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David W Pruitt619 Sherman St, Danville, IL 61832

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Known as:
W Jr David

David Pruitt Phones & Addresses

619 Sherman St, Danville, IL 61832 (217) 799-6107

2185 Rosswood Dr, San Jose, CA 95124 (408) 626-9913 (408) 626-9992

Indianola, IL

Westville, IL

Work

Company: Designr2 Address: 2185 Rosswood Dr, San Jose, CA 95124 Phones: (408) 626-9913 Position: Owner Industries: Business Services

Mentions for David W Pruitt

Career records & work history

Lawyers & Attorneys

David Pruitt Photo 1

David Pruitt - Lawyer

Specialties:
Bankruptcy & Debt, Civil Litigation, Complex Litigation, Business Litigation, Corporate Litigation, Commercial Law, Labor and Employment, Intellectual Property
ISLN:
918996693
Admitted:
2005
University:
University of Illinois, B.A.
Law School:
Chicago-Kent College of Law, Illinois Institute of Technology, J.D.
David Pruitt Photo 2

David Pruitt - Lawyer

Address:
600 1St Source Bank Center\N100 North Michigan
Phone:
(574) 237-1284 (Phone)
Work:
Barnes & Thornburg LLP, Associate
Specialties:
Appeals & Appellate, Business Law, Products Liability, Appeals, General Civil, Intellectual Property, Litigation, Nanotechnology
Jurisdiction:
Indiana
Law School:
University of Notre Dame Law School
Education:
University of Notre Dame, BA
University of Notre Dame Law School, JD
Memberships:
Indiana State Bar

Medicine Doctors

David E. Pruitt

Specialties:
Family Medicine
Work:
Virginia Physicians IncMidloathian Family Practice
3510 Anderson Hwy STE A, Powhatan, VA 23139
(804) 598-3100 (phone) (804) 598-2965 (fax)
Site
Education:
Medical School
Ross Univ, Sch of Med, Roseau, Dominica
Graduated: 1998
Procedures:
Allergen Immunotherapy, Arthrocentesis, Electrocardiogram (EKG or ECG), Vaccine Administration
Conditions:
Acute Bronchitis, Acute Pharyngitis, Acute Upper Respiratory Tract Infections, Chronic Sinusitis, Fractures, Dislocations, Derangement, and Sprains, Hypertension (HTN), Peripheral Nerve Disorders, Skin and Subcutaneous Infections, Abdominal Hernia, Abnormal Vaginal Bleeding, Acne, Acute Conjunctivitis, Acute Sinusitis, Allergic Rhinitis, Anxiety Dissociative and Somatoform Disorders, Anxiety Phobic Disorders, Atopic Dermatitis, Atrial Fibrillation and Atrial Flutter, Attention Deficit Disorder (ADD), Benign Prostatic Hypertrophy, Bipolar Disorder, Breast Disorders, Bronchial Asthma, Candidiasis, Candidiasis of Vulva and Vagina, Carpel Tunnel Syndrome, Cataract, Chronic Renal Disease, Constipation, Contact Dermatitis, Dermatitis, Diabetes Mellitus (DM), Disorders of Lipoid Metabolism, Epilepsy, Erectile Dysfunction (ED), Follicular Cyst of the Ovary, Gastroesophageal Reflux Disease (GERD), Gastrointestinal Hemorrhage, Genital HPV, Gingival and Periodontal Diseases, Gonorrhea, Gout, Hearing Loss, Heart Failure, Hemorrhoids, Herpes Genitalis, Herpes Simplex, Herpes Zoster, Hypothyroidism, Inflammatory Bowel Disease (IBD), Insomnia, Intervertebral Disc Degeneration, Iron Deficiency Anemia, Ischemic Heart Disease, Lateral Epicondylitis, Menopausal and Postmenopausal Disorders, Migraine Headache, Osteoarthritis, Osteoporosis, Otitis Media, Overweight and Obesity, Peptic Ulcer Disease, Phlebitis and Thrombophlebitis, Plantar Fascitis, Plantar Warts, Pneumonia, Poisoning by Drugs, Meds, or Biological Substances, Polycystic Ovarian Syndrome (PCOS), Premenstrual Syndrome (PMS), Prostatitis, Pulmonary Embolism, Restless Leg Syndrome, Rheumatoid Arthritis, Rosacea, Sexually Transmitted Diseases (STDs), Substance Abuse and/or Dependency, Tinea Pedis, Urinary Tract Infection (UT), Venous Embolism and Thrombosis, Vitamin D Deficiency
Languages:
English
Description:
Dr. Pruitt graduated from the Ross Univ, Sch of Med, Roseau, Dominica in 1998. He works in Powhatan, VA and specializes in Family Medicine. Dr. Pruitt is affiliated with Johnston-Willis Hospital.

