back contains a substrate material; providing a carrier wafer having a front, back, and at least one side; bonding the wafers using an adhesive; removing the substrate material and wet etching, from the device wafer's back side, to expose at least one metallization scheme feature; processing the device wafer's back side to create at least one backside redistribution layer; removing the device wafer from the carrier wafer; dicing the device wafer into individual die; providing a base technology wafer; coating the front of the base technology wafer with a sacrificial adhesive; placing the front of the individual die onto the front of the base technology wafer; and bonding the individual die to the base technology wafer.

Possible Relatives

Dana M Mcdonough  Daniel P Mcdonough  Donna M Mcdonough  Edward T Mcdonough  George A Mcdonough  Holly A Mcdonough  Ian I Mcdonough  Colin M Johnson  Colin Steele  Colin P Steen 

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