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Michael L Kropp, Age 5714430 659Th St, Wabasha, MN 55981

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Known as:
Michael E Kropp Michael K Kropp Mike L Kropp
Related to:
Donald D Kropp

Michael Kropp Phones & Addresses

27 Berna Blvd, Wabasha, MN 55981 (651) 565-3411

Albert Lea, MN

Windom, MN

Eden Prairie, MN

Glenville, MN

Saint Paul, MN

Mentions for Michael L Kropp

Michael Kropp resumes & CV records

Resumes

Michael Kropp Photo 43

Manager

Location:
Wabasha, MN
Industry:
Education Management
Work:
Wabasha-Kellogg High School
Manager
Michael Kropp Photo 44

Neighborhood Empowerment Supervisor At City Of Rock Hill

Location:
United States

Publications & IP owners

Us Patents

Method Of Producing A Laminated Structure

US Patent:
6395124, May 28, 2002
Filed:
Jul 30, 1999
Appl. No.:
09/365289
Inventors:
Joel D. Oxman - Minneapolis MN
Michael A. Kropp - Cottage Grove MN
Assignee:
3M Innovative Properties Company - St. Paul MN
International Classification:
B32B 3128
US Classification:
1562755, 1562757, 257778, 257783
Abstract:
A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above. The photopolymerizable adhesive composition can be applied directly to one or both surfaces of an aligned integrated chip and circuit board substrate or the chip aligned on an integrated circuit board substrate can be capillary underfilled with the photopolymerizable adhesive composition, which is subsequently cured. Data storage disks can also be prepared by the method of the invention.

Method Of Producing A Laminated Structure

US Patent:
6692611, Feb 17, 2004
Filed:
Nov 26, 2001
Appl. No.:
09/995038
Inventors:
Joel D. Oxman - Minneapolis MN
Michael A. Kropp - Cottage Grove MN
Peter B. Hogerton - White Bear Lake MN
Assignee:
3M Innovative Properties Company - St. Paul MN
International Classification:
B32B 3128
US Classification:
1562755, 1562757, 257778, 257783
Abstract:
A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above. The photopolymerizable adhesive composition can be applied directly to one or both surfaces of an aligned integrated chip and circuit board substrate or the chip aligned on an integrated circuit board substrate can be capillary underfilled with the photopolymerizable adhesive composition, which is subsequently cured. Data storage disks can also be prepared by the method of the invention.

Fluxing Compositions

US Patent:
2003011, Jun 19, 2003
Filed:
Sep 4, 2001
Appl. No.:
09/946013
Inventors:
Robert Kinney - Woodbury MN, US
Michael Kropp - Cottage Grove MN, US
Scott Charles - Hudson WI, US
Assignee:
3M Innovative Properties Company
International Classification:
B23K001/20
B23K031/02
B23K035/34
US Classification:
228/223000, 228/180220, 148/023000
Abstract:
The present invention provides for a chelate fluxing agent, its use in fluxing compositions, and its use in soldering methods. The fluxing agents as described herein, when combined with a resin such as thermosetting resins, thermoplastic resins or a combination thereof, afford compositions suitable for use as underfill adhesives. The present invention also provides for an electrical component assembly and methods for producing an electrical component assembly including such underfill adhesive compositions.

Segmented Curable Transfer Tapes

US Patent:
2003022, Dec 4, 2003
Filed:
May 28, 2002
Appl. No.:
10/157260
Inventors:
Larry Meixner - Woodbury MN, US
Leslie LeBow - St. Paul MN, US
Susan Noe - St. Paul MN, US
Michael Kropp - Cottage Grove MN, US
Assignee:
3M Innovative Properties Company
International Classification:
B32B001/00
US Classification:
156/230000, 428/040100, 428/337000
Abstract:
An adhesive transfer tape including an embossed carrier web having recesses embossed therein and a curable adhesive precursor coated into the recesses is disclosed.

Method Of Producing A Laminated Structure

US Patent:
2004013, Jul 15, 2004
Filed:
Dec 22, 2003
Appl. No.:
10/744264
Inventors:
Joel Oxman - Minneapolis MN, US
Michael Kropp - Cottage Grove MN, US
Peter Hogerton - White Bear Lake MN, US
Assignee:
3M Innovative Properties Company
International Classification:
B32B031/00
US Classification:
156/275500
Abstract:
A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above. The photopolymerizable adhesive composition can be applied directly to one or both surfaces of an aligned integrated chip and circuit board substrate or the chip aligned on an integrated circuit board substrate can be capillary underfilled with the photopolymerizable adhesive composition, which is subsequently cured. Data storage disks can also be prepared by the method of the invention.

Anisotropic Conductive Adhesive Composition

US Patent:
2006011, May 25, 2006
Filed:
Nov 19, 2004
Appl. No.:
10/992931
Inventors:
Glen Connell - Pine Springs MN, US
Michael Kropp - Cottage Grove MN, US
Eric Larson - Lake Elmo MN, US
International Classification:
B32B 27/38
C08L 63/00
B32B 37/00
US Classification:
428414000, 428413000, 523427000, 525523000
Abstract:
The invention provides anisotropically conductive adhesive compositions which comprise a mixture of: a cycloaliphatic epoxide resin; an omega hydroxyl ester-modified phenoxy resin; optionally, a multifunctional glycidyl ether epoxide resin; optionally, a thermoplastic resin; thermally activated catalyst; and electrically conductive particles.

Anisotropic Conductive Adhesive Compositions

US Patent:
2007011, May 24, 2007
Filed:
Oct 27, 2006
Appl. No.:
11/553523
Inventors:
Glen Connell - Pine Springs MN, US
Michael Kropp - Cottage Grove MN, US
Eric Larson - Lake Elmo MN, US
International Classification:
B32B 27/38
C08L 63/00
B32B 37/00
US Classification:
428413000, 428901000, 523400000, 525533000
Abstract:
The invention provides anisotropically conductive adhesive compositions, which comprise a mixture of a multifunctional glycidyl ether epoxy resin, a phenoxy resin, a core-shell polymer, optionally a thermoplastic resin, a thermally activated curing agent, and electrically conductive particles.

Layered Body And Method For Manufacturing Thin Substrate Using The Layered Body

US Patent:
2009001, Jan 15, 2009
Filed:
Jul 13, 2007
Appl. No.:
11/777328
Inventors:
Richard J. WEBB - Inver Grove Heights MN, US
Michael A. Kropp - Cottage Grove MN, US
International Classification:
H01L 21/469
US Classification:
428521, 156153, 156285, 438759, 257E21487
Abstract:
Provided is a layered body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body comprising a substrate to be ground, a joining layer including a curable adhesive in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Possible Relatives

Deborah K Kropp  Donna S Kropp  Edward C Kropp  Eric R Kropp  Harold C Kropp  Jennifer J Kropp  Jerome C Kropp  Michael A Last  Michael D Stanaland  Michael Stanberry 

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