David B. Pruitt

Specialties:
Child & Adolescent Psychiatry
Work:
University Of Maryland Psychiatry
701 W Pratt St STE 429, Baltimore, MD 21201
(410) 328-3522 (phone) (410) 328-8552 (fax)
Education:
Medical School
University of Texas Medical School at Houston
Graduated: 1974
Procedures:
Psychiatric Diagnosis or Evaluation, Psychiatric Therapeutic Procedures
Conditions:
Anxiety Phobic Disorders, Attention Deficit Disorder (ADD), Obsessive-Compulsive Disorder (OCD), Post Traumatic Stress Disorder (PTSD), Anxiety Dissociative and Somatoform Disorders, Autism, Bipolar Disorder, Depressive Disorders
Languages:
English, Spanish
Description:
Dr. Pruitt graduated from the University of Texas Medical School at Houston in 1974. He works in Baltimore, MD and specializes in Child & Adolescent Psychiatry. Dr. Pruitt is affiliated with University Of Maryland Medical Center.

David E. Pruitt

Specialties:
Radiation Oncology
Work:
Hot Springs Radiation Oncology
1455 Higdon Fry Rd STE C, Hot Springs National Park, AR 71913
(501) 622-2100 (phone) (501) 622-2214 (fax)
Education:
Medical School
University of Kansas School of Medicine
Graduated: 1988
Conditions:
Acute Bronchitis, Acute Sinusitis, Acute Upper Respiratory Tract Infections, Allergic Rhinitis, Diabetes Mellitus (DM), Disorders of Lipoid Metabolism, Hypertension (HTN), Hypothyroidism, Malignant Neoplasm of Female Breast, Melanoma, Skin and Subcutaneous Infections, Skin Cancer
Languages:
English
Description:
Dr. Pruitt graduated from the University of Kansas School of Medicine in 1988. He works in Hot Springs National Park, AR and specializes in Radiation Oncology. Dr. Pruitt is affiliated with CHI St Vincent Hospital Hot Springs.

David W. Pruitt

Specialties:
Pediatric Rehabilitation Medicine
Work:
Childrens Hospital Medical Center Pediatric Physical Rehabilitation
3333 Burnet Ave, Cincinnati, OH 45229
(513) 636-7480 (phone) (513) 636-7360 (fax)
Education:
Medical School
Loyola University Chicago Stritch School of Medicine
Graduated: 1998
Procedures:
Physical Therapy, Physical Therapy Evaluation, Neurological Testing
Languages:
English
Description:
Dr. Pruitt graduated from the Loyola University Chicago Stritch School of Medicine in 1998. He works in Cincinnati, OH and specializes in Pediatric Rehabilitation Medicine. Dr. Pruitt is affiliated with Cincinnati Childrens Hospital Medical Center.

