Mark R OjedaSan Jose, CA
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San Jose, CA
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Us Patents
Singulated Bare Die Testing
US Patent:
2008023, Sep 25, 2008
Filed:
Aug 8, 2007
Appl. No.:
11/835545
Inventors:
Robert Norbeck - Sunnyvale CA, US
Mark Ojeda - Sunnyvale CA, US
Ed Aquino - Sunnyvale CA, US
Mark Ojeda - Sunnyvale CA, US
Ed Aquino - Sunnyvale CA, US
Assignee:
SPANSION LLC - Sunnyvale CA
International Classification:
H01L 21/66
G01R 31/02
G01R 31/02
US Classification:
438 14, 324765, 257E21525
Abstract:
There is testing of individual dice prior to their inclusion in a multi-chip package. A wafer is sawn into individual dice and the dice are placed onto a die tray. If the tray is not full, then dice can be added that originate from other wafers. Contacts perform diagnostic tests upon the dice to determine if individual dice function as expected. Mapping talkes place to distinguish between dice that passed the diagnostic test and those that did not. Multiple tests can take place in series, where various forms of consolidation and mapping takes place. Passing dice can become part of a multi-chip package while failing dice can be re-screened or scrapped.
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