David S Xu, Age 33Naperville, IL

David Xu Phones & Addresses

Naperville, IL

Chicago, IL

Phoenix, AZ

Bethesda, MD

Evanston, IL

Work

Company: Collaloraction - Chicago, IL Oct 2010 Position: Marketing intern

Education

School / High School: Northwestern Center Feinberg School of Medicine 2011

Skills

Matlab • Excel VBA • C++ • Knowledge of Market and Credit Risk Management

Languages

English

Mentions for David S Xu

Professional Records

Medicine Doctors

David Xu Photo 1

Dr. David Xu, Phoenix AZ - MD (Doctor of Medicine)

Specialties:
Neurosurgery
Address:
350 W Thomas Rd Suite 720, Phoenix, AZ 85013
(602) 406-3000 (Phone) (602) 406-4149 (Fax)
Languages:
English
Education:
Medical School
Northwestern Center Feinberg School of Medicine
Graduated: 2011
David Xu Photo 2

David Xu

Specialties:
Neurological Surgery

Resumes

Resumes

David Xu Photo 3

David Xu - Chicago, IL

Work:
Collaloraction - Chicago, IL Oct 2010 to Apr 2011
Marketing Intern
Haitong Secrities Jun 2010 to Aug 2010
Summer Intern, Investment Banking Department
Zhongnan Branch - Wuhan, China Nov 2009 to Dec 2009
Full-time Manager Assistant
Education:
STUART SCHOOL OF BUSINESS, IIT - Chicago, IL Jan 2010 to Jan 2012
Master of Science in Finance
WUHAN UNIVERSITY Sep 2006 to Jul 2010
Bachelor in Economics
Skills:
Matlab, Excel VBA, C++, Knowledge of Market and Credit Risk Management

Business Records

Name / TitleCompany / ClassificationPhones & Addresses
David Xu
President
Prostar Painting & Restoration Ltd
Prostar Renovation & Painting. Hotel Renovations by Prostar (a Division of Prostar)
Painters. Pressure Washing. Paper Hangers
310 Victoria Dr, Vancouver, BC V5L 4C7
(604) 876-3305, (604) 876-1927
David Xu
President
Prostar Painting & Restoration Ltd (604) 876-3305, (604) 876-1927

Publications

Us Patents

Forming Die Backside Coating Structures With Coreless Packages

US Patent:
2013025, Sep 26, 2013
Filed:
May 16, 2013
Appl. No.:
13/895546
Inventors:
Rahul N. Manepalli - Chandler AZ,
Mohit Mamodia - Chandler AZ,
David Xu - Chandler AZ,
Javier Soto Gonzalez - Chandler AZ,
Edward R. Prack - Phoenix AZ,
International Classification:
H01L 25/00
US Classification:
438107
Abstract:
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.

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