David A Verdon, Age 54Redlands, CA

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Redlands, CA

Vance, AL

15905 Descansa Ct, Morgan Hill, CA 95037

2977 Walgrove Way, San Jose, CA 95128

Sunnyvale, CA

Santa Clara, CA

Santa Barbara, CA

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David A Verdon

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Position: Professional/Technical

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Degree: Associate degree or higher

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Roger Knight

Roger David Verdon Knight OBE, MA, BA, DipEd (born 6 September 1946) is an English administrator, cricketer and schoolmaster. He was awarded the OBE in ...

Us Patents

Conductive Via Feed Through For Double-Sided Modules

US Patent:
6288909, Sep 11, 2001
Filed:
May 12, 1999
Appl. No.:
9/310657
Inventors:
Eric Franklyn Richardson - Sunnyvale CA
David Andrew Verdon - San Jose CA
Brett Armstrong Kelley - Redwood City CA
Assignee:
Stellex Microwave Systems, Inc. - Palo Alto CA
International Classification:
H05K 714
US Classification:
361796
Abstract:
A double-sided module is provided having electrical substrates on either side of a panel housing which are interconnected by a wire connection from one substrate to a conductor-filled through-channel, or via, in the other substrate. The distances from the bonding point on one substrate to the bond vias have to have predetermined ratios of heights to center-to-center distances to avoid failure under ultra high acceleration. A ratio of under 20 to 1 is required to avoid failure under 5,000 gravities of acceleration for a 0. 0008 inch diameter wire and under 8. 3 to 1 for a 0. 002 inch diameter wire.

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