Jeremy Schmitz resumes & CV records
Resumes
General Manager
Work:
Ruby Tuesday
General Manager
General Manager
Jeremy Schmitz
Jeremy T Schmitz, Age 4613815 89Th Pl N, Maple Grove, MN 55369
Jeremy Schmitz Phones & Addresses
Maple Grove, MN
1327 Devonshire Rd, Bloomington, MN 55431 (952) 881-0825
Minneapolis, MN
10261 Palmersheim Dr, Hales Corners, WI 53130 (414) 425-6313
Franklin, WI
Milwaukee, WI
Menomonie, WI
Mentions for Jeremy T Schmitz
Publications & IP owners
Us Patents
Method For Packaging Thermal Interface Materials
US Patent:
2011018, Aug 4, 2011
Filed:
Apr 12, 2011
Appl. No.:
13/084706
Inventors:
Radesh Jewram - Lakeville MN, US
William E. McIntosh - Northfield MN, US
Jeremy J. Schmitz - Minnetrista MN, US
William E. McIntosh - Northfield MN, US
Jeremy J. Schmitz - Minnetrista MN, US
International Classification:
B65D 90/12
B65B 1/04
B65B 1/04
US Classification:
220600, 53473
Abstract:
A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.
Thermally Conductive Dielectric Interface
US Patent:
2014037, Dec 25, 2014
Filed:
Jun 20, 2014
Appl. No.:
14/310231
Inventors:
- Chanhassen MN, US
Jeremy J. Schmitz - Minnetrista MN, US
Jeremy L. Hammond - Stillwater MN, US
Jeremy J. Schmitz - Minnetrista MN, US
Jeremy L. Hammond - Stillwater MN, US
International Classification:
H05K 7/20
B23P 15/26
B23P 15/26
US Classification:
165133, 2989003
Abstract:
A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.
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