Mark Gottfried DeceasedNew York, NY

7078319, Jul 18, 2006

Nov 16, 2001

10/432081

Ivan Eliashevich - Maplewood NJ, US
Mark Gottfried - Hillsborough NJ, US

GELcore LLC - Valley View OH

H01L 21/301
H01L 21/46
H01L 21/78

438463, 438948

A method for separating individual optoelectronic devices, such as LEDs, from a wafer includes directing a laser beam having a width toward a major surface of the semiconductor wafer. The laser beam has an image with a first portion of a first energy per unit width and a second portion of a second energy per unit width less than the first energy. The laser beam image cuts into the first major surface of the semiconductor wafer to produce individual devices.

7439599, Oct 21, 2008

Mar 14, 2005

11/079708

Xiang Gao - Edison NJ, US
Alex Ceruzzi - Princeton Junction NJ, US
Steve Schwed - Bridgewater NJ, US
Linlin Liu - Hillsborough NJ, US
Mark Gottfried - Hillsborough NJ, US

Emcore Corporation - Albuquerque NM

H01L 31/00

257443, 257458, 257466

A PIN photodiode, and a method of manufacturing a PIN photodiode that reduces dielectric delamination and increases device reliability. The process proceeds by forming an first type electrode layer on the substrate; forming an intrinsic layer of the first type electrode layer; forming a second type electrode layer on the intrinsic layer; etching the second type electrode layer to define a mesa shaped structure; and depositing a passivation material over the mesa shaped structure.

2003000, Jan 2, 2003

May 15, 2002

10/146267

James Nering - Summit NJ, US
Robert Karlicek - Santa Maria CA, US
Mark Gottfried - Hillsborough NJ, US
Ivan Eliashevich - South Orange NJ, US
Michael Brown - Valrico FL, US

H01L021/301

438/463000

A method for separating a semiconductor wafer into several thousand devices or die by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coated with a generally high level adhesive. The mounted wafer is then placed on a vacuum chuck (which is itself positioned on a computer controlled positioning table) to hold it in place during the cutting process. The cutting surface is then covered with a protective layer to prevent contamination from the effluent resulting from the actual cutting process. A laser beam is generated and passed through optical elements and masks to create a pattern, such as a line or multiple lines. The patterned laser projection is directed at the wafer at a substantially normal angle and applied to the wafer until at least a partial cut is achieved through it. A mechanical separation process completes the separation when only a partial cut is achieved by the patterned laser projection. The die are then transferred to a grip ring for further processing.