Edwin K Sum, Age 68295 Edinburgh Cir, Danville, CA 94526

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295 Edinburgh Cir, Danville, CA 94526 (925) 838-1828 (925) 876-1828

Fremont, CA

Santa Clara, CA

Pleasanton, CA

295 Edinburgh Cir, Danville, CA 94526

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Position: Executive, Administrative, and Managerial Occupations

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Degree: Associate degree or higher

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Us Patents

Methods And Apparatus For Reducing Arcing During Plasma Processing

US Patent:
2005026, Dec 1, 2005
Filed:
Jun 1, 2004
Appl. No.:
10/858267
Inventors:
Li Hou - Cupertino CA, US
Qunhua Wang - San Jose CA, US
Edwin Sum - Danville CA, US
John White - Hayward CA, US
International Classification:
C23C016/00
H01L021/00
US Classification:
427569000, 118715000
Abstract:
In a first aspect, a method is provided for use during plasma processing. The first method includes the steps of (1) placing a substrate on a substrate holder of a plasma chamber; (2) positioning a cover frame adjacent and below a perimeter of the substrate; and (3) employing the cover frame to reduce arcing during plasma processing within the plasma chamber. Numerous other aspects are provided.

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