Publications & IP owners

Us Patents

Multi-Lumen Medical Device

US Patent:
6458076, Oct 1, 2002
Filed:
Feb 1, 2000
Appl. No.:
09/495810
Inventors:
David L. Pruitt - Union City CA
Assignee:
5 Star Medical - San Jose CA
International Classification:
A61B 100
US Classification:
600146, 600139, 600128
Abstract:
A multi-lumen medical device such as an endoscope or a catheter includes a shaft and a distal tip which are formed as multi-lumen extrusions having a large central working channel and a plurality of surrounding auxiliary lumens. The auxiliary lumens are arranged around the central working channel in a uniform manner so that the flexibility of the extruded member is uniform in a plurality of different directions. Use of the multi-lumen extrusion for the medical device provides a balanced device with a flexibility which is substantially the same in all directions. The medical device may be provided with four way tip deflection by providing four pull wires within four of the auxiliary lumens.

Leadframe With Support Members

US Patent:
6703692, Mar 9, 2004
Filed:
Jan 31, 2002
Appl. No.:
10/066030
Inventors:
David A. Pruitt - San Jose CA
Assignee:
Linear Technology Corp. - Milpitas CA
International Classification:
H01L 23495
US Classification:
257666, 257667, 257670, 257676, 257787
Abstract:
A leadframe is disclosed. The leadframe comprises a frame characterized by a substantially rectangular outline, a die paddle with a receiving surface, and a plurality of support members that connect the frame to the die paddle. The leadframe further comprises a plurality of leads connected to the frame, that will eventually serve to electrically connect an integrated circuit mounted on the die paddle to an external electrical device. The die paddle lies in a lower horizontal plane. A plurality of support members connect the frame with the die paddle. As projected on to a vertical plane that is perpendicular to the side of the frame to which a support member is attached, the offset angle between the support member and a vertical axis is less than 45 degrees.

Flashless Lead Frame With Horizontal Singulation

US Patent:
7154165, Dec 26, 2006
Filed:
Jul 21, 2004
Appl. No.:
10/895095
Inventors:
David Pruitt - San Jose CA, US
Assignee:
Linear Technology Corporation - Milpitas CA
International Classification:
H01L 23/495
H01L 23/48
H01L 23/52
US Classification:
257670, 257666, 257669
Abstract:
A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus applies a downward force to the lead frame segments and translates the downward force to a horizontal force applied to the tie bars. The singulation process confines movement of the lead frame metal to within the plane of the lead frame.

Flashless Lead Frame With Horizontal Singulation

US Patent:
7414302, Aug 19, 2008
Filed:
Aug 8, 2006
Appl. No.:
11/500359
Inventors:
David Pruitt - San Jose CA, US
Assignee:
Linear Technology Corporation - Milpitas CA
International Classification:
H01L 23/495
H01L 23/48
US Classification:
257669, 257670, 257666, 257E23037
Abstract:
A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus applies a downward force to the lead frame segments and translates the downward force to a horizontal force applied to the tie bars. The singulation process confines movement of the lead frame metal to within the plane of the lead frame.

Semiconductor Device Having A Suspended Isolating Interconnect

US Patent:
7902665, Mar 8, 2011
Filed:
Sep 2, 2008
Appl. No.:
12/202835
Inventors:
David Alan Pruitt - San Jose CA, US
Assignee:
Linear Technology Corporation - Milpitas CA
International Classification:
H01L 23/34
US Classification:
257725, 257666, 257686, 257777, 257E23031, 257E23085
Abstract:
A semiconductor device is configured to provide current and voltage isolation inside an integrated circuit package. The semiconductor device includes first and second semiconductor dies, a first isolating block positioned on the first semiconductor die, and a second isolating block positioned on the second semiconductor die. The semiconductor device also includes a first interconnect coil having a plurality of wires connecting the first semiconductor die to the second isolating block, and a second interconnect coil having a plurality of wires connecting the second semiconductor die to the first isolating block.

