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Kevin Layne Shipley, Age 52PO Box 828, Riverside, TX 77367

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Known as:
Kevin L Shipley
Related to:
Brenda Blackwell Orr 79

Kevin Shipley Phones & Addresses

Riverside, TX

Jackson, WY

Huntsville, TX

Houston, TX

Spring, TX

Work

Company: Kshipgroup Address: 1699 Romano Park Lane, Houston, TX 77090 Phones: (281) 705-5354 Position: Founder Industries: Services

Mentions for Kevin Layne Shipley

Kevin Shipley resumes & CV records

Resumes

Kevin Shipley Photo 44

Scout At National Scouting Report

Position:
Scout at National Scouting Report
Location:
Kingsport, Tennessee
Industry:
Sports
Work:
National Scouting Report since Oct 2012
Scout Maxim Healthcare Services - Chattanooga, Tennessee Area Aug 2011 - Oct 2012
Healthcare Recruiter D1 Sports Training Feb 2010 - Aug 2011
Recruiting Coordinator Bristol Rhythm and Roots Reunion Sep 2008 - Sep 2010
Event Volunteer TriCitiesSports.com - TN/VA/NC Dec 2007 - Feb 2010
Freelance Sports Writer Bristol Motor Speedway Aug 2009 - Aug 2009
Marketing and Sales Assistant HeadsUp Media Sep 2006 - Nov 2007
Director; Marketing and Business Development D1 Sports Training May 2006 - Aug 2006
Corporate Marketing Intern University of Tennessee Aug 2001 - Dec 2005
Student Athlete University of Tennessee Aug 2001 - Dec 2005
Student
Education:
2006-2007: University of Tennessee 2006 - 2007
of Education; Master of Science, Health and Human Services; Sport Marketing University of Tennessee-Knoxville 2001 - 2005
B.S., Mass Communications, Journalism & Electronic Media
Skills:
Event Planning, Sports, Press Releases, Media Relations, Feature Writing, Digital Marketing, Intercollegiate Athletics, Scouting, Marketing, Sports Management, Public Relations, Recruiting, Healthcare
Interests:
Almost Everything, at least once.
Languages:
Spanish
Kevin Shipley Photo 45

President At Community Development Bank

Position:
President at Community Develop,ent Bank
Location:
Ogema, Minnesota
Industry:
Banking
Work:
Community Develop,ent Bank
President
Kevin Shipley Photo 46

Nasa Space Technology Research Fellow At Purdue University

Position:
NASA Space Technology Research Fellow at Purdue University
Location:
West Lafayette, Indiana
Industry:
Aviation & Aerospace
Work:
Purdue University since Aug 2011
NASA Space Technology Research Fellow NASA Marshall Jul 2013 - Aug 2013
NASA Space Technology Research Fellow Center for Space Nuclear Research Jun 2010 - Aug 2011
Summer Research Fellow Center for Remote Sensing of Ice Sheets - University of Kansas May 2009 - May 2011
Composite Laboratory Research Assistant
Education:
Purdue 2011 - 2013
M.S., Aeronautics and Astronautics - propulsion University of Kansas 2007 - 2011

Publications & IP owners

Us Patents

Chemical Mechanical Polish Pad Conditioning Device

US Patent:
2002012, Sep 12, 2002
Filed:
Dec 20, 2000
Appl. No.:
09/751910
Inventors:
Kevin Shipley - Katy TX, US
Rick Messer - Austin TX, US
William Spencer - Thrall TX, US
International Classification:
B24B001/00
US Classification:
451/056000
Abstract:
A chemical mechanical polish pad conditioning device is disclosed. The device includes a conditioning substrate made of stainless steel forming a predetermined pattern on a surface. Also, a method of producing a chemical mechanical polish pad conditioning device is disclosed. The method includes providing a conditioning substrate made of stainless steel forming a predetermined pattern on a surface, and applying a hardening process to the surface of the conditioning substrate. The invention further discloses a method of conditioning a chemical mechanical polish pad. The method includes providing a conditioning substrate forming a predetermined pattern on a surface, fixing the conditioning substrate to a conditioning arm, and contacting the surface of the conditioning substrate with a polish pad and moving the conditioning substrate on the polish pad with a predetermined downforce at a predetermined rate of speed. Because the conditioning substrate does not use a diamond layer bonded to the substrate, there is no risk that detached diamonds may become embedded in the polish pad in the course of polishing. Under the configurations of the conditioning device, production of a custom conditioning device that meets specified cut-rate or surface roughness specifications can be achieved

Chemical Mechanical Polish Pad Conditioning Device

US Patent:
2003002, Feb 6, 2003
Filed:
Sep 19, 2002
Appl. No.:
10/247152
Inventors:
Kevin Shipley - Katy TX, US
Rick Messer - Austin TX, US
William Spencer - Thrall TX, US
International Classification:
B24B001/00
US Classification:
451/056000
Abstract:
A chemical mechanical polish pad conditioning device is disclosed. The device includes a conditioning substrate made of stainless steel forming a predetermined pattern on a surface. Also, a method of producing a chemical mechanical polish pad conditioning device is disclosed. The method includes providing a conditioning substrate made of stainless steel forming a predetermined pattern on a surface, and applying a hardening process to the surface of the conditioning substrate. The invention further discloses a method of conditioning a chemical mechanical polish pad. The method includes providing a conditioning substrate forming a predetermined pattern on a surface, fixing the conditioning substrate to a conditioning arm, and contacting the surface of the conditioning substrate with a polish pad and moving the conditioning substrate on the polish pad with a predetermined downforce at a predetermined rate of speed. Because the conditioning substrate does not use a diamond layer bonded to the substrate, there is no risk that detached diamonds may become embedded in the polish pad in the course of polishing. Under the configurations of the conditioning device, production of a custom conditioning device that meets specified cut-rate or surface roughness specifications can be achieved

Apparatus And Method For Cleaning Semiconductor Wafer

US Patent:
6110294, Aug 29, 2000
Filed:
Apr 14, 1998
Appl. No.:
9/060521
Inventors:
Kevin D. Shipley - Katy TX
Peter A. Burke - Avondale PA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
B08B 104
B08B 1100
US Classification:
134 6
Abstract:
A method and apparatus for cleaning a semiconductor wafer. The apparatus preferably includes a brush holder that may include a base and a connection stud extending from the base. The base preferably includes a receiving lip for receiving a brush that is disposed on its lower surface. The brush preferably includes a substantially flexible material and a plurality of protrusions for contacting a semiconductor wafer. A backing plate preferably is attached to one side of the brush for connecting the brush to the brush holder. The backing plate preferably further includes an outer edge capable of forming a snap-fit engagement within the receiving lip of the brush holder to: (a) facilitate periodic replacement of the brush and (b) form a mechanical connection between the brush and brush holder that can withstand the presence of relatively basic or acidic cleaning agents. A rotatable shaft is connected to the connection stud. The rotatable shaft includes a conduit running through the shaft for flowing cleaning fluid through a borehole in the connection stud and brush holder and through an opening in the backing plate and brush so that cleaning fluid may be directly dispensed through the shaft conduit to the wafer.

Possible Relatives

Dawn M Shipley  Dean A Shipley  Dale Shipley  Dana P Shipley  Debra L Shipley  Denise C Shipley  Dewey C Shipley  Kevin R Johnson  Kevin B Stanaland  Kevin B Johnston 

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