Guan K Quah, Age 771843 E Catamaran Dr, Gilbert, AZ 85234
Guan Quah Phones & Addresses
1843 Catamaran Dr, Gilbert, AZ 85234 (480) 926-8224
Tempe, AZ
Phoenix, AZ
1843 E Catamaran Dr, Gilbert, AZ 85234 (623) 845-2414
Work
Position:
Clerical/White Collar
Mentions for Guan K Quah
Publications & IP owners
Us Patents
Direct Chip Attach Structure And Method
US Patent:
6835580, Dec 28, 2004
Filed:
Jun 26, 2003
Appl. No.:
10/603258
Inventors:
James Knapp - Gilbert AZ
Kok Yang Lau - Asahan Melaka, MY
Beng Lian Lim - Negeri Sembilan, MY
Guan Keng Quah - Gilbert AZ
Kok Yang Lau - Asahan Melaka, MY
Beng Lian Lim - Negeri Sembilan, MY
Guan Keng Quah - Gilbert AZ
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
International Classification:
H01L 2166
US Classification:
438 15, 438111, 438112
Abstract:
A method for forming a direct chip attach (DCA) device ( ) includes attaching a chip ( ) to a lead frame ( ). Conductive studs ( ) are attached to bonding pads ( ) on the chip ( ) and a flag ( ) on lead frame ( ). The chip ( ) and flag ( ) are enclosed with an encapsulating layer ( ), and openings ( ) are formed in an upper surface ( ) to expose conductive studs ( ). In one embodiment, a masking layer ( ) is applied to the lead frame ( ), and the structure is then placed in an electroless plating apparatus ( ). While in the plating apparatus ( ), an injection device ( ) injects plating solution ( ) towards the upper surface ( ) and openings ( ) to enhance the formation of barrier layers ( ) on the conductive studs ( ). Solder bumps ( ) are then attached to barrier layers ( ) through the openings ( ).
Method Of Forming A Leadframe For A Semiconductor Package
US Patent:
6852574, Feb 8, 2005
Filed:
Aug 11, 2003
Appl. No.:
10/638181
Inventors:
Guan Keng Quah - Gilbert AZ, US
Darrell D. Truhitte - Phoenix AZ, US
Darrell D. Truhitte - Phoenix AZ, US
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
International Classification:
H01I021/44
H01I021/48
H01L021/50
H01I021/48
H01L021/50
US Classification:
438123, 438456
Abstract:
A method of forming a leadframe () provides blocking fulcrums () adjacent to the leads (, and ). During the process of encapsulating the leadframe (), the blocking fulcrums () restrict encapsulating material from exiting the mold cavity and from attaching to the leads (, and ).
Structure And Method Of Direct Chip Attach
US Patent:
7098051, Aug 29, 2006
Filed:
May 25, 2004
Appl. No.:
10/852898
Inventors:
Guan Keng Quah - Gilbert AZ, US
Assignee:
Semiconductor Components Industries, L.L.C. - Phoenix AZ
International Classification:
G01R 31/26
H01L 21/66
H01L 21/66
US Classification:
438 15, 257E21526, 257E21521
Abstract:
A semiconductor package () has a die (), a leadframe (), a bond pad (), an encapsulation () and a wire bond ball (). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (), and remainder of the bond wire is removed. Locations () for attaching the wire bond ball are recorded with reference to fiducials () on the lead frame. The encapsulation covers the die, deposits and die attach flag () of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings () for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die.
Method For Making A Direct Chip Attach Device And Structure
US Patent:
7144538, Dec 5, 2006
Filed:
Jun 26, 2003
Appl. No.:
10/603257
Inventors:
Yeu Wen Lee - Seremban, MY
Chuan Kiak Ng - Negei Sembilan, MY
Guan Keng Quah - Gilbert AZ, US
Chuan Kiak Ng - Negei Sembilan, MY
Guan Keng Quah - Gilbert AZ, US
Assignee:
Semiconductor Components Industries, LLC - Phoenix AZ
International Classification:
B29C 45/14
H01L 21/56
H01L 21/56
US Classification:
26427211, 26427217, 264273, 2642791, 2643281, 438108, 438112, 438118, 438122, 438123, 438127
Abstract:
A method for forming a direct chip attach device () includes attaching an electronic chip () to a lead frame structure (), which includes a flag (). Next, conductive studs () are attached to bond pads () on electronic chip () and flag () to form a sub-assembly (). Sub-assembly () is then placed in a molding apparatus (), which includes a first plate () and second plate (). Second plate () includes a cavity () for receiving electronic chip () and flag (), and pins (). During a molding step, pins () contact conductive studs () to prevent encapsulating material () from covering studs (). This forms openings () to receive solder balls () during a subsequent processing step.
Structure And Method Of Direct Chip Attach
US Patent:
2004004, Mar 11, 2004
Filed:
Sep 9, 2002
Appl. No.:
10/237123
Inventors:
Guan Quah - Gilbert AZ, US
Assignee:
Semiconductor Components Industries, LLC.
International Classification:
H01L021/44
US Classification:
438/106000
Abstract:
A semiconductor package () has a die (), a leadframe (), a bond pad (), an encapsulation () and a wire bond ball (). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (), and remainder of the bond wire is removed. Locations () for attaching the wire bond ball are recorded with reference to fiducials () on the lead frame. The encapsulation covers the die, deposits and die attach flag () of the lead frame. The wire bond ball is exposed where the encapsulation is removed. The locations for making openings () for exposing the wire bond ball is determined by recorded coordinates when the wire bond ball is formed. Exposed wire bond ball is plated, forming a lead to electrically connect to the die.
Semiconductor Package Structure And Method Of Manufacture
US Patent:
2008005, Mar 6, 2008
Filed:
Aug 23, 2006
Appl. No.:
11/466539
Inventors:
Guan Keng Quah - Gilbert AZ, US
Hou Boon Tan - Seremban, MY
Qiang Hua Pan - Leshan, CN
Hou Boon Tan - Seremban, MY
Qiang Hua Pan - Leshan, CN
International Classification:
H01L 23/495
US Classification:
257676
Abstract:
In one embodiment, a semiconductor package includes a lead frame having a lead portion and pad portion that are offset with respect to each other. The lead portion includes a deep formed impression. An up-bent portion connects the lead portion to the pad portion.
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