Flexible Contactless Wire Bonding Structure And Methodology For Semiconductor Device

US Patent:
7960845, Jun 14, 2011
Filed:
Jan 3, 2008
Appl. No.:
12/003883
Inventors:
David Alan Pruitt - San Jose CA, US
Assignee:
Linear Technology Corporation - Milpitas CA
International Classification:
H01L 21/60
H01L 23/495
H01L 23/48
H01L 23/52
H01L 29/40
US Classification:
257784, 257401, 257691, 257779, 257735, 257672
Abstract:
A semiconductor device such as a field-effect transistor, improved to reduce device resistance, comprises a leadframe which includes a die paddle integral with a first set of leads and a second set of leads that is electrically isolated from the first set, a semiconductor die having its lower surface positioned on, and electrically connected to, the die paddle, and a conductive layer on the upper surface of the die. At least one electrically conductive wire, preferably plural wires, extend laterally across the second surface of the semiconductor die, are in electrical contact with the conductive layer, and interconnect corresponding second leads on opposite sides of the die. The plural wires may be welded to leads in succession by alternate ball and wedge bonds on each lead. The conductive layer may be an aluminized layer on which is formed a thin layer a solderable material, such as tin. A solder is deposited on the tin layer, enmeshing the wires.

Lead Plating Technique For Singulated Ic Packages

US Patent:
8076181, Dec 13, 2011
Filed:
Oct 22, 2010
Appl. No.:
12/910676
Inventors:
David A. Pruitt - San Jose CA, US
Lothar Maier - Pleasanton CA, US
Assignee:
Linear Technology Corporation - Milpitas CA
International Classification:
H01L 21/50
H01L 21/48
H01L 21/44
H01L 21/46
US Classification:
438111, 438106, 438123, 438124, 438127, 438458, 257E21499, 257E21502, 257E21503, 257E21506, 257E21511
Abstract:
A packaging technique is described for QFNs, DFN, and other surface mount packages that allows the sides of leads to be plated with a wettable metal prior to the lead frames being singulated from the lead frame sheet. The leads of the lead frames in the sheet are shorted together and to the body of the lead frame sheet by a sacrificial interconnect structure. Chips are mounted to the lead frames and encapsulated, leaving the bottoms of the leads exposed. The lead frame sheet is then sawed along boundaries of the lead frames but not sawed through the interconnect structure. The sawing exposes at least a portion of the sides of the leads. The leads are then electroplated while the leads are biased with a bias voltage via the interconnect structure. After the plating, the lead frame sheet is sawed completely thorough the interconnect structure to singulate the lead frames and prevent the interconnect structure from shorting the leads together.

Enhanced Pad Design For Solder Attach Devices

US Patent:
8163643, Apr 24, 2012
Filed:
May 4, 2010
Appl. No.:
12/773477
Inventors:
Maurice O. Othieno - Alameda CA, US
Ramaswamy Ranganathan - Saratoga CA, US
Frederick E. Beville - San Jose CA, US
David A. Pruitt - San Jose CA, US
William D. Griffitts - Santa Clara CA, US
Assignee:
Linear Technology Corporation - Milpitas CA
International Classification:
H01L 21/44
US Classification:
438612, 438106, 257678, 257E21499, 257E21506, 257E21509
Abstract:
A semiconductor device is disclosed that has a die and a substrate having a die attachment area with a perimeter. A layer of solder connects the substrate and the die, the solder layer having at least one vent channel connected to the perimeter of the die attachment area, wherein the maximum distance from any point in the solder layer to the nearest free surface of the solder at a vent channel or at the perimeter of the die is less than the distance from the center of the die to the nearest edge of the die.

Isbn (Books And Publications)

Your Adolescent

Author:
David Pruitt
ISBN #:
0060956763

Your Child: A Parent'S Guide To The Changes And Challenges Of Childhood

Author:
David Pruitt
ISBN #:
0062701584

Your Adolescent : Emotional, Behavioral And Cognitive Development From Early Adolescence Through Teen Years

Author:
David B. Pruitt
ISBN #:
0062701827

Your Child: Emotional, Behavioral, And Cognitive Development From Birth Through Preadolescence

Author:
David B. Pruitt
ISBN #:
0062737309

Possible Relatives

Cynthia J Pruitt  Damon L Pruitt  Deborah L Pruitt  Dan Pruitt  Daniel D Pruitt  Aaron Pruitt  Danny S Pruitt  David Last  David W Johnson  David Stamps 

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