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Ki T LeeLos Angeles, CA

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Known as:
Ki Taik Lee

Ki Lee Phones & Addresses

Los Angeles, CA

Mentions for Ki T Lee

Career records & work history

Lawyers & Attorneys

Ki Lee Photo 1

Ki Jung Lee - Lawyer

Licenses:
Oregon - Active 2012
Ki Lee Photo 2

Ki Chang Lee - Lawyer

Address:
Hanol Law Offices
(600) 425-25xx (Office)
Licenses:
New York - Currently registered 1967
Education:
Brooklyn

Medicine Doctors

Ki Lee Photo 3

Dr. Ki S Lee, Los Angeles CA - MD (Doctor of Medicine)

Specialties:
Anesthesiology
Address:
4733 W Sunset Blvd, Los Angeles, CA 90027
(323) 783-4011 (Phone)
Certifications:
Anesthesiology, 1992
Awards:
Healthgrades Honor Roll
Languages:
English
Education:
Medical School
Baylor University
Graduated: 1987
Medical School
Baylor College Of Med
Graduated: 1987
Medical School
University Ca Irvine Med Center
Graduated: 1987
Ki Lee Photo 4

Dr. Ki B Lee, Huntington Park CA - DDS (Doctor of Dental Surgery)

Specialties:
Dentistry
Address:
7208 Pacific Blvd Suite 200, Huntington Park, CA 90255
(323) 582-2200 (Phone)
Languages:
English
Ki Lee Photo 5

Dr. Ki S Lee, La Palma CA - DC (Doctor of Chiropractic)

Specialties:
Chiropractic
Address:
7951 Valley View St, La Palma, CA 90623
(714) 994-1131 (Phone)
Languages:
English

Ki H. Lee

Specialties:
Epileptologist
Work:
Florida Hospital Medical GroupFlorida Epilepsy Center
615 E Princeton St STE 540, Orlando, FL 32803
(407) 303-8127 (phone) (407) 303-8197 (fax)
Site
Education:
Medical School
Seoul Natl Univ, Coll of Med, Chongno Ku, Seoul, So Korea
Graduated: 1990
Procedures:
Neurological Testing, Psychological and Neuropsychological Tests, Sleep and EEG Testing
Conditions:
Epilepsy, Peripheral Nerve Disorders
Languages:
English, Spanish
Description:
Dr. Lee graduated from the Seoul Natl Univ, Coll of Med, Chongno Ku, Seoul, So Korea in 1990. He works in Orlando, FL and specializes in Epileptologist. Dr. Lee is affiliated with Florida Hospital Orlando.

Ki N. Lee

Specialties:
Pain Management, Family Medicine
Work:
Ki N Lee MD
3947 Ferrara Dr, Silver Spring, MD 20906
(301) 942-9004 (phone)
Education:
Medical School
Kyungpook Natl Univ, Coll of Med, Taegu, So Korea
Graduated: 1966
Conditions:
Acute Bronchitis, Acute Sinusitis, Acute Upper Respiratory Tract Infections, Allergic Rhinitis, Anxiety Phobic Disorders, Bronchial Asthma, Contact Dermatitis, Diabetes Mellitus (DM), Disorders of Lipoid Metabolism, Gastroesophageal Reflux Disease (GERD), Hypertension (HTN), Osteoporosis, Skin and Subcutaneous Infections, Vitamin D Deficiency
Languages:
English, Korean
Description:
Dr. Lee graduated from the Kyungpook Natl Univ, Coll of Med, Taegu, So Korea in 1966. He works in Silver Spring, MD and specializes in Pain Management and Family Medicine. Dr. Lee is affiliated with Medstar Montgomery Medical Center.
Ki Lee Photo 6

Ki Sook Lee, Los Angeles CA

Specialties:
Anesthesiology
Obstetrics & Gynecology
Therapeutic Radiology
Work:
Kaiser Permanente Los Angeles Medical Center
4867 W Sunset Blvd, Los Angeles, CA 90027North County Ob-Gyn Medical
9850 Genesee Ave, La Jolla, CA 92037
Education:
Baylor College of Medicine (1987)
Ki Lee Photo 7

Ki Hyeong Lee

Specialties:
Neurology
Clinical Neurophysiology
Neurology with Special Qualifications in Child Neurology
Education:
Seoul National University (1990) *
Mcg Health, Inc (2002) *Neurology with Special Qualifications in Child Neurology
Medical College of Georgia (1998) *Clinical Neurophysiology
Ki Lee Photo 8

Ki Baek Lee, Huntington Park CA

Specialties:
Dentist
Address:
7208 Pacific Blvd, Huntington Park, CA 90255

License Records

Ki Chun Lee

Licenses:
License #: 2705122470 - Expired
Category: Contractor
Issued Date: Apr 28, 2008
Expiration Date: Apr 30, 2016
Type: Class C

Ki Hoon Lee

Licenses:
License #: 0225100686
Category: Real Estate Individual

Ki Lee resumes & CV records

Resumes

Ki Lee Photo 57

Ki Joon Lee - Centreville, VA

Work:
Hoseo Occupational Training College - Seoul, KR May 2014 to Dec 2014
Network administrator / IT support - part time International Digital Systems - Fort Lee, NJ Sep 2013 to Apr 2014
IT Support Edge Clothing Inc - Los Angeles, CA Feb 2013 to May 2013
IT Assistant Kenny Wholesale Electric, Inc - Los Angeles, CA Jan 2006 to Jul 2008
Technical support / Shipping Assistant Manager Navy Computer and Telecommunications Station - Republic of Korea, Navy Jul 1998 to Nov 2000
IT Support
Education:
Hoseo Technical college Jun 2014 to Dec 2014
Certificate of Network in security operations California State University May 2012
Bachelor of Science in Information System Yuhan College - Seoul, KR Jan 2004
Computer Science & Engineering
Ki Lee Photo 58

