Paul Rourke DeceasedBoston, MA

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Roxbury, MA

538 Talbot Ave APT 21, Dorchestr Ctr, MA 02124 (617) 407-9023

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Position: Administrative Support Occupations, Including Clerical Occupations

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Publications & IP owners

Us Patents

Thermal Mismatch Compensation Technique For Integrated Circuit Assemblies

US Patent:
6675600, Jan 13, 2004
Filed:
Dec 5, 2002
Appl. No.:
10/310230
Inventors:
Gene A. Robillard - Stoneham MA
Richard S. Holland - Framingham MA
Robert N. Graney - Northboro MA
John W. Marciniec - Framingham MA
John D. Mullarkey - Salem MA
Paul H. Rourke - Pelham NH
Assignee:
BAE Systems Information and Electronic Systems Integration Inc. - Nashua NH
International Classification:
F25D 2312
US Classification:
622592, 438 73, 25033903, 250352, 165 81
Abstract:
Techniques for minimizing stress induced by temperature changes in an integrated circuit (e. g. , focal plane array or processor) or other such assemblies that include materials having mismatched coefficients of thermal expansion/contraction are disclosed. A thermal interface including a flexible comb-like pattern enables compensation for mismatched coefficients thereby reducing thermal-related stress.

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