Inventors:
Liang Wang - Milpitas CA, US
Ilyas Mohammed - Santa Clara CA, US
Masud Beroz - Morrisville NC, US
Assignee:
INVENSAS CORPORATION - San Jose CA
International Classification:
H01L 29/06
H01L 29/04
H01L 29/12
H01L 33/08
H01L 21/20
US Classification:
257 52, 438 34, 438486, 257618, 257 76, 257E33002, 257E2109, 257E29022, 257E29068, 257E29003
Abstract:
High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.