James D Colby, Age 491297 County Road D Cir E, Saint Paul, MN 55109

7035072, Apr 25, 2006

Jul 10, 2002

10/192314

James A. Colby - Lombard IL, US

Littlefuse, Inc. - Des Plaines IL

H01C 7/10
H01C 7/12
H01C 7/13
H02H 1/04

361118, 361111, 361119, 361127, 338 20

The present invention provides an ESD apparatus that includes an electrical overstress suppression device in series with a capacitor. The ESD apparatus is ideally suited for use with network communication devices, but any electronic device requiring overvoltage protection and isolation may employ the ESD apparatus of the present invention. In one embodiment, the ESD apparatus includes a capacitor and an electrical overstress protection device that electrically communicates in series with the capacitor. In another embodiment, the ESD apparatus includes an electrical overstress protection device having a voltage variable material and a capacitor that electrically communicates in series with the overstress protection device. The capacitor is sized so that the overstress device can withstand an application of a predetermined steady state voltage.

7183891, Feb 27, 2007

Oct 5, 2004

10/958442

Edwin James Harris - Oak Park IL, US
Tushar Vyas - Streamwood IL, US
Timothy Pachla - Berwyn IL, US
James A. Colby - Lombard IL, US

Littelfuse, Inc. - Des Plaines IL

H01C 7/10

338 21, 338 22 SD, 338204, 338314

A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.

2009002, Jan 29, 2009

Jul 26, 2007

11/828844

James A. Colby - Lombard IL, US
Stephen Whitney - Lake Zurich IL, US
Du Yaosheng - Chaoyang District Beijing, CN

LITTELFUSE, INC. - Des Plaines IL

H02H 5/04

361104

A circuit protection device includes a fuse element placed in parallel with a PTC thermistor layer. The element and PTC thermistor layer are provided on one or more insulating substrate, such as an FR-4 or polyimide substrate. First and second conductors connect the fuse element and PTC thermistor layer electrically in parallel, such that current (i) initially under normal flows mainly through the fuse element and PTC thermistor layer at a lower drop in voltage and (ii) after an opening of the fuse element flows under normal operation through the PTC thermistor layer at a higher drop in voltage.

2012016, Jun 28, 2012

Dec 20, 2011

13/331774

Pamela Lynn Lundberg - Crystal Lake IL, US
Taras Peter Drozd - Chicago IL, US
James Donald Colby - Arlington Heights IL, US

A23L 1/162
A23L 1/01

426243, 426557

A method and composition for reducing sodium in a pasta product having a cheese component and an anti-boil-over component without compromising the cheese flavor of the pasta product. The sodium chloride in the anti-boil-over composition is replaced with a sodium replacer including at least one of a modified potassium chloride or a bonded potassium chloride. Modified potassium chloride can include potassium chloride, rice flour, citric acid, L-lysine and rosemary extract. Bonded potassium chloride can include potassium chloride and natural flavors. The sodium replacer can include potassium chloride with at least either of the modified potassium chloride or the bonded potassium chloride. The addition of sodium replacers to the anti-boil-over component results in enhanced cheese flavors.