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Lin L Han, Age 58Montgomery, NJ

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Known as:
Han Lin
Related to:
Bin Lin 58

Lin Han Phones & Addresses

Belle Mead, NJ

33 Shetland Ct, Edison, NJ 08817 (732) 205-0083

Princeton, NJ

Middlesex, NJ

Streamwood, IL

Woodbridge, NJ

Wakefield, MA

East Rutherford, NJ

Iselin, NJ

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Work

Company: Century Home Realty Group Address: Phones: (646) 662-8888 (Phone)

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Career records & work history

Real Estate Brokers

Lin Han Photo 1

Lin Han, New York - Agent

Specialties:
Residential sales
Luxury homes
First time home buyers
Relocation
Work:
Century Home Realty Group
(646) 662-8888 (Phone)
License #10401247484
Client type:
Home Buyers
Home Sellers
Property type:
Single Family Home
Condo/Townhome
Multi-family

Lin Han resumes & CV records

Resumes

Lin Han Photo 45

Lin Han

Lin Han Photo 46

Student At Princeton University

Position:
student at Princeton University
Location:
Greater New York City Area
Industry:
Publishing
Work:
Princeton University
student
Lin Han Photo 47

Lin Han

Location:
United States

Publications & IP owners

Us Patents

Hybrid Layers For Use In Coatings On Electronic Devices Or Other Articles

US Patent:
8592253, Nov 26, 2013
Filed:
May 5, 2009
Appl. No.:
12/990860
Inventors:
Prashant Mandlik - Princeton NJ, US
Sigurd Wagner - Princeton NJ, US
Jeffrey A. Silvernail - Yardley PA, US
Ruiqing Ma - Morristown NJ, US
Julia J. Brown - Yardley PA, US
Lin Han - Princeton NJ, US
Assignee:
The Trustees of Princeton University - Princeton NJ
Universal Display Corporation - Ewing NJ
International Classification:
H01L 21/44
H01L 21/48
US Classification:
438106, 438126
Abstract:
A method for protecting an electronic device comprising an organic device body. The method involves the use of a hybrid layer deposited by chemical vapor deposition. The hybrid layer comprises a mixture of a polymeric material and a non-polymeric material, wherein the weight ratio of polymeric to non-polymeric material is in the range of 95:5 to 5:95, and wherein the polymeric material and the non-polymeric material are created from the same source of precursor material. Also disclosed are techniques for impeding the lateral diffusion of environmental contaminants.

Hybrid Dielectric Material For Thin Film Transistors

US Patent:
2011006, Mar 24, 2011
Filed:
Nov 10, 2010
Appl. No.:
12/943398
Inventors:
Lin HAN - Princeton NJ, US
Prashant MANDLIK - Lawrenceville NJ, US
Sigurd WAGNER - Princeton NJ, US
Assignee:
THE TRUSTEES OF PRINCETON UNIVERSITY - PRINCETON NJ
International Classification:
H01L 51/50
H01L 33/08
US Classification:
257 40, 257 59, 257E33053, 257E51018
Abstract:
Thin-film transistors are made using a hybrid silica-silicone material as an insulating material. The hybrid silica-silicone material may be deposited by plasma-enhanced chemical vapor deposition from siloxanes and oxygen. These hybrid materials may be employed as the gate dielectric, as a subbing layer, and/or as a back channel passivating layer. The transistors may be made in any conventional TFT geometry.

Hybrid Dielectric Material For Thin Film Transistors

US Patent:
2011018, Jul 28, 2011
Filed:
Jul 30, 2009
Appl. No.:
13/056704
Inventors:
Lin Han - Princeton NJ, US
Prashant Mandlik - Lawrenceville NJ, US
Sigurd Wagner - Princeton NJ, US
International Classification:
H01L 51/52
H01L 51/10
H01L 29/786
H01L 29/04
H01L 21/316
US Classification:
257 40, 257 43, 257 57, 257 66, 438770, 257E29289, 257E29292, 257E29296, 257E51003, 257E51018, 257E29003, 257E21282
Abstract:
Thin-film transistors are made using an organosilicate glass (OSG) as an insulator material. The organosilicate glasses may be SiO-silicone hybrid materials deposited by plasma-enhanced chemical vapor deposition from siloxanes and oxygen. These hybrid materials may be employed as the gate dielectric, as a subbing layer, and/or as a back channel passivating layer. The transistors may be made in any conventional TFT geometry.

