Deborah I Sylvester, Age 6315518 Easton Gate Ln, Houston, TX 77044

Deborah Sylvester Phones & Addresses

Houston, TX

South Amboy, NJ

Rego Park, NY

Jamaica, NY

Brooklyn, NY

Mentions for Deborah I Sylvester

Career records & work history

License Records

Deborah J Sylvester

Licenses:
License #: 069464-21 - Active
Category: Nursing
Type: Registered Nurse

Deborah J Sylvester

Licenses:
License #: 069464-23 - Active
Category: Nursing
Type: APRN-NP-Family

Deborah Sylvester resumes & CV records

Resumes

Deborah Sylvester Photo 37

Deborah Sylvester

Deborah Sylvester Photo 38

Deborah Sylvester

Deborah Sylvester Photo 39

Deborah Sylvester

Deborah Sylvester Photo 40

Deborah Sylvester

Deborah Sylvester Photo 41

Hospital Contract Manager At Healthfirst

Position:
Hospital Contract Manager at Healthfirst
Location:
Greater New York City Area
Industry:
Hospital & Health Care
Work:
Healthfirst since Jun 2012
Hospital Contract Manager
Health Plus PHSP May 2003 - Apr 2012
Account Manager
Care Plus / Amerigroup Jan 2000 - May 2003
Provider Relations Representative
Education:
CUNY Medgar Evers College
Skills:
Managed Care, Provider Relations, Healthcare Management, Hospital Contracting, Hospital Reimbursement, Network Management, Medicaid Managed Care, Medicare, Health Insurance, Medicaid, Healthcare Information Technology
Deborah Sylvester Photo 42

Deborah Sylvester

Location:
United States
Deborah Sylvester Photo 43

Assistant At Re/Max Right Choice

Location:
Greater New York City Area
Industry:
Real Estate
Deborah Sylvester Photo 44

Deborah Sylvester

Location:
United States

Publications & IP owners

Us Patents

Apparatus And Methods For Cooling Semiconductor Integrated Circuit Package Structures

US Patent:
7394659, Jul 1, 2008
Filed:
Nov 19, 2004
Appl. No.:
10/991987
Inventors:
Evan George Colgan - Chestnut Ridge NY, US
Gary Goth - Pleasant Valley NY, US
Deborah Anne Sylvester - Poughkeepsie NY, US
Jeffrey Allen Zitz - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 7/20
H01L 23/367
US Classification:
361718, 361717, 361719, 257706, 257707, 257713
Abstract:
The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e. g. , copper thermal hat or lid) using a compliant thermally conductive material (e. g. , thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.

Apparatus And Methods For Cooling Semiconductor Integrated Circuit Package Structures

US Patent:
7803664, Sep 28, 2010
Filed:
May 5, 2008
Appl. No.:
12/115332
Inventors:
Evan George Colgan - Chestnut Ridge NY, US
Gary Goth - Pleasant Valley NY, US
Deborah Anne Sylvester - Poughkeepsie NY, US
Jeffrey Allen Zitz - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 21/00
H01L 23/34
H01L 23/367
US Classification:
438122, 438118, 257712, 257E23104
Abstract:
The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e. g. , copper thermal hat or lid) using a compliant thermally conductive material (e. g. , thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.

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