Jon David Burnsed, Age 49Tempe, AZ

2023011, Apr 13, 2023

Oct 12, 2021

17/498998

- Melbourne FL, US
Jon D. Burnsed - Tempe AZ, US

H04N 5/235
H04N 5/225
H04N 5/238
H01L 27/32
G02B 27/01

An optical device includes an underlying device configured output light in a first spectrum. A stacked device is coupled to the underlying device is configured to be coupled in an overlapping fashion to an optical output of the underlying device. The stacked device is transparent to light in the first spectrum. The stacked device includes electro-optical circuits including: light emitters and detectors. Each detector is associated with one or more light emitters. Each detector is configured to detect light emitted from the underlying device. The light emitters are configured to output light dependent on light detected by an associated detector. Optical filters are optically coupled to an optical input of the underlying device. Each filter is aligned with a detector to suppress absorption of certain wavelengths of light by the underlying device thereby affecting light detected by the detectors and thus further affecting the light output by the light emitters.

2023009, Mar 30, 2023

Sep 24, 2021

17/485107

- Melbourne FL, US
Jon D. Burnsed - Tempe AZ, US

F41G 1/34
G02B 13/16
H01L 27/32

A transparent optical device configured to be used with an underlying device. The underlying device is configured to provide output light. The optical device is configured to transmit light from the underlying device through the optical device. The optical device includes first and second zones. The first zone includes a first plurality of transparent regions formed in the first zone allowing light to pass through from the underlying device. The second zone includes a second plurality of transparent regions formed in the second zone which allow light in the first spectrum to pass through from the underlying device at a different transmission efficiency than the first zone.

2023010, Mar 30, 2023

Sep 30, 2021

17/490983

- Melbourne FL, US
Jay Scott Tucker - Chandler AZ, US
Jon D. Burnsed - Tempe AZ, US

H04N 5/232
G06T 7/13
G06V 10/25
G06T 7/70
G02B 7/36
G02B 23/12

A nightvision system includes an underlying device that provides output light in a first spectrum. A transparent optical device transmits light in the first spectrum from the underlying device through the transparent optical device. The transparent optical device includes an active area of a semiconductor chip. The active area includes active elements that cause the underlying device to detect light from the underlying device and transparent regions formed in the active area which are transparent to the light in the first spectrum to allow light in the first spectrum to pass through from the underlying device to a user. An image processor processes images produced using light detected by the first plurality of active elements. An autofocus mechanism coupled to the image processor focuses the input light into the underlying device based on image processing performed by the image processor.

2023010, Mar 30, 2023

Sep 24, 2021

17/485118

- Melbourne FL, US
Jon D. Burnsed - Tempe AZ, US

G09G 3/3225

An optical device. The optical device includes an underlying device that is sensitive to input light, and provides output light in a first spectrum based on absorbing the input light. The optical device further includes a stacked device, formed in an active area of a single semiconductor chip, coupled in an overlapping fashion to the underlying device. The stacked device includes first and second zones. Each zone has a plurality of active elements having a particular lateral size, where the lateral size is different for each zone. Each zone also has a plurality of transparent regions formed in the stacked device which are transparent to the light in the first spectrum to allow light in the first spectrum to pass through from the underlying device. The transparent regions are configured in size and shape to cause each zone to have a particular transmission efficiency for light in the first spectrum

2023008, Mar 23, 2023

Nov 15, 2022

17/987157

- Melbourne FL, US
Jon Burnsed - Tempe AZ, US

G02B 23/12
G02B 27/01
H01L 27/32
H01L 51/56
H01L 51/00

Increasing transparency of one or more micro-displays. A method includes attaching a transparent cover to at least a portion of a semiconductor wafer. The at least a portion of the semiconductor wafer includes the one or more micro-displays. The one or more micro-displays include one or more active silicon areas. The method further includes, after the transparent cover has been attached to the at least a portion of the semiconductor wafer, removing silicon between one or more of the active silicon areas, causing the one or more micro-displays to have a transparency of at least 50%.

2021034, Nov 11, 2021

May 6, 2020

16/868306

- Melbourne FL, US
Jon Burnsed - Tempe AZ, US

G02B 23/12
G02B 27/01
H01L 27/32
H01L 51/00
H01L 51/56

Increasing transparency of one or more micro-displays. A method includes attaching a transparent cover to at least a portion of a semiconductor wafer. The at least a portion of the semiconductor wafer includes the one or more micro-displays. The one or more micro-displays include one or more active silicon areas. The method further includes, after the transparent cover has been attached to the at least a portion of the semiconductor wafer, removing silicon between one or more of the active silicon areas.