Gerald K Fehr, Age 8795 Lilly Way, Watsonville, CA 95076

6498394, Dec 24, 2002

May 9, 2000

09/569597

Gerald K. Fehr - Cupertino CA

OSE USA - San Jose CA

H01L 2334

257706, 257712, 257713, 257796

A method for manufacturing a plastic encapsulated integrated circuit (IC) package has steps for placing a diamond substrate in a lower cavity of an encapsulation mold such that the diamond substrate in the finished package underlies the die attach pad and a portion of the leads in close proximity to each. Pins are provided in lower cavities of molds to support and/or position diamond substrates to lie close to both die attach pads and leads to facilitate efficient heat transfer from an operating IC, through the die attach pad, into and through the diamond substrate, and finally to the leads leading from the encapsulated package. Apparatus is disclosed for positioning and supporting diamond substrates, and combination heat slugs for the purpose are disclosed, having diamond substrates bonded to metal slugs.

2002008, Jul 11, 2002

Jan 5, 2001

09/755480

Michael Scherbarth - Tracy CA, US
Gerald Fehr - La Selva Beach CA, US

H01L023/495

257/666000, 438/123000

A lead frame apparatus for holding IC packages during IC package processing is provided. The lead frame apparatus comprises a substantially flat thin strip of conductive material having substantially parallel sides and square ends forming the lead frame apparatus, a strip of adhesive material adhered to one surface of lead frame apparatus, the overall dimensions of the strip substantially the same as the overall dimensions of the lead frame apparatus, a plurality of die-attach pads arranged on the non-adhesive surface of the lead frame apparatus, the pads for receiving IC packages for encapsulation by molding, and at least one geometric area of material alteration formed in the conductive material forming the lead frame, the area located substantially at either frame end, wherein a user accesses the strip of adhesive material through utilization of the material alteration for the purpose of removing the adhesive material from the surface of the lead frame.

2004006, Apr 8, 2004

Oct 2, 2002

10/263492

Gerald Fehr - La Selva Beach CA, US
Ernesto Opiniano - San Jose CA, US

H01L021/44
H01L021/48
H01L021/50

438/109000, 438/127000

A method for producing a semiconductor package without spacer components has steps of (a) providing at least two rectangular die components each having a length greater than a width and bond pads implemented on the short sides only; (b) cross stacking the die components on a substrate for package assembly such that the bond-pad arrays are unobstructed; (c) wire bonding the unobstructed bond pads on each die component to the substrate; and (d) encapsulating the package.

5491110, Feb 13, 1996

Feb 3, 1995

8/383716

Gerald K. Fehr - Cupertino CA
Victor Batinovich - Morgan Hill CA

Integrated Packaging Assembly Corporation - San Jose CA

H01L 2160

437206

An improved metal semiconductor package is described. The semiconductor package includes a lead frame with a top side and a bottom side. A semiconductor is positioned on the top side of the lead frame. Bond wires electrically couple the lead frame to the semiconductor die. A metallic base is positioned at the bottom side of the lead frame. A metallic cap is positioned over the top side of the lead frame. The metallic cap includes a central aperture that is aligned with the semiconductor die. An external plastic seal is used to join the metallic base, lead frame, and metallic cap. The external plastic seal may be in the form of a perimeter seal or a body seal.

5436407, Jul 25, 1995

Jun 13, 1994

8/258967

Gerald K. Fehr - Cupertino CA
Victor Batinovich - Morgan Hill CA

Integrated Packaging Assembly Corporation - San Jose CA

H01L 2302

174524

An improved metal semiconductor package is described. The semiconductor package includes a lead frame with a top side and a bottom side. A semiconductor is positioned on the top side of the lead frame. Bond wires electrically couple the lead frame to the semiconductor die. A metallic base is positioned at the bottom side of the lead frame. A metallic cap is positioned over the top side of the lead frame. The metallic cap includes a central aperture that is aligned with the semiconductor die. An external plastic seal is used to join the metallic base, lead frame, and metallic cap. The external plastic seal may be in the form of a perimeter seal or a body seal.

6058602, May 9, 2000

Sep 21, 1998

9/157750

Gerald K. Fehr - Cupertino CA

Integrated Packaging Assembly Corporation - San Jose CA

H01R 4300

29827

A method for manufacturing a plastic encapsulated integrated circuit (IC) package has steps for placing a diamond substrate in a lower cavity of an encapsulation mold such that the diamond substrate in the finished package underlies the die attach pad and a portion of the leads in close proximity to each. Pins are provided in lower cavities of molds to support and/or position diamond substrates to lie close to both die attach pads and leads to facilitate efficient heat transfer from an operating IC, through the die attach pad, into and through the diamond substrate, and finally to the leads leading from the encapsulated package. Apparatus is disclosed for positioning and supporting diamond substrates, and combination heat slugs for the purpose are disclosed, having diamond substrates bonded to metal slugs.

5859477, Jan 12, 1999

Aug 25, 1997

8/918784

Gerald K. Fehr - Cupertino CA

International Packaging and Assembly Corporation - San Jose CA

H01L 2328
H01L 2310
H01L 2334

257796

A method for manufacturing a plastic encapsulated integrated circuit (IC) package has steps for placing a diamond substrate in a lower cavity of an encapsulation mold such that the diamond substrate in the finished package underlies the die attach pad and a portion of the leads in close proximity to each. Pins are provided in lower cavities of molds to support and/or position diamond substrates to lie close to both die attach pads and leads to facilitate efficient heat transfer from an operating IC, through the die attach pad, into and through the diamond substrate, and finally to the leads leading from the encapsulated package. Apparatus is disclosed for positioning and supporting diamond substrates, and combination heat slugs for the purpose are disclosed, having diamond substrates bonded to metal slugs.

5682673, Nov 4, 1997

Apr 17, 1995

8/424151

Gerald K. Fehr - Cupertino CA

IPAC, Inc. - San Jose CA

H01R 4300

29827

A mold is provided for use in encapsulating integrated circuit (IC) dies attached to die attach pads of lead frames, wherein the mold has one or more support elements in cavities of the mold for supporting the die attach pad portions of the lead frame while the mold is closed on the lead frame and encapsulation material is injected to encapsulate the IC dies and die attach pads. The support elements are, in a preferred embodiment, pins extending from the surfaces of the cavities in the mold, and the pins keep the die attach pads from moving into contact with surfaces of the cavities, so die attach pads or dies are not exposed in finished packages. In a preferred embodiment the pins each are tapered in the extended portion, so the amount of exposure of the die attach pad is absolutely minimized. In another embodiment, the support elements are retractable. In still other embodiments, support elements are beads bonded to a lead frame strip or dimples provided to a lead frame strip in the process of manufacturing the strip.