Gerald Fehr resumes & CV records
Resumes
Gerald Fehr
Gerald K Fehr, Age 8795 Lilly Way, Watsonville, CA 95076
Gerald Fehr Phones & Addresses
95 Lilly Way, Watsonville, CA 95076 (831) 768-9663
La Selva Beach, CA
Arnolds Park, IA
Escondido, CA
Milford, IA
San Jose, CA
Santa Cruz, CA
Mentions for Gerald K Fehr
Publications & IP owners
Us Patents
Lead-Frame Design Modification To Facilitate Removal Of Resist Tape From The Lead-Frame
US Patent:
2002008, Jul 11, 2002
Filed:
Jan 5, 2001
Appl. No.:
09/755480
Inventors:
Michael Scherbarth - Tracy CA, US
Gerald Fehr - La Selva Beach CA, US
Gerald Fehr - La Selva Beach CA, US
International Classification:
H01L023/495
US Classification:
257/666000, 438/123000
Abstract:
A lead frame apparatus for holding IC packages during IC package processing is provided. The lead frame apparatus comprises a substantially flat thin strip of conductive material having substantially parallel sides and square ends forming the lead frame apparatus, a strip of adhesive material adhered to one surface of lead frame apparatus, the overall dimensions of the strip substantially the same as the overall dimensions of the lead frame apparatus, a plurality of die-attach pads arranged on the non-adhesive surface of the lead frame apparatus, the pads for receiving IC packages for encapsulation by molding, and at least one geometric area of material alteration formed in the conductive material forming the lead frame, the area located substantially at either frame end, wherein a user accesses the strip of adhesive material through utilization of the material alteration for the purpose of removing the adhesive material from the surface of the lead frame.
Method For Stack-Packaging Integrated Circuit Die Using At Least One Die In The Package As A Spacer
US Patent:
2004006, Apr 8, 2004
Filed:
Oct 2, 2002
Appl. No.:
10/263492
Inventors:
Gerald Fehr - La Selva Beach CA, US
Ernesto Opiniano - San Jose CA, US
Ernesto Opiniano - San Jose CA, US
International Classification:
H01L021/44
H01L021/48
H01L021/50
H01L021/48
H01L021/50
US Classification:
438/109000, 438/127000
Abstract:
A method for producing a semiconductor package without spacer components has steps of (a) providing at least two rectangular die components each having a length greater than a width and bond pads implemented on the short sides only; (b) cross stacking the die components on a substrate for package assembly such that the bond-pad arrays are unobstructed; (c) wire bonding the unobstructed bond pads on each die component to the substrate; and (d) encapsulating the package.
NOTICE: You may not use PeopleBackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. PeopleBackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.