Kan Lillian Chen, Age 961 Baldwin Ave UNIT 802, San Mateo, CA 94401

4962457, Oct 9, 1990

Oct 25, 1988

7/262360

Kan Chen - Ann Arbor MI
Robert D. Ervin - Plymouth MI

The University of Michigan - Ann Arbor MI

G08G 100

364443

An intelligent vehicle-highway system utilizes a transmitter installed on the vehicle for communicating with modules having memory elements for storing site-specific information, a receiver for receiving an enabling signal from the transceiver on the vehicle, and a transmitter for making the site-specific information available to the operator of the vehicle. The data storage system is installed in the vicinity of the roadway, such as alongside of the roadway, overhead of the roadway, or preferably embedded in the roadway itself so as to ensure communciation with vehicles within predetermined lanes. In a highly advantageous embodiment, the site-specific data can be changed by reprogramming an erasable memory with a memory programmer, which may be installed on a programming vehicle which is authorized to travel on the roadway for the purpose of reprogramming the data within the data storage systems. Such reprogramming may use access codes which prevent tampering with the stored data. Alternatively, reprogramming of the data storage systems can be performed with the use of local transmitters controlled by a centralized agency.

2014018, Jul 3, 2014

Jan 2, 2013

13/733133

KLA-Tencor Corporation - , US
Kan Chen - Fremont CA, US
Lisheng Gao - Morgan Hill CA, US
Junqing Huang - Fremont CA, US

KLA-TENCOR CORPORATION - Milpitas CA

G06T 7/00

382149

Methods and systems for detecting defects on a wafer are provided. One method includes identifying one or more characteristics of first raw output generated for a wafer that correspond to one or more geometrical characteristics of patterned features formed on the wafer and assigning individual output in second raw output generated for the wafer to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different.