Peter J Nystrom, Age 57Webster, NY

Peter Nystrom Phones & Addresses

Webster, NY

Rochester, NY

62 Glenwood Dr, Webster, NY 14580

Work

Position: Professional/Technical

Education

Degree: Associate degree or higher

Emails

p***m@msn.com

Mentions for Peter J Nystrom

Professional Records

License Records

Peter Nystrom

Licenses:
License #: E-8021 - Expired
Category: Engineering Intern

Resumes

Resumes

Peter Nystrom Photo 1

Peter Nystrom

Position:
Senior Research Engineer/Electrical at Xerox Corporation
Location:
Rochester, New York Area
Industry:
Research
Work:
Xerox Corporation since Aug 1987
Senior Research Engineer/Electrical
Xerox Corporation May 1985 - Aug 1987
Engineering Technician
Redcom Laboratories May 1980 - May 1985
Technician
Education:
Rochester Institute of Technology 1990
MS, Computer ScienceLanguage Theory, Architecture, Genetic Algorithms (Thesis)
Rochester Institute of Technology 1987
BS, Electrical EngineeringEmbedded Systems, Digital Signal Processing, Digital Logic
Skills:
Silicon Device Design & Packaging - MEMS, Ink Jet, other, Electrical and Mechanical
Interests:
Camping, Hiking, Homebrewing, BBQ/Smoking, Automotive, Construction/Landscaping, Ice Hockey
Honor & Awards:
16 US Patents
Peter Nystrom Photo 2

Chief Operating Officer & Ase

Position:
Cheif Operating Officer & ASE at Ventura County Council, BSA
Location:
Camarillo, California
Industry:
Nonprofit Organization Management
Work:
Ventura County Council, BSA - Camarillo, CA since Sep 2010
Cheif Operating Officer & ASE
Education:
Lafayette College 1991 - 1996
Peter Nystrom Photo 3

Peter Nystrom

Publications

Us Patents

Method And Apparatus For Transferring Heat From A Thermal Inkjet Printhead Substrate Using A Heat Sink

US Patent:
6343848, Feb 5, 2002
Filed:
Jan 19, 1999
Appl. No.:
09/232820
Inventors:
Richard H. Berg - Greece NY
Peter J. Nystrom - Webster NY
Assignee:
Xerox Corporation - Stamford CT
International Classification:
B41J 29377
US Classification:
347 18
Abstract:
A heat sink, provides a heat transfer pathway to remove heat from the rear face of a printhead substrate. The heat sink is located between the printhead substrate and the printer carriage. The heat sink may, in one embodiment, be biased to float substantially normal to the rear face of a printhead substrate using a biasing device, such as one or more springs, or a one or more spring clips. The springs, which are compressed, tend to urge the face of the heat sink against the back face of the printhead, forming an interface between the two faces. Additional force can be provided by a carriage arm, as its radius acts as a moment arm to assist in pressing the two faces together. A low thermal heat conductivity contact resistance and an improved thermal resistance to heat dissipation between the printhead substrate and the heat sink are provided by the high pressure interface resulting from the use of the springs and the radius of the carriage arm. An additional layer of heat conductive material can be provided at the interface of the heat sink and the printhead substrate. This can reduce the ability of air pockets to form between the heat sink and the printhead substrate.

Ink Jet Printing Systems And Methods With Pre-Fill And Dimple Design

US Patent:
2013016, Jun 27, 2013
Filed:
Feb 20, 2013
Appl. No.:
13/772201
Inventors:
Xerox Corporation - Norwalk CT,
Richard P. Germain - Webster NY,
Joseph A. Degroot - Hamilton MI,
Peter J. Nystrom - Webster NY,
Jun Ma - Penfield NY,
Assignee:
XEROX CORPORATION - Norwalk CT
International Classification:
B41J 2/045
US Classification:
347 54
Abstract:
Systems and methods of ejecting ink drops from an inkjet printer are disclosed. The systems and methods can include a printhead with one or more actuators with associated nozzles and membranes. A voltage waveform can be applied to the actuators to fill the actuators with a volume of ink and eject the ink through the nozzles as ink drops. The voltage waveform can have associated pre-fill voltage to fill the actuator with ink and a firing voltage to eject the ink. The actuator membranes can have multi-height dimples to protect the membranes from contacting electrodes and reduce the electric field.

