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Joel M Sharrow, Age 66Peru, NY

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Peru, NY

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Us Patents

Method And Apparatus For Combined Particle Location And Removal

US Patent:
6356653, Mar 12, 2002
Filed:
Jul 16, 1998
Appl. No.:
09/116680
Inventors:
Jeffrey A. Brigante - Colchester VT
Glenn W. Gale - Essex Junction VT
Maurice R. Hevey - Burlington VT
Ben Kim - S. Burlington VT
Joel M. Sharrow - South Hero VT
William A. Syverson - Colchester VT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06K 900
US Classification:
382145, 382149, 382153, 382144
Abstract:
A method for removing one or more particles from a surface of an object is provided. The method has first and second steps of detecting and locating the one or more particles on the surface of the object. In a third step, focused energy is directed onto one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface. In preferred variations of the method of the present invention, the object is a semiconductor wafer and the directed focused energy is in the form of a laser. Also provided is an apparatus for removing the plurality of particles from the surface of the object. The apparatus includes a detector for detecting and locating the plurality of particles on the surface of the object, and a laser for directing focused energy on one or more of the detected particles to break a bond energy between the one or more particles and the surface thereby removing the one or more particles from the surface.

Backside Protection Films

US Patent:
6670283, Dec 30, 2003
Filed:
Nov 20, 2001
Appl. No.:
09/989389
Inventors:
Faye D. Baker - Burlington VT
Casey J. Grant - Hinesburg VT
Mousa H. Ishaq - Essex Junction VT
Joel M. Sharrow - South Hero VT
James D. Weil - Underhill VT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2131
US Classification:
438758, 438689, 438679
Abstract:
Disclosed is a method of fabricating a semiconductor device, comprising: (a) providing a bare semiconductor substrate, the substrate having a frontside and a backside; (b) forming one or more protective films on the backside of the substrate; and (c) performing one or more wafer fabrication steps. Some or all the protective films may be removed and the method repeated multiple times during fabrication of the semiconductor device.

Cleaning Of Semiconductor Wafers By Contaminate Encapsulation

US Patent:
6776171, Aug 17, 2004
Filed:
Jun 27, 2001
Appl. No.:
09/892954
Inventors:
Nicole S. Carpenter - Burlington VT
Joseph R. Drennan - Winooski VT
Alison K. Easton - South Burlington VT
Casey J. Grant - Hinesburg VT
Andrew S. Hoadley - Belvidere VT
Joel M. Sharrow - South Hero VT
William A. Syverson - Colchester VT
Kenneth H. Yao - Essex Junction VT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B08B 700
US Classification:
134 13, 134 1, 134 4, 134 5, 134 6, 134 10, 134 17, 134 26, 134 33, 134 34
Abstract:
An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.

Cleaning Of Semiconductor Wafers By Contaminate Encapsulation

US Patent:
7531059, May 12, 2009
Filed:
Mar 10, 2004
Appl. No.:
10/798816
Inventors:
Nicole S Carpenter - Burlington VT, US
Joseph R Drennan - Winooski VT, US
Alison K Easton - South Burlington VT, US
Casey J Grant - Hinesburg VT, US
Andrew S Hoadley - Belvidere VT, US
Joel M Sharrow - South Hero VT, US
William A Syverson - Colchester VT, US
Kenneth H Yao - Essex Junction VT, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 21/00
C23C 16/00
C23C 14/00
US Classification:
1563451, 134 12, 134 13, 134 4, 134172
Abstract:
An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.

Possible Relatives

Margaret A Sharrow  Nancy L Sharrow  Ryan A Sharrow  Susan L Sharrow  Amy N Sharrow  Charles R Sharrow  Joel J Johnston  Joel B Whiting  Joel H Steckel  Joel A Steele 

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