David Q Ma, Age 56Saint Paul, MN

2008020, Aug 28, 2008

Feb 3, 2006

11/815491

David Q. Ma - Saint Paul MN, US
Christopher S. Perman - Saint Paul MN, US
Raymond D. Skwierczynski - Cambridge MA, US
John C. Hedenstrom - Saint Paul MN, US

A61K 31/437
C07D 471/12
A61P 1/04

514293, 546 82

Pharmaceutical formulations in an aqueous gel formulation including 1-(2-methylpropyl)-1H-imidazo[4,5-c][1,5]naphthyridin-4-amine are provided. Methods of use and kits are also provided.

2009016, Jun 25, 2009

Feb 3, 2006

11/883665

Christopher S. Perman - Saint Paul MN, US
Raymond D. Skwierczynski - Saint Paul MN, US
David Q. Ma - Saint Paul MN, US
John C. Hedenstrom - Saint Paul MN, US

Coley Pharmaceutical Group, Inc. - New York NY

A61K 31/437
A61K 31/4738
A61P 31/00

514293, 514303

Aqueous gel formulations, including an immune response modifier (IRM), such as those chosen from imidazoquinoline amines, tetrahydroimidazoquinoline amines, imidazopyridine amines, 6,7-fused cycloalkylimidazopyridine amines, 1,2-bridged imidazoquinoline amines, imidazonaphthyridine amines, imidazotetrahydronaphthyridine amines, oxazoloquinoline amines, thiazoloquinoline amines, oxazolopyridine amines, thiazolopyridine amines, oxazolonaphthyridine amines, thiazolonaphthyridine amines, pyrazolopyridine amines, pyrazoloquinoline amines, tetrahydropyrazoloquinoline amines, pyrazolonaphthyridine amines, tetrahydropyrazolonaphthyridine amines, and 1H-imidazo dimers fused to pyridine amines, quinoline amines, tetrahydroquinoline amines, naphthyridine amines, or tetrahydronaphthyridine amines, are provided. Methods of use and kits are also provided.

5689608, Nov 18, 1997

Jun 7, 1995

8/485735

Andrew J. Moore - Plano TX
David L. Ma - Plano TX
Robert L. Bontz - Plano TX
Harry B. Bonham - Plano TX

Alcatel Network Systems, Inc. - Richardson TX

G02B 600

385139

A method of increasing the attachment bond strength between a first and second object comprising respective first and second materials is disclosed. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (FIG. 4). An attachment surface of the first material is configured to be nonplanar (FIGS. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (FIGS. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature whereby at least one of the materials is caused to flow in response to the heat. Finally, the first and second materials are brought to the operational temperature, wherein at least one of the first and second materials is placed in a compressive state at the contact point due to the relative change in size of at least one of the first and second materials as compared with the change in size of the other of the first and second materials.

5351329, Sep 27, 1994

Dec 22, 1992

7/994709

Andrew J. Moore - Plano TX
David L. Ma - Plano TX
Robert L. Bontz - Plano TX
Charles C. Burns - Plano TX

Alcatel Network Systems, Inc. - Richardson TX

G02B 600
G02B 636

385 92

In one embodiment, the present invention includes a method of installing an optic fiber in an optics package, wherein the tip of the fiber extends from a sleeve. In one step, a point of the fiber proximate its tip is affixed in a retaining member adjacent a device for communicating signals through the fiber. In a second step, a flexible member is disposed between the retaining member and the sleeve and in axial alignment with the fiber. In a third step, the optic fiber is positioned in the optics package after the step of affixing the fiber in place with the respect to the communicating device. In another embodiment, the present invention includes an optics assembly including an optic fiber having a tip extending from a sleeve and a device for communicating signals through the fiber. The assembly further includes a retaining member for affixing the fiber tip proximate the device for communicating signals through the fiber. Finally, the assembly includes a flexible member attached between the retaining member and the sleeve.

5509952, Apr 23, 1996

Jun 6, 1994

8/254438

Andrew J. Moore - Plano TX
David L. Ma - Plano TX
Robert L. Bontz - Plano TX
Harry B. Bonham - Plano TX

Alcatel Network Systems, Inc. - Richardson TX

C03B 2320

65406

In one embodiment, the present invention includes a method of increasing the attachment bond strength between a first and second object comprising respective first and second materials. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (FIG. 4). An attachment surface of the first material is configured to be nonplanar (FIG. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (FIG. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature whereby at least one of the materials is caused to flow in response to the heat. Finally, the first and second materials are brought to the operational temperature, wherein at least one of the first and second materials is placed in a compressive state at the contact point due to the relative change in size of at least one of the first and second materials as compared with the change in size of the other of the first and second materials. In a second and third embodiment, the present invention pertains to a method of sealing an end of a sleeve having an axial channel and a fiber extending through the axial channel and outward from the sleeve end.