Joseph A Toro, Age 96208 W 2Nd St, North Platte, NE 69101

5274911, Jan 4, 1994

Oct 21, 1991

7/780111

Joseph A. Toro - Ogallala NE

American Shizuki Corporation - Ogallala NE

H01R 4300

29827

An electrical device includes an electrical component encased in encasement material with leads electrically coupled to the component and extending through the encasement material for attachment to an electrical circuit. The leads include an internal region plated with solder for attachment to the component, an external region plated with solder for electrically coupling the component to a circuit board, and an intermediate region between the internal and external regions which is devoid of solder and which is positioned to be in contact with the encasement material to define an unplated interface between the lead and the encasement material. Leads having a center region devoid of solder plating may be formed by providing a lead frame, with selectively plated and punched regions of the lead frame to form the internal and external lead portions, plating the internal and external lead portions with solder and thereafter punching the center unplatted region to provide a plurality of leads having a center unplatted region. Components are thereafter electrically coupled to the solder plated internal portions of the leads on the lead frame with the leads and attached electrical components encased in an encasement material so that the encasement material is in direct contact with the unplatted center region of the leads.

4914547, Apr 3, 1990

May 6, 1988

7/190966

Joseph A. Toro - Ogallala NE
Thomas G. Johnson - Ogallala NE
Fred W. Olmsted - Ogallala NE

American Shizuki Corporation - Canoga Park CA

H01G 114
H01G 700
H05K 104

361323

An epoxy-encased wound capacitor suitable for being surface mounted and wave soldered to electronic circuitry, e. g. circuit boards and process for making the epoxy-encased wound capacitor. The wound capacitor is formed from winding together lengths of two bilaminar ribbons. The capacitor is then cured by exposing it to ultrasonic energy according to a predefined ultrasonic profile while at substantially the same time, mechanically pressing the capacitor. Contacts are formed on the capacitor and wire leads attached. Subsequently, the capacitor is placed in a flexible, reusable plastic mold featuring lead guides for precisely spacing the leads of the capacitor. Bubble-free epoxy is poured in the molds and heat cured. The epoxy-encased capacitor, suitable for surface mounting and wave soldering, is then removed from the mold.