Inventors:
- Santa Clara CA, US
Jackson Chung Peng Kong - Tanjung Tokong, 07, MY
Stephen Harvey Hall - Forest Grove OR, US
Khang Choong Yong - Puchong, 10, MY
Kooi Chi Ooi - Glugor, 07, MY
Eric C Gantner - Portland OR, US
International Classification:
H01L 23/538
H01L 23/66
H01L 25/00
H01L 25/18
H01L 21/56
H01L 25/065
Abstract:
An electrical interconnect for an electronic package. The electrical interconnect includes a first dielectric layer; a second dielectric layer; a signal conductor positioned between the first dielectric layer and the second dielectric layer; and a conductive reference layer mounted on the first dielectric layer, and wherein the conductive reference layer does not cover the signal conductor. The conductive reference layer may be a first conductive reference layer and the electrical interconnect further comprises a second conductive reference layer mounted on the second dielectric layer. The second conductive reference layer does not cover the signal conductor. In addition, the signal conductor may be a first signal conductor and the electrical interconnect may further include a second signal conductor between the first dielectric layer and the second dielectric layer. The first and second signal conductors may form a differential pair of conductors.
