Edward Calvin resumes & CV records
Resumes
Sous Chef
Location:
Saint Louis, MO
Work:
Chopped
Sous Chef
Sous Chef
Edward L Calvin, Age 612233 Indiana Ave, Saint Louis, MO 63104
Edward Calvin Phones & Addresses
2220 Indiana Ave, Saint Louis, MO 63104 (314) 664-1134 (314) 664-5685
2233 Indiana Ave, Saint Louis, MO 63104 (314) 664-1134 (314) 664-5685 (314) 925-8025
4123 Shaw Ave, Saint Louis, MO 63110 (314) 664-5685 (314) 762-0422
Wildwood, MO
Pacific, MO
Cape Girardeau, MO
3120 Independence St #36, Cpe Girardeau, MO 63703
Work
Position:
Executive, Administrative, and Managerial Occupations
Education
Degree:
High school graduate or higher
Mentions for Edward L Calvin
Publications & IP owners
Wikipedia
Edward Calvin Kendall
Edward Calvin Kendall (March 8, 1886, South Norwalk, Connecticut May 4, 1972, Princeton, New Jersey) was an American chemist. In 1950, Kendall was ...
Us Patents
Methods For Producing Diamond Grits For A Wafer Slicing System
US Patent:
2018011, May 3, 2018
Filed:
Dec 29, 2017
Appl. No.:
15/857831
Inventors:
- Kowloon, HK
Larry Shive - St. Charles MO, US
Rituraj Nandan - O'Fallon MO, US
Dale A. Witte - Wentzville MO, US
Edward Calvin - Grafton IL, US
Larry Shive - St. Charles MO, US
Rituraj Nandan - O'Fallon MO, US
Dale A. Witte - Wentzville MO, US
Edward Calvin - Grafton IL, US
International Classification:
B23D 65/00
B23D 61/18
B28D 5/04
B23D 61/18
B28D 5/04
Abstract:
A method for producing diamond grits for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated. The intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution.
Systems And Methods For Manufacturing Diamond Coated Wires
US Patent:
2016018, Jun 30, 2016
Filed:
Dec 30, 2015
Appl. No.:
14/983954
Inventors:
- Maryland Heights MO, US
Larry Wayne Shive - St. Charles MO, US
Rituraj Nandan - O'Fallon MO, US
Dale A. Witte - Wentzville MO, US
Edward Calvin - Grafton IL, US
Larry Wayne Shive - St. Charles MO, US
Rituraj Nandan - O'Fallon MO, US
Dale A. Witte - Wentzville MO, US
Edward Calvin - Grafton IL, US
International Classification:
B23D 65/00
B28D 5/04
B23D 61/18
B28D 5/04
B23D 61/18
Abstract:
A method for designing a diamond coated wire for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated, wherein the intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and wherein penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution.
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