Kai Ki Ng, Age 7713426 Bishop Way Dr, Houston, TX 77083

Kai Ng Phones & Addresses

13426 Bishop Way Dr, Houston, TX 77083 (281) 568-9501

Kingsport, TN

New York, NY

Work

Company: Selective first realty inc Address: 4110 Main St, Flushing, NY 11355 Phones: (718) 461-2510 Position: Founder Industries: Real Estate

Mentions for Kai Ki Ng

Career records & work history

Medicine Doctors

Kai Y. Ng

Specialties:
Internal Medicine
Work:
Kaiser Permanente Medical GroupKaiser Permanente Specialty Services
2238 Geary Blvd, San Francisco, CA 94115
(415) 833-2202 (phone) (415) 833-4322 (fax)
Site
Education:
Medical School
Northwestern University Feinberg School of Medicine
Graduated: 1998
Procedures:
Acupuncture, Destruction of Benign/Premalignant Skin Lesions, Skin Tags Removal, Vaccine Administration
Conditions:
Acute Sinusitis, Acute Upper Respiratory Tract Infections, Bronchial Asthma, Fractures, Dislocations, Derangement, and Sprains, Gastroesophageal Reflux Disease (GERD), Acne, Alopecia Areata, Anxiety Phobic Disorders, Benign Paroxysmal Positional Vertigo, Constipation, Contact Dermatitis, Depressive Disorders, Dermatitis, Diabetes Mellitus (DM), Disorders of Lipoid Metabolism, Erectile Dysfunction (ED), Gastritis and Duodenitis, Hearing Loss, Hemorrhoids, Hypertension (HTN), Infectious Liver Disease, Inguinal Hernia, Internal Derangement of Knee Cartilage, Menopausal and Postmenopausal Disorders, Migraine Headache, Mitral Valvular Disease, Osteoporosis, Otitis Media, Overweight and Obesity, Phlebitis and Thrombophlebitis, Plantar Warts, Pneumonia, Sciatica, Scoliosis or Kyphoscoliosis, Skin and Subcutaneous Infections, Substance Abuse and/or Dependency, Tinea Pedis, Tinea Unguium, Vitamin D Deficiency
Languages:
Chinese, English, Spanish
Description:
Dr. Ng graduated from the Northwestern University Feinberg School of Medicine in 1998. She works in San Francisco, CA and specializes in Internal Medicine. Dr. Ng is affiliated with Kaiser Foundation Hospital.
Kai Ng Photo 1

Kai Yan Ng

Specialties:
Internal Medicine
Education:
Northwestern University (1998)

Publications & IP owners

Us Patents

Die-Up Integrated Circuit Package With Grounded Stiffener

US Patent:
7573131, Aug 11, 2009
Filed:
Oct 27, 2006
Appl. No.:
11/588802
Inventors:
Cheng Qiang Cui - Singapore, SG
Kai C. Ng - East Meadow NY, US
Chee Wah Cheung - Wai Chai, HK
Assignee:
Compass Technology Co., Ltd. - Shatin, Hong Kong
International Classification:
H01L 23/34
H05K 7/20
H01L 21/00
US Classification:
257707, 257713, 257720, 257738, 257780, 257E23101, 361707, 361710, 438121, 438122
Abstract:
A printed circuit substrate is disposed on a bottom side of a stiffener. An IC die is disposed on a top side of the stiffener. The die is electrically connected onto the printed circuit substrate by wire bonding through an open slot in the stiffener. The die is not wire bonded to the stiffener. Solder balls are attached on a bottom side of the substrate and electrically connected to ground bond fingers of the substrate, and also are directly attached to solderable pads on the bottom side of the stiffener through open holes or plated through-holes on the substrate, so as to have the stiffener function as a ground plane and as a heat sink for power dissipation.

Isbn (Books And Publications)

Symmetric Multivariate And Related Distributions

Author:
Kai Wang Ng
ISBN #:
0412314304

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