David A Sawoska, Age 73216 Asbury St, Houston, TX 77007
David Sawoska Phones & Addresses
216 Asbury St, Houston, TX 77007 (281) 516-2726
22 Kent Ter, Watertown, CT 06795 (860) 274-3022
The Woodlands, TX
Waterbury, CT
Mentions for David A Sawoska
Publications & IP owners
Us Patents
Method For Enhancing The Solderability Of A Surface
US Patent:
6444109, Sep 3, 2002
Filed:
Oct 26, 2000
Appl. No.:
09/698370
Inventors:
Ronald Redline - Prospect CT, 06712
David Sawoska - Watertown CT
Peter Kukanskis - Woodbury CT
David Sawoska - Watertown CT
Peter Kukanskis - Woodbury CT
International Classification:
C25D 554
US Classification:
205 85, 106 123, 427 98, 427125
Abstract:
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, ampihateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
Method For Enhancing The Solderability Of A Surface
US Patent:
6544397, Apr 8, 2003
Filed:
Mar 29, 2001
Appl. No.:
09/821205
Inventors:
Ronald Redline - Prospect CT, 06712
David Sawoska - Watertown CT, 06795
Peter Kukanskis - Woodbury CT, 06798
David Sawoska - Watertown CT, 06795
Peter Kukanskis - Woodbury CT, 06798
International Classification:
C25D 554
US Classification:
205 85, 205263, 106 123, 427 98, 427125
Abstract:
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
Method For The Manufacture Of Printed Circuit Boards With Plated Resistors
US Patent:
6585904, Jul 1, 2003
Filed:
Feb 15, 2001
Appl. No.:
09/784242
Inventors:
Peter Kukanskis - Woodbury CT, 06798
Dennis Fritz - Brookville IN, 47012
Frank Durso - Cheshire CT, 06410
Steven Castaldi - Torrington CT, 06790
David Sawoska - Watertown CT, 06795
Dennis Fritz - Brookville IN, 47012
Frank Durso - Cheshire CT, 06410
Steven Castaldi - Torrington CT, 06790
David Sawoska - Watertown CT, 06795
International Classification:
H01B 1300
US Classification:
216 13, 216 67, 216 65, 216 74, 216 75, 21912169, 438382, 257690, 174250
Abstract:
A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
Method For The Manufacture Of Printed Circuit Boards With Integral Plated Resistors
US Patent:
6767445, Jul 27, 2004
Filed:
Oct 16, 2002
Appl. No.:
10/271817
Inventors:
Peter Kukanskis - Woodbury CT, 06798
Frank Durso - Cheshire CT, 06410
David Sawoska - Watertown CT, 06795
Frank Durso - Cheshire CT, 06410
David Sawoska - Watertown CT, 06795
International Classification:
H05K 100
US Classification:
205125, 205126, 205196, 205205, 205208, 205220, 427 98, 427259, 427282, 427304, 427305, 427404, 4274431, 438382
Abstract:
The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.
Method For Enhancing The Solderability Of A Surface
US Patent:
6905587, Jun 14, 2005
Filed:
Jan 14, 2003
Appl. No.:
10/341859
Inventors:
Ronald Redline - Prospect CT, US
David Sawoska - Watertown CT, US
Peter Kukanskis - Woodbury CT, US
David Sawoska - Watertown CT, US
Peter Kukanskis - Woodbury CT, US
International Classification:
C23C018/54
C25D005/48
C25D005/48
US Classification:
205 85, 205196, 205220, 228209, 427 98, 427125, 427343, 427437
Abstract:
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
Method For The Manufacture Of Printed Circuit Boards With Plated Resistors
US Patent:
7034231, Apr 25, 2006
Filed:
Apr 21, 2003
Appl. No.:
10/419651
Inventors:
Peter Kukanskis - Woodbury CT, US
Dennis Fritz - Brookville IN, US
Frank Durso - Cheshire CT, US
Steven Castaldi - Torrington CT, US
David Sawoska - Watertown CT, US
Dennis Fritz - Brookville IN, US
Frank Durso - Cheshire CT, US
Steven Castaldi - Torrington CT, US
David Sawoska - Watertown CT, US
International Classification:
H05K 1/16
US Classification:
174260, 174256, 174258, 361751, 361761, 361762, 361765, 361766, 361777, 361779, 213 13
Abstract:
A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
Method For The Manufacture Of Printed Circuit Boards With Plated Resistors
US Patent:
7279108, Oct 9, 2007
Filed:
Feb 6, 2006
Appl. No.:
11/348941
Inventors:
Peter Kukanskis - Woodbury CT, US
Dennis Fritz - Brookville IN, US
Frank Durso - Cheshire CT, US
Steven Castaldi - Torrington CT, US
David Sawoska - Watertown CT, US
Dennis Fritz - Brookville IN, US
Frank Durso - Cheshire CT, US
Steven Castaldi - Torrington CT, US
David Sawoska - Watertown CT, US
International Classification:
H01B 13/00
H01L 23/48
H01L 23/48
US Classification:
216 13, 216 41, 216 65, 216 67, 216 74, 216 75, 174250, 438382, 438689, 21912167
Abstract:
A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
Method For Enhancing The Solderability Of A Surface
US Patent:
7267259, Sep 11, 2007
Filed:
Jun 6, 2003
Appl. No.:
10/456329
Inventors:
Ronald Redline - Prospect CT, US
David Sawoska - Watertown CT, US
Peter Kukanskis - Woodbury CT, US
David Sawoska - Watertown CT, US
Peter Kukanskis - Woodbury CT, US
International Classification:
C23C 18/54
C25D 5/48
B05D 5/12
C25D 5/48
B05D 5/12
US Classification:
228209, 205 85, 205263, 427125
Abstract:
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
Public records
Vehicle Records
David Sawoska
Address:
106 E Crystal Cyn Cir, Spring, TX 77389
Phone:
(281) 516-2726
VIN:
WBAWL735X9P181658
Make:
BMW
Model:
3 SERIES
Year:
2009
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