Hsiu H Lin, Age 88Bryn Mawr, PA

Hsiu Lin Phones & Addresses

Bryn Mawr, PA

108 Enderberry Cir, Syracuse, NY 13224

Winchester, MA

19 Alsun Dr, Hollis, NH 03049 (603) 465-3803

5202 Silver Fox Dr, Jamesville, NY 13078 (315) 446-0095

Cambridge, MA

New York, NY

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Mentions for Hsiu H Lin

Resumes & CV records

Resumes

Hsiu Lin Photo 23

Hsiu Lin

Skills:
Microsoft Office, Management
Hsiu Lin Photo 24

Hsiu Ling Lin

Hsiu Lin Photo 25

Hsiu Lin

Location:
United States
Hsiu Lin Photo 26

Hsiu Lin

Publications & IP owners

Us Patents

Metal Core Printed Circuit Board

US Patent:
4679122, Jul 7, 1987
Filed:
Jul 11, 1986
Appl. No.:
6/886751
Inventors:
Robert E. Belke - Clay NY
Raymond A. Shirk - North Syracuse NY
Hsiu H. Lin - Syracuse NY
Louis Zakraysek - Cicero NY
Assignee:
General Electric Company - Syracuse NY
International Classification:
H05K 105
US Classification:
361414
Abstract:
A novel metal core printed circuit board and a method of making it are described. The circuit board comprises a metal substrate, a patternable metal foil, and an insulating layer of thermoplastic resin whose glass transition temperature is exceeded during assembly under pressure to bond the resin to the metal substrate and to the foil by high temperature wetting. The circuit board also provides holes whose interior is lined with a resin united fusing to the resin in the insulating layer by high temperature wetting accompanied by pressure. The thermoplastic resin is a polyetherimide engineering plastic. The layers of the printed circuit board described above, including any additional layers of insulating resin and foil, may be bonded in a single step in a laminating press. The finished circuit board may be a structural component of a chassis, has good heat conductivity, good high voltage performance, is practical for high frequency transmission paths, is tolerant of the high temperature necessary for soldering, and has a high continuous service temperature.

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