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Neil S Mclellan, Age 53476 Lovely St, Avon, CT 06001

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Known as:
Neil Stuart Mclellan Neil X Mclellan Neil L Mclellan Neil S Mclennan

Neil Mclellan Phones & Addresses

476 Lovely St, Avon, CT 06001 (860) 673-9177

Litchfield, CT

Canton, CT

14616 Waterview Cir, Addison, TX 75001 (972) 247-4556 (972) 488-1935

Windsor, CT

Sioux Falls, SD

Dallas, TX

476 Lovely St, Avon, CT 06001 (860) 803-0230

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Work

Position: Service Occupations

Mentions for Neil S Mclellan

Neil Mclellan resumes & CV records

Resumes

Neil Mclellan Photo 35

Assistant Vice President Life And Disability Technology

Location:
Hartford, CT
Industry:
Insurance
Work:
The Hartford Jul 2003 - Apr 2014
Director Actuarial Technology Symetra Jul 2003 - Apr 2014
Assistant Vice President Life and Disability Technology Lincoln Financial Group Oct 2001 - Jul 2003
Director, Mis Data Warehouse Pwc Jun 1999 - Oct 2001
Senior Conslutant Deloitte Jul 1994 - Jun 1999
Senior Consultant
Education:
Brunel University London 1998 - 2000
Bachelors, Bachelor of Science Brunel University London 1990 - 1994
Bachelors, Bachelor of Science, Computer Science, Management Ulverston Victoria High School
Brunel University London
Masters, Master of International Studies
Skills:
Insurance, Business Intelligence, Data Warehousing, Business Analysis, It Strategy, Sdlc, Requirements Analysis, Data Modeling, Requirements Gathering, Business Requirements, Employee Benefits, Enterprise Architecture, Vendor Management, Project Portfolio Management, Disability Insurance, Pmo, Visio, Agile Methodologies, Business Objects, It Solutions, Predictive Analytics, Software Development, Group Life, Agile Methodolgy
Languages:
French
German
Neil Mclellan Photo 36

Neil Mclellan

Neil Mclellan Photo 37

Neil Mclellan

Publications & IP owners

Wikipedia

Neil Mclellan Photo 38

Neil Mclellan

Neil McLellan is a producer and programmer. Neil McLellan currently works in New York City as the creative director of a family of an international, multi-service production ...
Neil Mclellan Photo 39

Cowboy (Album)

Cowboy was produced by Gareth Jones and Neil McLellan and marked the band's return to more simplistic three-minute synthpop music. After disappointing sales and chart placing of their ...

Us Patents

Low Profile Sockets And Modules For Surface Mountable Applications

US Patent:
5528463, Jun 18, 1996
Filed:
Jul 16, 1993
Appl. No.:
8/092631
Inventors:
Neil McLellan - Garland TX
Mike Strittmatter - Carrollton TX
Joseph P. Hundt - Corinth TX
Christopher M. Sells - Carrollton TX
Francis A. Scherpenberg - Carrollton TX
Assignee:
Dallas Semiconductor Corp. - Dallas TX
International Classification:
H01R 2368
US Classification:
361785
Abstract:
A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.

Thermal Protection Of Electrical Elements Systems

US Patent:
6021046, Feb 1, 2000
Filed:
Dec 15, 1995
Appl. No.:
8/573600
Inventors:
Neil McLellan - Garland TX
Mike Strittmatter - Carrollton TX
Assignee:
Dallas Semiconductor Corporation - Dallas TX
International Classification:
H05K 720
US Classification:
361719
Abstract:
A thermal protection system that comprises an assembly of at least one electrical component and a heat shield surrounding the electrical component, wherein the heat shield forms a pocket between the electrical element and the heat shield and associated methods. The electrical element has at least one electrical lead. The system permits the electrical lead(s) to increase in temperature sufficient to permit soldering of the electrical lead(s) to a second electrical element. The thermal protection system also comprises a heat sink to protect the electrical element, which comprises a heat capacity material. The system also comprises electrical lead(s) with a low-cross sectional area.

