David S Xu, Age 32Naperville, IL

Mentions for David S Xu

Professional Records

Medicine Doctors

Dr. David Xu, Phoenix AZ - MD (Doctor of Medicine)

Specialties:

Neurosurgery

Address:

350 W Thomas Rd Suite 720, Phoenix, AZ 85013
(602) 406-3000 (Phone) (602) 406-4149 (Fax)

Languages:

English

Education:

Medical School
Northwestern Center Feinberg School of Medicine
Graduated: 2011

David Xu

Specialties:

Neurological Surgery

Resumes

Resumes

David Xu - Chicago, IL

Work:

Collaloraction - Chicago, IL Oct 2010 to Apr 2011
Marketing Intern Haitong Secrities Jun 2010 to Aug 2010
Summer Intern, Investment Banking Department Zhongnan Branch - Wuhan, China Nov 2009 to Dec 2009
Full-time Manager Assistant

Education:

STUART SCHOOL OF BUSINESS, IIT - Chicago, IL Jan 2010 to Jan 2012
Master of Science in Finance WUHAN UNIVERSITY Sep 2006 to Jul 2010
Bachelor in Economics

Skills:

Matlab, Excel VBA, C++, Knowledge of Market and Credit Risk Management

Business Records

Name / Title	Company / Classification	Phones & Addresses
David Xu President	Prostar Painting & Restoration Ltd Prostar Renovation & Painting. Hotel Renovations by Prostar (a Division of Prostar) Painters. Pressure Washing. Paper Hangers	310 Victoria Dr, Vancouver, BC V5L 4C7 (604) 876-3305, (604) 876-1927
David Xu President	Prostar Painting & Restoration Ltd	(604) 876-3305, (604) 876-1927

Publications

Us Patents

Forming Die Backside Coating Structures With Coreless Packages

US Patent:

2013025, Sep 26, 2013

Filed:

May 16, 2013

Appl. No.:

13/895546

Inventors:

Rahul N. Manepalli - Chandler AZ,
Mohit Mamodia - Chandler AZ,
David Xu - Chandler AZ,
Javier Soto Gonzalez - Chandler AZ,
Edward R. Prack - Phoenix AZ,

International Classification:

H01L 25/00

US Classification:

438107

Abstract:

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.

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