In Situ Flexible Circuit Embossing To Form An Electrical Interconnect

US Patent:
8584331, Nov 19, 2013
Filed:
Sep 14, 2011
Appl. No.:
13/232465
Inventors:
Bryan R Dolan - Rochester NY,
Peter J Nystrom - Webster NY,
Assignee:
Xerox Corporation - Norwalk CT
International Classification:
H04R 17/10
B41J 2/045
H05K 3/30
US Classification:
29 2535, 298901, 29829, 29844, 174254, 347 50, 347 68, 347 71, 310328, 310365
Abstract:
A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i. e. , contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit.

High Density Multilayer Interconnect For Print Head

US Patent:
8585183, Nov 19, 2013
Filed:
Mar 22, 2011
Appl. No.:
13/053968
Inventors:
Peter J. Nystrom - Webster NY,
Mark A. Cellura - Webster NY,
Gary Daniel Redding - Victor NY,
Assignee:
Xerox Corporation - Norwalk CT
International Classification:
B41J 2/045
US Classification:
347 68
Abstract:
A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm, dispensing an interstitial layer over the diaphragm, and forming a plurality of patterned conductive traces on the interstitial layer to physically and electrically contact the plurality of piezoelectric elements. The plurality of patterned traces can be formed using, for example, photolithography, a lift-off process, laser ablation, etc. Electrical communication between the plurality of patterned conductive traces and the plurality of piezoelectric elements can be established through surface contact between the two structures, without the requirement of a separate conductor.

High Density Electrical Interconnect Using Limited Density Flex Circuits

US Patent:
8585185, Nov 19, 2013
Filed:
Sep 22, 2011
Appl. No.:
13/240829
Inventors:
Peter J Nystrom - Webster NY,
Scott Taylor Treece - Portland OR,
Bryan R Dolan - Rochester NY,
Assignee:
Xerox Corporation - Norwalk CT
International Classification:
B41J 2/045
US Classification:
347 68, 347 71, 347 72, 347 50, 347 58
Abstract:
A method and structure for an ink jet print head which includes the use of two or more flexible circuits and a piezoelectric element array. A first pad array is included on a first flex circuit to power a first portion of the piezoelectric element array of the print head, and a second pad array is included on a second flex circuit to power a second portion of the piezoelectric element array of the print head. Using two flex circuits requires only half as many traces to be formed on each flex circuit, which can relax spacing requirements and design tolerances.

High Density Electrical Interconnect For Printing Devices Using Flex Circuits And Dielectric Underfill

US Patent:
8585187, Nov 19, 2013
Filed:
Apr 29, 2011
Appl. No.:
13/097182
Inventors:
Peter J. Nystrom - Webster NY,
Gary D. Redding - Victor NY,
Mark A. Cellura - Webster NY,
Assignee:
Xerox Corporation - Norwalk CT
International Classification:
B41J 2/045
H01L 41/22
US Classification:
347 70, 29 2535
Abstract:
A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.

Process For Adding Thermoset Layer To Piezoelectric Printhead

US Patent:
8608293, Dec 17, 2013
Filed:
Oct 24, 2011
Appl. No.:
13/279778
Inventors:
Gary D Redding - Victor NY,
Bryan R Dolan - Rochester NY,
Mark A Cellura - Webster NY,
Peter J Nystrom - Webster NY,
Assignee:
Xerox Corporation - Norwalk CT
International Classification:
B41J 2/045
B21D 51/16
B23P 17/00
US Classification:
347 68, 298901
Abstract:
Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.

Independent Adjustment Of Drop Mass And Velocity Using Stepped Nozzles

US Patent:
8646875, Feb 11, 2014
Filed:
Mar 31, 2010
Appl. No.:
12/751077
Inventors:
Peter M. Gulvin - Webster NY,
John R. Andrews - Fairport NY,
Gerald A. Domoto - Briarcliff Manor NY,
Nicholas P. Kladias - Flushing NY,
Peter J. Nystrom - Webster NY,
Assignee:
Xerox Corporation - Norwalk CT
International Classification:
B41J 2/14
B41J 2/16
US Classification:
347 47, 298901
Abstract:
Methods and systems of ejecting ink drops from an inkjet printer are disclosed. The methods and systems can include a printhead with one or more stepped nozzles each with an associated entrance diameter and exit diameter. Ink can be received into the printhead and formed into ink drops in the stepped nozzles. The ink drops can each have an associated drop mass and drop speed. The stepped nozzles can be provided such that the exit diameter can independently dictate the drop mass and the entrance diameter can independently dictate the drop speed. As such, the complexity of jet design optimization is reduced.

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