David J Womac, Age 593755 King Williams Ct, Saint Charles, IL 60174

6373133, Apr 16, 2002

Jul 13, 1999

09/353467

Giulio DiGiacomo - Hopewell Junction NY
David L. Edwards - Poughkeepsie NY
Larry D. Gross - Los Gatos CA
Sushumna Iruvanti - Wappingers Falls NY
Raed A. Sherif - Croton-on Hudson NY
Subhash L. Shinde - Cortlandt Manor NY
David J. Womac - Lagrangeville NY
David B. Goland - Croton-on Hudson NY
Lester W. Herron - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

H01L 2334

257713, 257723

A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.

2002001, Feb 14, 2002

Jan 12, 2001

09/758320

Giulio Giacomo - Hopewell Junction NY, US
Stephen Drofitz - Wappingers Falls NY, US
David Edwards - Poughkeepsie NY, US
Sushumna Iruvanti - Wappingers Falls NY, US
David Womac - Lagrangeville NY, US

H01L021/44
H01L021/48
H01L021/50
H01L023/34
H01L023/48
H01L023/52
H01L029/40

257/712000, 257/782000, 438/122000, 438/612000

A method and structure for thermally connecting a thermal conductor to at least one chip, the thermal conductor including a lower surface and at least one piston extending from the lower surface corresponding to each of the chips, each of the chips having an upper surface opposing each of the pistons, the chips being mounted on a substrate, the method comprising steps of metalizing the lower surface of the thermal conductor and the pistons, applying a solder to the lower surface of the thermal conductor, applying a thermal paste between the upper surface of the chips and the pistons, positioning the substrate and the thermal conductor such that the substrate is aligned with the thermal conductor, biasing the thermal conductor toward the substrate, biasing the pistons toward the chips such that the thermal paste has a consistent thickness between each of the chips and the pistons, reflowing the solder, such that the solder bonds the substrate to the thermal conductor and the pistons form a metallurgical bond with the thermal conductor, wherein after the reflowing step, the pistons and the thermal conductor form a unitary structure for maintaining the consistent thickness of the thermal paste between each of the chips and the pistons which achieves a considerably thinner thermal paste layer and greater thermal conduction.

6214647, Apr 10, 2001

Sep 23, 1998

9/159239

Giulio Di Giacomo - Hopewell Junction NY
Stephen S. Drofitz - Wappingers Falls NY
David L. Edwards - Poughkeepsie NY
Sushumna Iruvanti - Wappingers Falls NY
David J. Womac - Lagrangeville NY

International Business Machines Corporation - Armonk NY

H01L 2144
H01L 2148
H01L 2150

438122

A method and structure for thermally connecting a thermal conductor to at least one chip, the thermal conductor including a lower surface and at least one piston extending from the lower surface corresponding to each of the chips, each of the chips having an upper surface opposing each of the pistons, the chips being mounted on a substrate, the method comprising steps of metalizing the lower surface of the thermal conductor and the pistons, applying a solder to the lower surface of the thermal conductor, applying a thermal paste between the upper surface of the chips and the pistons, positioning the substrate and the thermal conductor such that the substrate is aligned with the thermal conductor, biasing the thermal conductor toward the substrate, biasing the pistons toward the chips such that the thermal paste has a consistent thickness between each of the chips and the pistons, reflowing the solder, such that the solder bonds the substrate to the thermal conductor and the pistons form a metallurgical bond with the thermal conductor, wherein after the reflowing step, the pistons and the thermal conductor form a unitary structure for maintaining the consistent thickness of the thermal paste between each of the chips and the pistons which achieves a considerably thinner thermal paste layer and greater thermal conduction.

5981310, Nov 9, 1999

Jan 22, 1998

9/012071

Giulio DiGiacomo - Hopewell Junction NY
Stephen S. Drofitz - Wappingers Falls NY
David L. Edwards - Poughkeepsie NY
Larry D. Gross - Los Gatos CA
Sushumna Iruvanti - Wappingers Falls NY
Raed A. Sherif - Croton-on Hudson NY
Subhash L. Shinde - Cortlandt Manor NY
David J. Womac - Lagrangeville NY
David B. Goland - Croton-on Hudson NY
Lester W. Herron - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

H01L 2144
H01L 2148
H01L 2150

438106

A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.

6085831, Jul 11, 2000

Mar 3, 1999

9/261345

Giulio DiGiacomo - Hopewell Junction NY
Sushumna Iruvanti - Wappingers Falls NY
David J. Womac - Avon CT

International Business Machines Corporation - Armonk NY

F28D 1500

16510433

An apparatus for and method of cooling an electronic module comprising a heat sink enclosure placed directly over a chip or substrate in a flip chip package. The heat sink enclosure has a plurality of cooling fins extending from within the cavity of the enclosure. A liquid sealed inside the enclosure is trapped within a thermal transfer means, preferably a metal wick, which sits directly on a chip or substrate. As the chip or substrate heats up, heat is transferred to the thermal transfer means which in turn heats the liquid to its heat of vaporization. The vapors of the liquid rise and condense on the cooling fins and the heat is absorbed by the enclosure and conducted to an outside surface of the enclosure and dissipated. Cooling fins on an exterior surface of the enclosure further reduces the thermal resistance to enhance cooling.

2018030, Oct 25, 2018

Jun 29, 2018

16/024101

- Naperville IL, US
David J. Womac - Saint Charles IL, US

F04D 27/00
F04D 25/16

A system, apparatus, and procedure for controlling a fan module. The system comprises a chassis having a backplane, at least one fan module arranged in the chassis, and a profile switch. In one embodiment, the profile switch is arranged in the chassis. Each fan module includes at least one fan and a fan module controller arranged to receive a control signal from a shelf controller. The profile switch is arranged to signal the fan module controller so as to control the at least one fan based on operating profiles corresponding to selected switch positions of the switch.

2014025, Sep 11, 2014

Mar 8, 2013

13/791389

- Naperville IL, US
David J. Womac - Saint Charles IL, US

F04D 27/00

415 1, 415 15

A system, apparatus, and procedure for controlling a fan module. The system comprises a chassis having a backplane, at least one fan module arranged in the chassis, and a profile switch. In one embodiment, the profile switch is arranged in the chassis. Each fan module includes at least one fan and a fan module controller arranged to receive a control signal from a shelf controller. The profile switch is arranged to signal the fan module controller so as to control the at least one fan based on operating profiles corresponding to selected switch positions of the switch.

2008023, Sep 25, 2008

Feb 22, 2008

12/036029

David J. Womac - St. Charles IL, US
Kimon Papakos - Chicago IL, US
Scott A. Blakemore - Warrenville IL, US

TELLABS OPERATIONS, INC. - Naperville IL

H05K 5/02

454184

An apparatus, system, and method are provided for venting an enclosure, such as a chassis housing electronic equipment. The method includes receiving, at least one air directing surface, airflow moving in a first direction, the at least one air directing surface being disposed externally from the chassis at a predetermined placement relative to the at least one ventilation surface in a path of the airflow. The at least one air directing surface has a configuration to alter the direction of the airflow between the air directing surface and the at least one ventilation surface. The method also includes redirecting the airflow between the at least one air directing surface and the at least one ventilation surface to at least a second direction using the air directing surface. The predetermined placement and configuration of the at least one air directing surface determine the second direction in which the airflow is discharged, and the second direction is either towards or away from the at least one ventilation surface. Also in the receiving, the airflow is received at least one air directing surface of a bracket configured to attach the chassis to a mounting structure.