David Arthur Ruben, Age 652164 E Norcroft St, Mesa, AZ 85213

David Ruben Phones & Addresses

2164 Norcroft St, Mesa, AZ 85213 (480) 969-8544 (602) 538-6411

Salt Lake City, UT

Mentions for David Arthur Ruben

Career records & work history

Lawyers & Attorneys

David Ruben Photo 1

David Ruben - Lawyer

Office:
Law Offices of David L. Ruben
Specialties:
Divorce, Child Custody, Criminal Law, Automobile Accidents and Injuries, Personal Injury, Consumer Bankruptcy, Criminal Law & Practice, Family & Juvenile Law, Negligence, Insurance & Worker's Compensation, DUI & DWI, Criminal Law & Practice, Solo & Small Firm Practice, Negligence, Insurance & Workers' Comp, Negligence
ISLN:
913493357
Admitted:
1991
University:
University of Maryland, B.A., 1988
Law School:
University of Baltimore, J.D., 1991
David Ruben Photo 2

David Ruben - Lawyer

Office:
Ruben & Sjolander
Specialties:
Product Liability, Lemon Law, Consumer Litigation, Commercial Litigation, Business Litigation, Real Estate Litigation, Appellate Practice
ISLN:
900616066
Admitted:
1991
University:
University of California, B.A., 1988
Law School:
Southwestern University, J.D., 1991

Medicine Doctors

David M. Ruben

Specialties:
General Surgery
Work:
Ruben Luke & Garcha Surgical Associates
5670 Peachtree Dunwoody Rd STE 920, Atlanta, GA 30342
(404) 847-0664 (phone) (404) 250-1694 (fax)
Ruben Luke & Garcha Surgical PC
3400 Old Milton Pkwy STE C440, Alpharetta, GA 30005
(678) 297-9707 (phone) (678) 297-9708 (fax)
Education:
Medical School
Medical College of Georgia School of Medicine
Graduated: 1980
Procedures:
Appendectomy, Breast Biopsy, Breast Reconstruction, Endoscopic Retrograde Cholangiopancreatography (ERCP), Hernia Repair, Laparoscopic Gallbladder Removal, Mastectomy, Proctosigmoidoscopy, Spleen Surgey, Upper Gastrointestinal Endoscopy, Gallbladder Removal, Laparoscopic Appendectomy, Pilonidal Cyst Excision, Small Bowel Resection, Thyroid Gland Removal
Conditions:
Abdominal Hernia, Appendicitis, Breast Disorders, Cholelethiasis or Cholecystitis, Inguinal Hernia, Intestinal Obstruction, Malignant Neoplasm of Female Breast, Ventral Hernia, Femoral Hernia, Gastric Cancer, Gastrointestinal Hemorrhage, Ischemic Bowel Disease, Malignant Neoplasm of Colon, Malignant Neoplasm of Esophagus, Melanoma, Rectal, Abdomen, Small Intestines, or Colon Cancer
Languages:
English
Description:
Dr. Ruben graduated from the Medical College of Georgia School of Medicine in 1980. He works in Alpharetta, GA and 1 other location and specializes in General Surgery. Dr. Ruben is affiliated with Northside Hospital.

David A. Ruben

Specialties:
Child & Adolescent Psychiatry, Psychiatry
Work:
Healthcare Southwest
2016 S 4 Ave, Tucson, AZ 85713
(520) 882-4252 (phone) (520) 792-2835 (fax)
Education:
Medical School
University of Arizona College of Medicine at Tucson
Graduated: 1974
Procedures:
Psychiatric Diagnosis or Evaluation, Psychiatric Therapeutic Procedures
Conditions:
Anxiety Dissociative and Somatoform Disorders, Anxiety Phobic Disorders, Attention Deficit Disorder (ADD), Bipolar Disorder, Depressive Disorders, Obsessive-Compulsive Disorder (OCD), Post Traumatic Stress Disorder (PTSD), Schizophrenia
Languages:
English, Spanish
Description:
Dr. Ruben graduated from the University of Arizona College of Medicine at Tucson in 1974. He works in Tucson, AZ and specializes in Child & Adolescent Psychiatry and Psychiatry. Dr. Ruben is affiliated with Canyon Vista Medical Center and Tucson Medical Center.
David Ruben Photo 3

DAVID M RUBEN

Specialties:
Surgery
Education:
Medical College of Georgia (1980)
David Ruben Photo 4

David Alan Ruben

Specialties:
Psychiatry
Child & Adolescent Psychiatry
Pain Medicine
Education:
University of Arizona (1974)

David Ruben resumes & CV records

Resumes

David Ruben Photo 36

Senior Distinguished Engineer, Technical Fellow, Bakken Fellow

Location:
Phoenix, AZ
Industry:
Medical Devices
Work:
Medtronic
Senior Distinguished Engineer, Technical Fellow, Bakken Fellow
Education:
University of Utah
Skills:
Failure Analysis, Design of Experiments, R&D, Design For Manufacturing, Spc, Semiconductors, Fmea, Engineering Management, Manufacturing, Medical Devices, Process Simulation, Cross Functional Team Leadership, Ic, Reliability, Design Control, Quality System, Six Sigma, Reliability Engineering, Product Development, Iso 13485, Process Engineering, Biomedical Engineering, Analog, Failure Mode and Effects Analysis, Statistical Process Control, Research and Development
David Ruben Photo 37

David Ruben

David Ruben Photo 38

David Ruben

David Ruben Photo 39

David Ruben

Location:
United States

Publications & IP owners

Us Patents

Apparatus And Method For Laser Welding Of Ribbons

US Patent:
6501043, Dec 31, 2002
Filed:
Oct 16, 2000
Appl. No.:
09/688427
Inventors:
David A. Ruben - Mesa AZ
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
B23K 2620
US Classification:
21912164, 21912163
Abstract:
A method and apparatus for laser welding a section of a ribbon to a substrate or substrate pad uses a laser beam that passes through an aperture in a bond head. The laser beam may be supplied to the bond head using an optic fiber. This method is useful for bonding conductive ribbons in microelectronic circuits.