Power Cap

US Patent:
5892304, Apr 6, 1999
Filed:
Sep 23, 1997
Appl. No.:
8/935967
Inventors:
Neil McLellan - Garland TX
Mark A. Gerber - Plano TX
Michael K. Strittmatter - Carrollton TX
Joseph P. Hundt - Corinth TX
Assignee:
Dallas Semiconductor - Dallas TX
International Classification:
H01L 2312
US Classification:
307150
Abstract:
The power cap includes a power supply positioned between a cover and a base. The cover is provided with clips to permit the attachment and detachment of the cover to the power supply and the base. The base is provided with surface mounted NRTC or NVSRAM chips and electrical contacts. The power supply is provided with a crystal oscillator and a battery for controlling the operation of the NRTC or NVSRAM chips, and spring contacts for maintaining the electrical connection between the base and the power supply.

Method Of Assembling Electronic Component

US Patent:
5647121, Jul 15, 1997
Filed:
Jun 7, 1995
Appl. No.:
8/487821
Inventors:
Neil McLellan - Garland TX
Mike Strittmatter - Carrollton TX
Joseph Patrick Hundt - Corinth TX
Christopher M. Sells - Carrollton TX
Francis A. Scherpenberg - Carrollton TX
Assignee:
Dallas Semiconductor Corporation - Dallas TX
International Classification:
H05K 334
US Classification:
29840
Abstract:
A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.

Power Cap

US Patent:
5682068, Oct 28, 1997
Filed:
Dec 7, 1995
Appl. No.:
8/568851
Inventors:
Neil McLellan - Garland TX
Mark A. Gerber - Plano TX
Michael K. Strittmatter - Carrollton TX
Joseph P. Hundt - Corinth TX
Assignee:
Dallas Semiconductor Corp. - Dallas TX
International Classification:
H01L 2312
US Classification:
307150
Abstract:
The power cap includes a power supply positioned between a cover and a base. The cover is provided with clips to permit the attachment and detachment of the cover to the power supply and the base. The base is provided with surface mounted NRTC or NVSRAM chips and electrical contacts. The power supply is provided with a crystal oscillator and a battery for controlling the operation of the NRTC or NVSRAM chips, and spring contacts for maintaining the electrical connection between the base and the power supply.

Flexible Film Semiconductor Package

US Patent:
5130783, Jul 14, 1992
Filed:
Mar 4, 1991
Appl. No.:
7/664170
Inventors:
Neil R. McLellan - Garland TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 2330
H01L 2304
H01L 2308
US Classification:
357 74
Abstract:
A thin film package is formed using a lost cost TAB interconnection on a semiconductor device and sandwiching the device between thin films of plastic to form a sealed, thin, light weight package for the semiconductor device.

Method Of Providing Thermal Protection Of Electrical Elements

US Patent:
5913552, Jun 22, 1999
Filed:
Aug 19, 1997
Appl. No.:
8/914401
Inventors:
Neil McLellan - Garland TX
Mike Strittmatter - Carrollton TX
Assignee:
Dallas Semiconductor Corporation - Dallas TX
International Classification:
H05K 300
US Classification:
29843
Abstract:
A thermal protection system that assembly of at least one electrical components and a heat shield surrounding the electrical component, wherein the heat shield forms a pocket between the electrical element and the heat shield and associated methods. The electrical element has at least one electrical lead. The system permits the electrical lead(s) to increase in temperature sufficient to permit soldering of the electrical lead(s) to a second electrical element. The thermal protection system also comprises a heat sink to protect the electrical element, which comprises a heat capacity material. The system also comprises electrical lead(s) with a low-cross sectional area.

Delayed Reflow Alloy Mix Solder Paste

US Patent:
4865654, Sep 12, 1989
Filed:
Dec 17, 1987
Appl. No.:
7/134394
Inventors:
Neil R. McLellan - Dallas TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
B23K 3534
US Classification:
148 24
Abstract:
A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilize a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 100% tin and 150 micron particles of an alloy of 10% tin and 90% lead. Included in the process of soldering components to the circuit board is the step of prebaking the circuit board with solder paste and components in their proper place on the board.

Possible Relatives

Dennis P Mclellan  Diane Mclellan  Donna C Mclellan  Dora K Mclellan  Doug A Mclellan  Eric W Mclellan  Evelyn L Mclellan  Neil T Johnston  Neil G White  Neil F Stanley 

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