Jerry R Bautista, Age 68619 NW Alpine Ter, Portland, OR 97210

Jerry Bautista Phones & Addresses

Portland, OR

Hayward, CA

Honolulu, HI

Atlanta, GA

Alpharetta, GA

Seattle, WA

Basking Ridge, NJ

Alameda, CA

Sunnyvale, CA

5809 Gold Creek Dr, Castro Valley, CA 94552 (510) 538-0701

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Work

Position: Professional/Technical

Mentions for Jerry R Bautista

Jerry Bautista resumes & CV records

Resumes

Jerry Bautista Photo 35

Walmart Associate

Work:
Walmart
Walmart Associate
Jerry Bautista Photo 36

Jerry Bautista

Industry:
Entertainment
Work:
Croupier Casino Dealer Feb 2014 - May 2015
Genting Malaysia
Resorts World Genting Apr 2009 - May 2013
Croupier and Casino Dealer
Jerry Bautista Photo 37

Jerry Bautista

Publications & IP owners

Us Patents

In-Street Die-To-Die Interconnects

US Patent:
2012000, Jan 12, 2012
Filed:
Jul 6, 2010
Appl. No.:
12/830547
Inventors:
Aleksandar Aleksov - Chandler AZ, US
Arnab Sarkar - Chandler AZ, US
Henning Braunisch - Chandler AZ, US
Jerry R. Bautista - Castro Valley CA, US
International Classification:
H01L 27/10
H01L 21/50
US Classification:
257508, 438462, 257E21499, 257E2707
Abstract:
The present disclosure relates to the field of microelectronic die packaging, particularly multi-chip packaging, wherein on-substrate modularity is enabled by using in-street die-to-die interconnects to facilitate signal routing between microelectronic dice. These in-street die-to-die interconnects may allow for manufacturing of several products on a single microelectronic substrate, which may lead to improved microelectronic die and/or microelectronic module harvesting and increased product yields.

Expandable Interleaving Optical Add/Drop Filter Module

US Patent:
6256433, Jul 3, 2001
Filed:
Sep 24, 1999
Appl. No.:
9/405027
Inventors:
Huali Luo - Fremont CA
Joseph C. Chon - Fremont CA
Jerry R. Bautista - Castro Valley CA
Assignee:
Wavesplitter Technologies, Inc. - Fremont CA
International Classification:
G02B 628
US Classification:
385 24
Abstract:
An optical add/drop filter (OADF) module is provided that is capable of only utilizing one filter to drop and add multiple channels from a multiplexed signal. In one embodiment, a demultiplexer separates the input signal into groups of signals or channels to be dropped. This group of channels is coupled to one input of a 2. times. 2 interleaving OADF, which in one embodiment is an unbalanced Mach-Zehnder Interferometer, while another group of channels to be added back to the multiplexed signal is coupled to the other input. One output of the OADF drops one group of channels, while the other output transmits the added group of channels to an input of a multiplexer, which combines the group of added channels with the other groups of channels from the outputs of the demultiplexer. In another embodiment, a multi-window filter formed from an unbalanced Michelson Interferometer outputs two signals, each having either odd or even wavelength signal components. The signal to be dropped is input back to an optical circulator, which drops the signal from an exit port.

Method For Coating An Article With A Ladder Siloxane Polymer And Coated Article

US Patent:
5962067, Oct 5, 1999
Filed:
Sep 9, 1997
Appl. No.:
8/926210
Inventors:
Jerry Rodolfo Bautista - Atlanta GA
Edwin Arthur Chandross - Murray Hill NJ
Valerie Jeanne Kuck - Upper Montclair NJ
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
B05D 506
US Classification:
4271632
Abstract:
The invention provides a method for coating an article with a siloxane-based coating composition that results in a coating with high thermal mechanical stability, the method also allowing commercially acceptable speeds to be employed while inhibiting beading of the coating prior to cure. In one embodiment, an article is coated with a composition containing a first methylsilsequioxane oligomer having an initial viscosity of about 2000 cp or less, a second methylsilsequioxane oligomer having an initial viscosity of about 40,000 to about 90,000 cp, a viscosity-lowering additive of a lower aliphatic ketone, and a catalyst. In another embodiment, the invention provides a method for coating an article with a modified methylsilsequioxane coating suitable for higher temperature applications than an all-methyl coating. This embodiment involves coating an article with a composition comprising an oligomer characterized by A:B:C, where A represents the number of methyl pendant groups in the oligomer and is about 13 to about 67, B represents dimethyl pendant groups and is about 0 to about 33, and C represents phenyl pendant groups and is about 10 to about 80, a lower aliphatic ketone viscosity-lowering additive, and a catalyst of a moderately strong protic acid. In a third embodiment, it is possible to attain an even higher temperature coating.

Wearable Electronic Device With Color Display

US Patent:
2015018, Jul 2, 2015
Filed:
Dec 28, 2013
Appl. No.:
14/142796
Inventors:
Mark Francis - Portland OR, US
Gregory Peek - Northplains OR, US
Jerry Bautista - Castro Valley CA, US
Mark Pontarelli - Lake Oswego OR, US
International Classification:
G09G 5/02
G06F 3/01
Abstract:
A wearable electronic device is described herein. The wearable electronic device includes a housing for the wearable electronic device. A display is supported by the housing. The wearable electronic device also includes a colorimeter comprising a sensor to sense a first color. The colorimeter is to display on the display a second color corresponding to the sensed first color.

In-Street Die-To-Die Interconnects

US Patent:
2014012, May 1, 2014
Filed:
Jan 3, 2014
Appl. No.:
14/146877
Inventors:
Aleksandar Aleksov - Chandler AZ, US
Arnab Sarkar - Chandler AZ, US
Henning Braunisch - Phoenix AZ, US
Jerry R. Bautista - Castro Valley CA, US
International Classification:
H01L 21/78
US Classification:
438462
Abstract:
The present disclosure relates to the field of microelectronic die packaging, particularly multi-chip packaging, wherein on-substrate modularity is enabled by using in-street die-to-die interconnects to facilitate signal routing between microelectronic dice. These in-street die-to-die interconnects may allow for manufacturing of several products on a single microelectronic substrate, which may lead to improved microelectronic die and/or microelectronic module harvesting and increased product yields.

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