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David A Strawser, Age 70PO Box 3212, Marion, IN 46953

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Known as:
David Alan Strawser
Related to:
Angela Byers Jon Strawser 81

David Strawser Phones & Addresses

558 S 1000 E, Marion, IN 46953 (765) 998-7049

82 Bobby Ave, Marion, IN 46953 (765) 674-1935

Palos Hills, IL

Palatine, IL

Chicago, IL

Prospect Heights, IL

82 E Bobby Ave, Marion, IN 46953

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Work

Position: Personal Care and Service Occupations

Education

Degree: Associate degree or higher

Mentions for David A Strawser

David Strawser resumes & CV records

Resumes

David Strawser Photo 33

David Strawser

Skills:
Microsoft Office, Management, Microsoft Excel
David Strawser Photo 34

David Strawser

David Strawser Photo 35

David Strawser

David Strawser Photo 36

David Strawser

David Strawser Photo 37

David Strawser

Location:
United States

Publications & IP owners

Us Patents

Methods For Removing Acrylic-Based Polymer Coatings

US Patent:
5609693, Mar 11, 1997
Filed:
Nov 17, 1993
Appl. No.:
8/154871
Inventors:
John F. Dobrez - Flossmoor IL
David A. Strawser - Palatine IL
Assignee:
Dober Chemical Corp. - Midlothian IL
International Classification:
B08B 308
C23G 102
US Classification:
134 38
Abstract:
Methods useful for removing an acrylic-based polymeric material located on a surface, for example, a surface of a piece of process equipment. The method includes contacting an acrylic-based polymeric material located on the surface of a piece of equipment with a composition containing at least about 20% by weight of water and an organic component containing at least one alkylene oxide group, preferably a plurality of alkylene oxide groups, per molecule in an amount effective to solubilize at least a portion of the acrylic-based polymeric material.

Conductive Metallization Of Substrates Via Developing Agents

US Patent:
4997674, Mar 5, 1991
Filed:
Jun 6, 1988
Appl. No.:
7/204068
Inventors:
William J. E. Parr - Naperville IL
Ronald E. Hutton - Faversham, GB2
Dieter Frank - Naperville IL
David A. Strawser - Prospect Heights IL
Assignee:
Akzo America Inc. - New York NY
International Classification:
C23C 2400
US Classification:
427123
Abstract:
A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.

Possible Relatives

Jamie C Strawser  Jan M Strawser  Jeffrey W Strawser  Laura E Strawser  Melissa S Strawser  Michael B Strawser  Michelle D Strawser  David J Last  David K Stancil  David J Stancombe 

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