Kurt Roger Lehman, Age 59375 Elm St, Menlo Park, CA 94025

6433541, Aug 13, 2002

Aug 7, 2000

09/633198

Kurt R. Lehman - Menlo Park CA
Shing M. Lee - Fremont CA
John Fielden - Los Altos CA

KLA-Tencor Corporation - San Jose CA

G01B 706

324230, 324202, 32420712, 32420716, 324225, 324233, 324234, 438 13, 438 17

Disclosed is a method of obtaining information in-situ regarding a film of a sample using an eddy probe during a process for removing the film. The eddy probe has at least one sensing coil. An AC voltage is applied to the sensing coil(s) of the eddy probe. One or more first signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate the film of the sample. One or more second signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate to a reference material having a fixed composition and/or distance from the sensing coil. The first signals are calibrated based on the second signals so that undesired gain and/or phase changes within the first signals are corrected. A property value of the film is determined based on the calibrated first signals. An apparatus for performing the above described method is also disclosed.

6621264, Sep 16, 2003

Jun 5, 2002

10/166585

Kurt R. Lehman - Menlo Park CA
Shing M. Lee - Fremont CA
John Fielden - Los Altos CA

KLA-Tencor Corporation - San Jose CA

G01B 706

324230, 324226, 438 13, 438 17

A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and quadrature components of an induced AC voltage in the sensing coil, calibrating the first signal based on the measured second signal at a different separation from the sample and reference material, determining a conductance function relating conductance with location along the selected curve, processing the calibrated first voltage pairs to generate a lift-off curve, determining an intersection voltage pair representing intersection of the lift-off curve with a selected curve, and determining the conductance of the sample from the intersection voltage pair and the conductance function.

6628397, Sep 30, 2003

Sep 15, 1999

09/396143

Mehrdad Nikoonahad - Menlo Park CA
Shing M. Lee - Fremont CA
Kalman Kele - Santa Cruz CA
Guoheng Zhao - Milpitas CA
Kurt R. Lehman - Menlo Park CA

KLA-Tencor - San Jose CA

G01N 2155

356445

Disclosed is a self-clearing objective for directing a beam towards a sample and clearing away debris from an optical viewing path adjacent to the sample. The self-clearing objective includes an optical element and a substantially transparent fluid flowing between the optical element and the sample such that at least a portion adjacent to the sample is substantially cleared of debris. The optical element and the fluid cooperatively direct the beam towards the sample. This self-clearing objective may be coupled with various measurement devices to measure various characteristics of samples having debris that prevents clear optical measurements. Additionally, the measurement device may be integrated with or coupled to various sample processing systems so that the relevant process may be clearly monitored.

6707540, Mar 16, 2004

Aug 7, 2000

09/633800

Kurt R. Lehman - Menlo Park CA
Shing M. Lee - Fremont CA
John Fielden - Los Altos CA
Guoheng Zhao - Milpitas CA
Mehrdad Nikoonahad - Menlo Park CA

KLA-Tencor Corporation - San Jose CA

G01N 2100

356 72, 324230, 451 6

Disclosed is a chemical mechanical polishing (CMP) system for polishing a sample with a polishing agent and monitoring the sample. The CMP system includes a polishing table, a sample carrier arranged to hold the sample over the polishing table, and an eddy probe. The polishing table and sample carrier are arranged to receive a polishing agent between the sample and the polishing table and to polish the sample by moving the polishing table and the sample carrier relative to each other. The eddy probe is arranged to be operable to obtain a measurement of the sample while the sample is being polished. The CMP system further includes an optical measurement device arranged to be operable to obtain a measurement of the sample while the sample is being polished. The CMP system also has a memory and a processor coupled with the memory. The processor and memory are adapted for operating the eddy probe and optical measurement device.

6866559, Mar 15, 2005

Feb 4, 2003

10/358107

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies - Milpitas CA

B24B049/12

451 8, 451 6, 451 41

Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad are provided. One window includes a first portion and a second portion. The first portion includes a first material, and the second portion includes a second material different than the first. Another window includes a substantially transparent gel. In some instances, the gel includes a triblock copolymer and a plasticizing oil. An additional window includes an upper window, a housing, and a diaphragm. The housing may allow a fluid to flow into and out of a space between the housing and the diaphragm. In another embodiment, a window includes a layer of material coupled to lateral surfaces of the window. In some cases, the window may be disposed within an opening in a polishing pad, and movement of the window within the polishing pad may compress the layer of material.

6884146, Apr 26, 2005

Feb 4, 2003

10/358105

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

B24D049/00

451 5, 451 6, 451 8, 451 9, 451 41, 451285, 451286, 451287, 451288, 438 14, 438 15, 438 16, 438 17

Systems and methods for characterizing a polishing process are provided. One method includes scanning a specimen with two or more measurement devices during polishing. In one embodiment, the two or more measurement devices may include a reflectometer and a capacitance probe. In another embodiment, the two or more measurement devices may include an optical device and an eddy current device. An additional embodiment relates to a measurement device for scanning a specimen during polishing. The device includes a light source and a scanning assembly. The scanning assembly is configured to scan light from the light source across the specimen during polishing. Another measurement device includes a laser light source coupled to a first fiber optic bundle and a detector coupled to a second fiber optic bundle. An additional method includes scanning a specimen with different measurement devices during different steps of a polishing process.

6885190, Apr 26, 2005

Jul 21, 2003

10/623953

Kurt R. Lehman - Menlo Park CA, US
Shing M. Lee - Fremont CA, US
John Fielden - Los Altos CA, US

KLA-Tencor Corporation - San Jose CA

G01R033/12

324230, 324202, 32420712

A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and quadrature components of an induced AC voltage in the sensing coil, calibrating the first signal based on the measured second signal at a different separation from the sample and reference material, determining a conductance function relating conductance with location along the selected curve, processing the calibrated first voltage pairs to generate a lift-off curve, determining an intersection voltage pair representing intersection of the lift-off curve with a selected curve, and determining the conductance of the sample from the intersection voltage pair and the conductance function.

6935922, Aug 30, 2005

Feb 4, 2003

10/358106

Kurt Lehman - Menlo Park CA, US
Charles Chen - Sunnyvale CA, US
Ronald L. Allen - San Jose CA, US
Robert Shinagawa - Cupertino CA, US
Anantha Sethuraman - Palo Alto CA, US
Christopher F. Bevis - Los Gatos CA, US
Thanassis Trikas - Redwood City CA, US
Haiguang Chen - Millbrae CA, US
Ching Ling Meng - Fremont CA, US

KLA-Tencor Technologies Corp. - Milpitas CA

B24D049/00

451 5, 451 6, 451 8, 451 9, 451 41, 451285, 451286, 451287, 451288, 438 14, 438 15, 438 16, 438 17

Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing are provided. One method includes scanning a specimen with a measurement device during polishing to generate output signals at measurement spots on the specimen. The method may also include determining a characteristic of polishing at the measurement spots from the output signals. In addition, the method may include determining relative or absolute locations of the measurement spots on the specimen. The method may further include generating a two-dimensional map of the characteristic at the relative or absolute locations of the measurement spots on the specimen. In some embodiments, the relative locations of the measurement spots may be determined from a representative scan path of the measurement device and an average spacing between starting points on individual scans.