Matthew T Farinelli, Age 427911 Mustang Loop Rd, Park City, UT 84098

Matthew Farinelli Phones & Addresses

7911 Mustang Loop Rd, Park City, UT 84098

Heber City, UT

Brighton, MA

2 Elliott St, Danvers, MA 01923 (978) 777-0971

10 Drury Ln, Danvers, MA 01923 (978) 777-0971

Burlington, VT

Summit, UT

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Work

Company: Wolfgang man & beast May 2014 Position: Marketing manager

Education

School / High School: University of Vermont- Burlington, VT May 2005 Specialities: BA in English

Mentions for Matthew T Farinelli

Resumes & CV records

Resumes

Matthew Farinelli Photo 10

Matthew Farinelli - Park City, UT

Work:
Wolfgang Man & Beast May 2014 to 2000
Marketing Manager
GCommerce Solutions - Park City, UT Jun 2012 to May 2014
Business Development Manager/Project Manager
GCommerce Solutions - Park City, UT Oct 2011 to Jun 2012
Search Marketing Specialist
Skullcandy, Inc - Park City, UT May 2008 to May 2011
Accounts Receivable Manager
Education:
University of Vermont - Burlington, VT May 2005
BA in English

Publications & IP owners

Us Patents

Structure For Coupling Probes Of Probe Device To Corresponding Electrical Contacts On Product Substrate

US Patent:
7456640, Nov 25, 2008
Filed:
Feb 16, 2006
Appl. No.:
11/355726
Inventors:
Ronald Richard Breton - Richmond VT, US
S. Jay Chey - Ossining NY, US
Steven Alan Cordes - Yorktown Heights NY, US
Matthew Farinelli - Riverdale NY, US
Michael David Fregeau - Colchester VT, US
Sherif Ahmed Goma - White Plains NY, US
Gene T. Patrick - Richmond VT, US
Mohammed S. Shaikh - Essex Junction VT, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 31/02
US Classification:
324754, 324761, 324762
Abstract:
An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate including a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.

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