Ki Ho Lee - Garden Grove, CA

Work:
tm wireless - Orange, CA Jul 1997 to Jan 2010
retail
Education:
u.c.i - Irvine, CA 1993 to 1995
some college in bussiness
Ki Lee Photo 59

Ki Lee - Los Angeles, CA

Work:
JC SALES WHOLESALER - Los Angeles, CA Feb 2002 to Jul 2013
Buyer SKS TRADING COMPANY - Seattle, WA Jun 2000 to Dec 2001
Import / Export Traffic Controller
Education:
East Asian Languages - UNIVERSITY OF WASHINGTON - Seattle, WA
Bachelor of Arts

Publications & IP owners

Us Patents

Application Of Conductive Via Or Trench For Intra Module Emi Shielding

US Patent:
2022031, Sep 29, 2022
Filed:
Mar 22, 2022
Appl. No.:
17/655801
Inventors:
- Irvine CA, US
Hoang Mong Nguyen - Fountain Valley CA, US
Matthew Sean Read - Foothill Ranch CA, US
Howard E. Chen - Anaheim CA, US
Ki Wook Lee - Irvine CA, US
Yi Liu - San Diego CA, US
International Classification:
H01L 23/552
H01L 23/31
H01L 25/065
H01L 23/498
H01L 21/56
H01L 21/48
H01L 25/00
Abstract:
A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

Electronic Package And Method For Manufacturing An Electronic Package

US Patent:
2023011, Apr 13, 2023
Filed:
Oct 19, 2021
Appl. No.:
17/504911
Inventors:
- Irvine CA, US
Anthony James LoBianco - Irvine CA, US
Howard E. Chen - Anaheim CA, US
Ki Wook Lee - Irvine CA, US
Yi Liu - San Diego CA, US
International Classification:
H01L 23/498
H01L 21/56
H01L 21/48
H01L 23/31
H01L 25/10
H01L 25/00
Abstract:
An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.

Method Of Making A Closed Cavity Printed Circuit Board With Patterned Laminate Structure

US Patent:
2021031, Oct 7, 2021
Filed:
Apr 14, 2021
Appl. No.:
17/230367
Inventors:
- Irvine CA, US
Ki Wook Lee - Irvine CA, US
International Classification:
H05K 3/46
H01Q 1/38
H05K 1/16
Abstract:
A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

Method Of Making Printed Circuit Board Structure Including A Closed Cavity With Vias

US Patent:
2021031, Oct 7, 2021
Filed:
Apr 14, 2021
Appl. No.:
17/230584
Inventors:
- Irvine CA, US
Ki Wook Lee - Irvine CA, US
International Classification:
H05K 3/46
H01Q 1/38
H05K 1/16
Abstract:
A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

Printed Circuit Board Structure Including A Closed Cavity

US Patent:
2020039, Dec 17, 2020
Filed:
May 26, 2020
Appl. No.:
16/883631
Inventors:
- Woburn MA, US
Ki Wook Lee - Irvine CA, US
International Classification:
H01Q 1/38
H05K 3/46
H05K 3/42
H05K 1/11
H05K 1/02
H01Q 9/04
H01Q 1/24
H01Q 1/22
H01Q 1/36
Abstract:
A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.

Devices And Methods Related To Nested Filters

US Patent:
2020007, Mar 5, 2020
Filed:
Aug 31, 2019
Appl. No.:
16/558056
Inventors:
- Woburn MA, US
Ki Wook LEE - Irvine CA, US
Takeshi FURUSAWA - Toyonaka-Shi, JP
Sundeep Nand NANGALIA - Raleigh NC, US
Russ Alan REISNER - Oxnard CA, US
John C. BALDWIN - Simi Valley CA, US
International Classification:
H05K 1/02
H05K 1/18
H05K 1/11
H01Q 1/22
H04B 1/10
Abstract:
Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

Printed Circuit Board Structure Including A Closed Cavity

US Patent:
2018032, Nov 8, 2018
Filed:
May 1, 2018
Appl. No.:
15/967976
Inventors:
- Woburn MA, US
Ki Wook Lee - Irvine CA, US
International Classification:
H01Q 1/38
H05K 3/46
H05K 3/42
H05K 1/11
H05K 1/02
H01Q 9/04
H01Q 1/24
Abstract:
A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.

Method Of Making Printed Circuit Board Structure Including A Closed Cavity

US Patent:
2018032, Nov 8, 2018
Filed:
May 1, 2018
Appl. No.:
15/967955
Inventors:
- Woburn MA, US
Ki Wook Lee - Irvine CA, US
International Classification:
H05K 3/46
Abstract:
A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

Isbn (Books And Publications)

Present And Future Security Problems Of Korea: Csis Statesmen'S Forum Address May 8, 1987

Author:
Ki Baek Lee
ISBN #:
0892061081

Public records

Vehicle Records

Ki Lee

Address:
510 S Ardmore Ave APT 233, Los Angeles, CA 90020
Phone:
(213) 820-5039
VIN:
WDDHF5KBXCA564871
Make:
MERCEDES-BENZ
Model:
E-CLASS
Year:
2012

Ki Lee

Address:
510 S Ardmore Ave, Los Angeles, CA 90020
Phone:
(213) 820-5039
VIN:
WMWSV3C54BTY14525
Make:
MINI
Model:
COOPER
Year:
2011

Possible Relatives

Cynthia C Lee  Dawn P Lee  Dawna L Lee  Dawne E Lee  Deana M Lee  Deann A Lee  Deanna L Lee  Ki M Johnson  Ki S Jung  Ki Kim 

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