James Arnold Rew Deceased102 Sunnydale Way, Reisterstown, MD 21136

4801069, Jan 31, 1989

Mar 30, 1987

7/032427

Michael J. Ankrom - Baltimore MD
James A. Rew - Millersville MD

Westinghouse Electric Corp. - Pittsburgh PA

B23K 3102

2281802

A method and an apparatus for depositing solder onto component lead pads of a printed wiring board. Solder preforms which are multi-layer, solder containing members are positively biased against the pwb pad which is then introduced into a vapor phase environment defining a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The pwb is heated according to a controlled process in which the temperature of the pwb is continuously monitored. The apparatus is a pressure fixture usable for vapor phase solder deposition of a pwb and comprises a first and a second member which are removably fastened together in an opposed relationship with a pwb is disposed between the first and the second members.

4069999, Jan 24, 1978

Nov 10, 1976

5/740530

James A. Rew - Glen Burnie MD

The United States of America as represented by the Secretary of the Air
Force - Washington DC

B25B 508

248507

A clamping device for securing a workpiece such as an electronic package to a support such as a heat sink. A curved slot is machined around a central opening in the body of a configurated flat metal clamp having an extending lip which contacts the edge of the workpiece. The central opening in the clamp body receives a hold down screw member which threadably engages the support. When the hold down screw is fully tightened against the support with the extending lip over the workpiece, the known clamping force predetermined by the thickness and configuration of the clamp body is applied. The need for a torque wrench and specific fastener torque values to prevent possible distortion of the surface of the heat sink is eliminated.

4909429, Mar 20, 1990

Oct 14, 1988

7/257911

Michael J. Ankrom - Baltimore MD
James A. Rew - Millersville MD

Westinghouse Electric Corp. - Pittsburgh PA

B23K 100

228 57

A method and an apparatus for depositing solder onto component lead pads of a printed wiring board. Solder preforms which are multi-layer, solder containing members are positively biased against the pwb pad which is then introduced into a vapor phase environment defining a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The pwb is heated according to a controlled process in which the temperature of the pwb is continuously monitored. The apparatus is a pressure fixture usable for vapor phase solder deposition of a pwb and comprises a first and a second member which are removably fastened together in an opposed relationship with a pwb is disposed between the first and the second members.

4135298, Jan 23, 1979

Jun 21, 1977

5/808493

James A. Rew - Glen Burnie MD
Albert B. Simon - Ellicott City MD
Thomas M. Fahey - Laurel MD

The United States of America as represented by the Secretary of the Air
Force - Washington DC

B23P 1526

29727

A mechanically deformable heat transfer fin for installation in a hollow cavity of a large complex elongated extrusion to improve heat transfer characteristics without brazing welding or glueing. Since the required design cannot be obtained with the transfer fins as an integral part of the extrusion using presently known techniques, a separate fin insert of slightly smaller dimensions than the hollow opening of the large extrusion is installed therein. The insert includes a plurality of legs and an internal pressure cavity which can be sealed off at both ends with pressure cap fittings secured by tie rods. After installation in the extrusion, pressure is applied to the inner chamber until the legs of the insert move outward and contact the inner surface of the extrusion walls. The pressure is raised until the relatively thin walls of the insert are permanently deformed so that, when the pressure is relieved, the insert is held fixedly in place.

4802276, Feb 7, 1989

Mar 30, 1987

7/032429

Corey H. Bowcutt - Annapolis MD
John J. Buckley - Baltimore MD
James A. Rew - Millersville MD

Westinghouse Electric Corp. - Pittsburgh PA

H05K 330
H05K 334

29739

An apparatus for printed wiring board assembly provides for the populating with components of a printed wiring board having at least one adjacent pair of pad rows onto which solder has been deposited. A curable adhesive strip is applied between the adjacent pair of pad rows. The adhesive strip has a first adhesive side which adheres to the printed wiring board and an opposed, second adhesive side onto which the components are selectively mounted so that the component's leads are aligned with the pad rows. A predetermined constant force is applied to the components and the adhesive strip is cured. The apparatus supports the printed wiring board and maintains a predetermined constant force on the components. A frame defining a generally U-shaped member has an upper and a lower surface. The U-shaped member has a slot therein for receiving the printed wiring board therein.

4840305, Jun 20, 1989

Mar 30, 1987

7/032426

Michael J. Ankrom - Baltimore MD
Corey H. Bowcutt - Annapolis MD
John J. Buckley - Baltimore MD
James A. Rew - Millersville MD

Westinghouse Electric Corp. - Pittsburgh PA

B23K 3102

228232

A method for vapor phase soldering components onto a PWB onto which solder has been previously deposited includes the steps of applying a fluxing agent on the PWB and introducing the PWB into a vapor phase environment. The application of flux is a multi-step process which includes a sequential application of flux to the PWB. The vapor phase environment defines a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The PWB is heated according to a controlled process in which the temperature of the PWB is continuously monitored.

5293983, Mar 15, 1994

Aug 9, 1991

7/742753

Thomas F. Grapes - Columbia MD
James A. Rew - Millersville MD
Charles M. Miller - Seven Valleys PA
John J. Buckley - Hanover MD
Stanley K. Wakamiya - Ellicott City MD
David J. Tilles - Baltimore MD
William L. DeHaven - Millersville MD

Westinghouse Electric Corp. - Pittsburgh PA

B65G 3700

198358

A transport/stacker module provides for a vertical stacking of mail bins. Carriers traveling in a transport path have openable and closable doors at both ends, and a frame of the transport/stacker module is provided with cam actuators to open the doors after the carriers pass turnaround areas and close the doors before the carriers enter the turnaround areas. A rake mechanism disposed above each bin is provided with a snubber which engages a mail piece prior to rake tines of the rake mechanism.