Peter Tortorici4981 Soho Ln, Chandler, AZ 85249

Peter Tortorici Phones & Addresses

4981 Soho Ln, Chandler, AZ 85249 (480) 883-1924

1102 E Canyon Way, Chandler, AZ 85249 (480) 883-1924

Work

Company: Medtronic micro rel Address: 2343 W Medtronic Way, Tempe, AZ 85281 Phones: (480) 968-6411 Position: Professional engineer Industries: Surgical and Medical Instruments and Apparatus

Education

Degree: High school graduate or higher

Mentions for Peter Tortorici

Peter Tortorici resumes & CV records

Resumes

Peter Tortorici Photo 20

Senior Manager

Location:
2343 west Medtronic Way, Tempe, AZ 85281
Industry:
Medical Devices
Work:
Medtronic
Senior Manager
Medtronic Mar 2014 - Jun 2016
Senior Principal Materials Engineer: Advanced Problem Solving
Medtronic Mar 2014 - Jun 2016
Technical Collaboration and Innovation Leader
Medtronic Aug 1, 2006 - Mar 2014
Manager, New Product Integration
Medtronic 2003 - 2006
Principle Hdi Substrate Component Engineer
Medtronic Apr 1, 2001 - Jan 1, 2003
Principal Process Engineer
Ge Aug 1, 1999 - Mar 1, 2001
Metal Component Program Manager
Hewlett-Packard Aug 1, 1997 - Aug 1, 1999
Metallurgical Engineer
Forschungszentrum Juelich Juelich Germany Apr 1, 1996 - Sep 1, 1996
Visiting Research Scientist
Mangnequench Jan 1987 - Aug 1990
Engineering Cooperative Education Student
Education:
Purdue University 1994 - 1997
Doctorates, Doctor of Philosophy, Engineering
Purdue University 1991 - 1993
Master of Science, Masters, Metallurgical Engineering, Engineering
Purdue University 1985 - 1990
Bachelors, Bachelor of Science, Metallurgical Engineering, Engineering
Arizona State University
Skills:
Design of Experiments, Six Sigma, Manufacturing, Design For Manufacturing, Medical Devices, Iso 13485, Spc, Manufacturing Engineering, Lean Manufacturing, Quality System, Fmea, Fda, Materials Science, Dmaic, R&D, Continuous Improvement, Minitab, Failure Analysis, Metallurgy, Root Cause Analysis
Languages:
French
Peter Tortorici Photo 21

Peter Tortorici

Peter Tortorici Photo 22

Peter Tortorici

Skills:
Microsoft Office

Publications & IP owners

Us Patents

Assembly Including A Circuit And An Encapsulation Frame, And Method Of Making The Same

US Patent:
7288847, Oct 30, 2007
Filed:
Jan 25, 2005
Appl. No.:
11/042740
Inventors:
David A. Ruben - Mesa AZ, US
Scott B. Sleeper - Phoenix AZ, US
Peter C. Tortorici - Chandler AZ, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
H01L 23/29
US Classification:
257791, 257666, 257676, 257774, 257E23092, 257E23066
Abstract:
An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.

Encapsulation Circuitry On A Substrate

US Patent:
7682878, Mar 23, 2010
Filed:
Oct 23, 2007
Appl. No.:
11/877408
Inventors:
David A. Ruben - Mesa AZ, US
Scott B. Sleeper - Phoenix AZ, US
Peter C. Tortorici - Chandler AZ, US
Assignee:
Medtronic, Inc. - Minneapolis MN
International Classification:
H01L 21/44
US Classification:
438124, 438112, 438123, 438127, 257666, 257676, 257774, 257791, 257E23066, 257E23092
Abstract:
An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.

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