Apparatus And Method For Laser Welding Of Ribbons

US Patent:
6717100, Apr 6, 2004
Filed:
Oct 25, 2002
Appl. No.:
10/280965
Inventors:
David A. Ruben - Mesa AZ
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
B23K 2620
US Classification:
21912164, 21912163
Abstract:
An apparatus and method are provided for using laser energy in an automated bonding machine to effect laser welding of ribbons and other connectors, particularly conductive ribbons in microelectronic circuits. The apparatus and method allow bonding and connection of microelectronic circuits with discrete heating avoiding heat damage to peripheral microelectronic components. The apparatus and method also allow bonding of flexible materials and low-resistance materials, and are less dependant on substrate and terminal stability in comparison to existing bonding methods. The bonding method leads to decreased apparatus wear in comparison to existing bonding methods.

Freeform Substrates And Devices

US Patent:
6787891, Sep 7, 2004
Filed:
Dec 6, 2000
Appl. No.:
09/731121
Inventors:
David A. Ruben - Mesa AZ
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
H01L 2306
US Classification:
257684, 257723, 257724
Abstract:
An implantable medical device substrate is free form cut to the shape of the interior of the device. The free form shape allows more efficient use of not only the interior space of the device but also of the substrate itself. Integrated circuit components are formed to fit the shape of the substrate, freeing areas in the device for additional components, or allowing the device to be made smaller through a maximized use of the available space-volume.

Implantable Medical Device Including A Surface-Mount Terminal Array

US Patent:
6963780, Nov 8, 2005
Filed:
Jan 31, 2002
Appl. No.:
10/061718
Inventors:
David A. Ruben - Mesa AZ, US
Andrew J. Ries - Lino Lakes MN, US
Juan G. Milla - Mesa AZ, US
Randy S. Roles - Crystal MN, US
Terry W. Bruneau - Anoka MN, US
Steve Craig Warren - Phoenix AZ, US
David W. Parkin - Phoenix AZ, US
John K. Day - Chandler AZ, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
A61N001/375
US Classification:
607 36, 607 37, 607 9, 607 4, 607 2, 439626, 429709, 4297331
Abstract:
An implantable medical device comprises an enclosure, a first plurality of electrical contacts disposed within the enclosure, at least a first electrical component secured within the enclosure, a second plurality of electrical contacts on the first electrical component, and a terminal array for providing electrical coupling between the first and second plurality of electrical contacts. The terminal array comprises a housing having a plurality of apertures therethrough, the housing having a first side and a second opposite side. Each of a plurality of conductive terminals is positioned within one of the plurality of apertures and has a first contact region proximate the first side of the housing and a second contact region proximate the second side of the housing. The first contact region is electrically coupled to one of the first plurality of electrical contacts, and the second contact region is electrically coupled to one of the second plurality of contacts.

Assembly Including A Circuit And An Encapsulation Frame, And Method Of Making The Same

US Patent:
7288847, Oct 30, 2007
Filed:
Jan 25, 2005
Appl. No.:
11/042740
Inventors:
David A. Ruben - Mesa AZ, US
Scott B. Sleeper - Phoenix AZ, US
Peter C. Tortorici - Chandler AZ, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
H01L 23/29
US Classification:
257791, 257666, 257676, 257774, 257E23092, 257E23066
Abstract:
An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.

Freeform Substrates And Devices

US Patent:
7335530, Feb 26, 2008
Filed:
Jul 29, 2004
Appl. No.:
10/902539
Inventors:
David A. Ruben - Mesa AZ, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
H01L 21/00
US Classification:
438106, 438127, 438460, 438463, 257E21001
Abstract:
An implantable medical device substrate is free form cut to the shape of the interior of the device. The free form shape allows more efficient use of not only the interior space of the device but also of the substrate itself. Integrated circuit components are formed to fit the shape of the substrate, freeing areas in the device for additional components, or allowing the device to be made smaller through a maximized use of the available space-volume.

Pressure Sensor Configurations For Implantable Medical Electrical Leads

US Patent:
7591185, Sep 22, 2009
Filed:
Apr 23, 2008
Appl. No.:
12/108212
Inventors:
Kamal Deep Mothilal - Plymouth MN, US
Michael A. Schugt - St. Paul MN, US
David A. Ruben - Mesa AZ, US
Jonathan P. Roberts - Coon Rapids MN, US
Clark B. Norgaard - Phoenix AZ, US
Lary R. Larson - Gold Canyon AZ, US
Assignee:
Medtronic, inc. - Minneapolis MN
International Classification:
G01L 9/12
A61N 1/00
US Classification:
73718, 600486, 607 17
Abstract:
An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.

Encapsulation Circuitry On A Substrate

US Patent:
7682878, Mar 23, 2010
Filed:
Oct 23, 2007
Appl. No.:
11/877408
Inventors:
David A. Ruben - Mesa AZ, US
Scott B. Sleeper - Phoenix AZ, US
Peter C. Tortorici - Chandler AZ, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
H01L 21/44
US Classification:
438124, 438112, 438123, 438127, 257666, 257676, 257774, 257791, 257E23066, 257E23092
Abstract:
An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.

Isbn (Books And Publications)

Marxism And Materialism

Author:
David Ruben
ISBN #:
0391009664

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