Herbert B Fick, Age 645046 Woodlawn Blvd, Minneapolis, MN 55417

3940534, Feb 24, 1976

Aug 5, 1974

5/494771

Herbert J. Fick - Northfield MN
Edward J. Mahagnoul - Faribault MN

G. T. Schjeldahl Company - Northfield MN

B32B 1712

428228

A mechanically sound electrically stable substrate for use in an electrical laminate wherein the substrate supports at least one electrically conductive metallic layer. The substrate portion comprises a woven glass cloth base pad which is interposed between a pair of outer substrate layers of a polyester mat. The polyester mat comprises a mat of spunbonded continuous filament polyester fibers, preferably polyethylene terephthalate fibers, calendered, with the fibers including a mixture of bulk fibers of relatively high melting point retained in place or bonded by a binder fiber of essentially the same polyester material but with a relatively lower melting point. In fabrication, the mat, along with the glass cloth, is saturated with a curable resin, for example a heat curable resin, preferably polybutadiene, which is cured in-situ.

4842911, Jun 27, 1989

Jul 8, 1988

7/222069

Herbert J. Fick - Northfield MN

The Bergquist Company - Minneapolis MN

B32B 700
B32B 2706

428 40

Withdrawal and dissipation of heat from an electronic solid-state device by an associated heat-sink structure are promoted by a relatively thin broad-area dielectric interfacing composed of dual filled layers of compliant silicone rubber in sandwiching relation to a porous glass-cloth carrier, one of the layers being pre-vulcanized and the other being subsequently cured and bonded in place once the composite interfacing has been applied to heat-sink surfaces adapted for abutment with the device for the intended heat transfer. The soft rubber interfacing offers good dielectric and insulating and voltage-breakdown characteristics even when well loaded with thermally-conductive oxides, and intimate voidless surface contacts and high-quality thermal matching are fostered both along abutting compliant surfaces of the pre-cured portion of the interfacing and along fully bonded surfaces of the portion cured in situ. Processing which makes such interfacing eminently practical and particularly advantageous to the user includes initial application of filled uncured rubber to one side of the sheet of the porous carrier, followed by its vulcanization and then by application of a further uncured amount to the opposite side of the carrier, with a protective peel-off plastic covering being used to facilitate handling and release-cutting of desired smaller wafer configurations from the large-area composite; uncured sides of the smaller peeled wafers are than mated with appropriate parts of heat sinks and cured, thereby producing heat sinks integrated with securely-bonded thermally-matching dielectric interfacing in readiness for unions with devices from which heat must be dissipated efficiently.

4810563, Mar 7, 1989

Oct 30, 1987

7/114855

David C. DeGree - Burnsville MN
Herbert J. Fick - Northfield MN
Bruce H. Juenger - Northfield MN

The Bergquist Company - Minneapolis MN

B32B 1508
H05K 346

428209

A thermally conductive laminate structure for use as a mounting base and/or chassis attachment member in combination with solid-state electronic devices, the laminate preferably comprising up to five layers including a pair of outer metallic layers disposed on opposite sides of center composite layers of electrically insulative layers separated by an interposed metallic layer. The center insulative layers are films of polyimide(amide) material, with the polyimide(amide) film being filled with a quantity of aluminum oxide, boron nitride, or other suitable particulate solid in an amount ranging from between about 30% and 100% by weight of polyimide(amide) solids. The outer layers are metallic, with the base member being a metallic pad of copper or aluminum, and with the opposed metallic layer being copper and arranged in a printed circuitry pattern or array.

4574879, Mar 11, 1986

Feb 29, 1984

6/584897

David C. DeGree - Burnsville MN
Herbert J. Fick - Northfield MN
Bruce H. Juenger - Northfield MN

The Bergquist Company - Minneapolis MN

F28F 300
B32B 2520
B32B 3300
H05K 720

165185

A thermally conductive electrically insulative laminate for use as chassis barriers in combination with solid-state electronic devices, the laminate comprising at least three layers and including a pair of outer layers disposed on opposite sides of a center layer. The center layer comprises a film of a polyimide (amide) filled with a quantity of either aluminum oxide or boron nitride particulate solids and included in an amount ranging from between about 10% to about 50% by volume. The outer layers consist essentially of silicone base rubber, and are preferably filled with a quantity of aluminum oxide or boron nitride particulate solids in an amount ranging from between about 25% and 50% by volume.

4602678, Jul 29, 1986

Sep 2, 1983

6/529033

Herbert J. Fick - Northfield MN

The Bergquist Company - Minneapolis MN

H01L 2340
F28F 1300

165 79

A relatively thin broad-area dielectric interfacing composed of dual filled layers of compliant silicone rubber in sandwiching relation to a porous glass-cloth carrier, one of the layers being pre-vulcanized and the other being subsequently cured and bonded in place once the composite interfacing has been applied to heat-sink surfaces adapted for abutment with the device for the intended heat transfer. The soft rubber interfacing offers good dielectric and insulating and voltage-breakdown characteristics even when well loaded with thermally-conductive oxides, and intimate voidless surface contacts and high-quality thermal matching are fostered both along abutting compliant surfaces of the pre-cured portion of the interfacing and along fully bonded surfaces of the portion cured in situ. Processing which makes such interfacing eminently practical and particularly advantageous to the user includes initial application of filled uncured rubber to one side of a sheet of the porous carrier, followed by its vulcanization and then by application of a further uncured amount to the opposite side of the carrier. A protective peel-off plastic covering is used to facilitate handling and release-cutting of desired smaller wafer configurations from the large-area composite.

4685987, Aug 11, 1987

Jan 21, 1986

6/820216

Herbert J. Fick - Northfield MN

The Bergquist Company - Minneapolis MN

B32B 3116

156247

A relatively thin broad-area dielectric interfacing composed of dual filled layers of compliant silicone rubber in sandwiching relation to a porous glass-cloth carrier, one of the layers being pre-vulcanized and the other being subsequently cured and bonded in place once the composite interfacing has been applied to heat-sink surfaces adapted for abutment with the device for the intended heat transfer. The soft rubber interfacing offers good dielectric and insulating and voltage-breakdown characteristics even when well loaded with thermally-conductive oxides, and intimate voidless surface contacts and high-quality thermal matching are fostered both along abutting compliant surfaces of the pre-cured portion of the interfacing and along fully bonded surfaces of the portion cured in situ. Processing which makes such interfacing eminently practical and particularly advantageous to the user includes initial application of filled uncured rubber to one side of a sheet of the porous carrier, followed by its vulcanization and then by application of a further uncured amount to the opposite side of the carrier. A protective peel-off plastic covering is used to facilitate handling and release-cutting of desired smaller wafer configurations from the large area composite.

2021034, Nov 11, 2021

May 5, 2021

17/308866

- Minneapolis MN, US
Herbert B. Fick - Minneapolis MN, US

F21S 4/24
F21V 23/00
F21S 9/02
F21V 33/00

This Graphic Band Assembly includes a band/strap that may be worn and is printed with a graphic image made up of electroluminescent segments. The graphic image on the band/strap is animated by the programming of circuitry contained in underlying layers of the band/strap which causes the selective illumination of the segments. The Graphic Band Assembly includes a PCB control unit and a rechargeable battery that contain the illumination program, control the EL illumination pattern, and provide the power to illuminate the EL Band. The Assembly includes accessible switches that allow the unit to be turned on and off, and to switch between programs. The Assembly includes a USB port for recharging and programming the device.