Eugene L Babcock, Age 6121845 Heatherwood Ln, Yorba Linda, CA 92887

Eugene Babcock Phones & Addresses

21845 Heatherwood Ln, Yorba Linda, CA 92887 (714) 693-1365

Placentia, CA

7301 Monaco St, Miami, FL 33143 (305) 740-9249 (305) 740-9250

Coral Gables, FL

Ada, MI

Social networks

Eugene L Babcock

Linkedin

Education

Degree: Master of Science School / High School: California State University, Channel Islands Specialities: Biotechnology

Interests

Science & Technology

Industries

Biotechnology

Mentions for Eugene L Babcock

Resumes

Resumes

Eugene Babcock Photo 1

R&d At Amgen

Location:
Greater Los Angeles Area
Industry:
Biotechnology
Education:
California State University, Channel Islands
Master of Science, Biotechnology
University of California, Irvine
Bachelor of Science, Chemistry
Interests:
Science & Technology

Business Records

Name / TitleCompany / ClassificationPhones & Addresses
Eugene Babcock
President, Vice President
Coulter Holdings, Inc PO Box 169015, Miami, FL 33116

Publications

Us Patents

Method Of Forming Detector Array Contact Bumps For Improved Lift Off Of Excess Metal

US Patent:
5091288, Feb 25, 1992
Filed:
Oct 27, 1989
Appl. No.:
7/428371
Inventors:
Pierino I. Zappella - Garden Grove CA
Angel A. Pepe - Irvine CA
William R. Fewer - Diamond Bar CA
Eugene J. Babcock - Garden Grove CA
Assignee:
Rockwell International Corporation - El Segundo CA
International Classification:
G03C 516
US Classification:
430311
Abstract:
An improved method of forming metal contact bumps for infrared detector array includes depositing a thick layer of positive organic photoresist, and exposing the entire layer to light. A second, substantially thinner layer of photoresist is then applied, and exposed with a pattern of light corresponding to the contact bumps desired. The photoresist is developed to resolve the pattern in the top thin film, and the underlying thick resist is isotropically developed down to the substrate surface and under a portion of the remaining unexposed top layer. the metal to form the contact bumps is then deposited, preferably by evaporative deposition. The overhanging edges of the top layer of photoresist prevent continuous metal step coverage between the surface of the photoresist layer and the bumps formed on the substrate surface in the cavity. The remaining photoresist is then dissolved, and the metal deposited on the surface of the second layer is readily removed.

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