Paul James Ciccolo, Age 73146 Cordaville Rd, Ashland, MA 01721

Paul Ciccolo Phones & Addresses

146 Cordaville Rd, Ashland, MA 01721 (508) 881-2397

Naples, FL

Franklin, MA

Intervale, NH

Holliston, MA

Work

Position: Sales/Service

Education

Degree: Associate degree or higher

Mentions for Paul James Ciccolo

Paul Ciccolo resumes & CV records

Resumes

Paul Ciccolo Photo 4

Senior Principal Product Development Manager

Location:
146 Cordaville Rd, Ashland, MA 01721
Industry:
Chemicals
Work:
Rohm and Hass Electroincs Material 1976 - 2006
Senior Global Enginneer
Shipley 1976 - 2006
Senior Global Process Engineer
The Dow Chemical Company 1976 - 2006
Senior Principal Product Development Manager
Education:
Framingham State University 1972 - 1976
Bachelors, Bachelor of Science, Earth Science, Geography
Boston State College
Skills:
Process Engineering, R&D, Product Development, Design of Experiments, Coatings, Process Simulation, Polymers, Chemical Engineering, Six Sigma, Chemistry, Materials Science, Manufacturing, Spc, Nanotechnology, Electrochemistry, Materials, Root Cause Analysis, Thin Films, Engineering, Plastics, Characterization, Process Improvement, Engineering Management, Process Optimization, Surface Chemistry, Analytical Chemistry, Iso, Polymer Science, Semiconductors, Electronics, Polymer Chemistry, Adhesives, Electroplating, Failure Analysis
Interests:
Children
Education
Environment
Science and Technology
Disaster and Humanitarian Relief
Human Rights
Animal Welfare
Health
Paul Ciccolo Photo 5

Paul Ciccolo

Paul Ciccolo Photo 6

Paul Ciccolo

Location:
United States

Publications & IP owners

Us Patents

Pretreatment Process For Electroless Plating Of Polyimides

US Patent:
5178956, Jan 12, 1993
Filed:
Oct 3, 1989
Appl. No.:
7/416535
Inventors:
James Rychwalski - Medway MA
Paul J. Ciccolo - Ashland MA
Edward C. Couble - Brockton MA
Assignee:
Shipley Company Inc. - Newton MA
International Classification:
C23C 2600
US Classification:
428458
Abstract:
A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.

Conditioning Process For Electroless Plating Of Polyetherimides

US Patent:
5441770, Aug 15, 1995
Filed:
Aug 14, 1991
Appl. No.:
7/747443
Inventors:
James E. Rychwalski - Medway MA
Paul J. Ciccolo - Ashland MA
Robert B. Currie - Berkley MA
Philip D. Knudsen - Northboro MA
Assignee:
Shipley Company Inc. - Marlborough MA
International Classification:
B05D 100
US Classification:
427306
Abstract:
A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.

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