Inventors:
Darrell String - Havre de Grace MD, US
Jon William Turley - Conshohocken PA, US
International Classification:
B24D 11/00
Abstract:
A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer and a corresponding internal peripheral edge of the polishing layer; wherein the light transmissive window element is disposed within the internal opening and contacts the internal peripheral edge of the porous subpad layer; wherein the light transmissive window element is adhered to the pressure sensitive adhesive layer; wherein the porous subpad layer has been subjected to a first critical compressive force along the internal peripheral edge forming a first irreversibly collapsed, densified region of the porous subpad layer along the peripheral edge; wherein the porous subpad layer has been subjected to a second critical compressive force along the outer perimeter of the porous subpad layer forming a second irreversibly collapsed, densified region of the porous subpad layer along the outer perimeter of the porous subpad layer; wherein the polishing surface is adapted for polishing the substrate. Also provided is a method of making such multilayer chemical mechanical polishing pads and for using them to polish a substrate.