Electronic Device With Reduced Non-Device Edge Area

US Patent:
2013024, Sep 19, 2013
Filed:
Mar 16, 2012
Appl. No.:
13/422924
Inventors:
Prashant Mandlik - Lawrenceville NJ, US
Ruiqing Ma - Morristown NJ, US
Jeff Silvernail - Yardley PA, US
Julie J. Brown - Yardley PA, US
Lin Han - Princeton NJ, US
Sigurd Wagner - Princeton NJ, US
Luke Walski - Princeton NJ, US
Assignee:
Universal Display Corporation - Ewing NJ
International Classification:
H01L 23/28
H01L 21/78
H01L 21/56
H01L 23/48
US Classification:
257774, 257791, 438113, 438460, 438127, 257E23116, 257E23011, 257E21599, 257E21502
Abstract:
A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.

Hybrid Layers For Use In Coatings On Electronic Devices Or Other Articles

US Patent:
2014005, Feb 27, 2014
Filed:
Oct 29, 2013
Appl. No.:
14/065877
Inventors:
Jeffrey A. SILVERNAIL - Yardley PA, US
Ruiqing MA - Morristown NJ, US
Julia J. BROWN - Yardley PA, US
Lin HAN - Princeton NJ, US
Assignee:
UNIVERSAL DISPLAY CORPORATION - EWING NJ
THE TRUSTEES OF PRINCETON UNIVERSITY - PRINCETON NJ
International Classification:
H01L 51/52
US Classification:
257 40
Abstract:
A method for protecting an electronic device comprising an organic device body. The method involves the use of a hybrid layer deposited by chemical vapor deposition. The hybrid layer comprises a mixture of a polymeric material and a non-polymeric material, wherein the weight ratio of polymeric to non-polymeric material is in the range of 95:5 to 5:95, and wherein the polymeric material and the non-polymeric material are created from the same source of precursor material. Also disclosed are techniques for impeding the lateral diffusion of environmental contaminants.

Electronic Device With Reduced Non-Device Edge Area

US Patent:
2022019, Jun 23, 2022
Filed:
Mar 15, 2022
Appl. No.:
17/694887
Inventors:
- Ewing NJ, US
- Princeton NJ, US
Jeffrey SILVERNAIL - Yardley PA, US
Julia J. BROWN - Yardley PA, US
Lin HAN - Princeton NJ, US
Sigurd WAGNER - Princeton NJ, US
Luke WALSKI - Princeton NJ, US
International Classification:
H01L 51/52
H01L 25/04
H01L 25/075
H01L 27/32
H01L 51/56
Abstract:
A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.

Electronic Device With Reduced Non-Device Edge Area

US Patent:
2020005, Feb 20, 2020
Filed:
Oct 24, 2019
Appl. No.:
16/662095
Inventors:
- Ewing NJ, US
- Princeton NJ, US
Jeffrey SILVERNAIL - Yardley PA, US
Julia J. BROWN - Yardley PA, US
Lin HAN - Ewing NJ, US
Sigurd WAGNER - Princeton NJ, US
Luke WALSKI - Princeton NJ, US
International Classification:
H01L 51/52
H01L 51/56
H01L 27/32
H01L 25/075
Abstract:
A first product may be provided that comprises a substrate having a first surface, a first side, and a first edge where the first surface meets the first side; and a device disposed over the substrate, the device having a second side, where at least a first portion of the second side is disposed within 3 mm from the first edge of the substrate. The first product may further comprise a first barrier film that covers at least a portion of the first edge of the substrate, at least a portion of the first side of the substrate, and at least the first portion of the second side of the device.

Hybrid Layers For Use In Coatings On Electronic Devices Or Other Articles

US Patent:
2017001, Jan 19, 2017
Filed:
Jan 28, 2016
Appl. No.:
15/008834
Inventors:
- Princeton NJ, US
- Ewing NJ, US
Jeffrey A. Silvernail - Yardley PA, US
Ruiqing Ma - Morristown NJ, US
Julia J. Brown - Yardley PA, US
Lin Han - Princeton NJ, US
International Classification:
H01L 51/52
H01L 51/56
Abstract:
A method for protecting an electronic device comprising an organic device body. The method involves the use of a hybrid layer deposited by chemical vapor deposition. The hybrid layer comprises a mixture of a polymeric material and a non-polymeric material, wherein the weight ratio of polymeric to non-polymeric material is in the range of 95:5 to 5:95, and wherein the polymeric material and the non-polymeric material are created from the same source of precursor material. Also disclosed are techniques for impeding the lateral diffusion of environmental contaminants.

Possible Relatives

Dae S Han  Deborah K Han  Dan Han  Daniel C Han  Aaron C Han  Dennis D Han  Diana S Han  Lin K White  Lin Y Kam  Lin D Mei 

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